Numerical Investigations on the Grinding Forces in Ultrasonic Assisted Grinding of SiC Ceramics by Using SPH Method

2014 ◽  
Vol 1017 ◽  
pp. 735-740 ◽  
Author(s):  
Zhi Qiang Liang ◽  
Zhao Yang Mi ◽  
Xi Bin Wang ◽  
Tian Feng Zhou ◽  
Yong Bo Wu ◽  
...  
Keyword(s):  
Ultrasonic Vibration ◽  
Chip Thickness ◽  
Depth Of Cut ◽  
Grinding Forces ◽  
Sph Method ◽  
Undeformed Chip Thickness ◽  
Ultrasonic Assisted Grinding ◽  
Abrasive Grain ◽  
Grinding Parameters ◽  
Ultrasonic Assisted

In this study, the grinding force variation mechanism in ultrasonic assisted grinding (UAG) of SiC ceramic is investigated by simulation method using a single diamond abrasive grain scratching. In simulation, the workpiece is modeled by smoothed particle hydrodynamic (SPH) method while the abrasive grain is modeled by finite element method (FEM). To reliably predict the grinding forces in UAG, an analytical model of average undeformed chip thickness ha is established. Grinding forces under different grinding parameters, i.e., depth of cut, and different ultrasonic vibration amplitudes are calculated by setting average undeformed chip thickness haas scratching depth during SPH simulation process. The simulation results indicate that the normal force in UAG is reduced by about 20%, while the tangential force decreases up to 30% compared with those in conventional grinding (CG). The influences of grinding parameters and ultrasonic vibration on grinding forces will be investigated and the preliminary explanations will be presented.

Experimental Investigations of Grinding Forces in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire

2013 ◽  
Vol 797 ◽  
pp. 223-228
Author(s):  
Zhi Qiang Liang ◽  
Tian Feng Zhou ◽  
Xi Bin Wang ◽  
Yong Bo Wu ◽  
Wen Xiang Zhao
Keyword(s):  
Ultrasonic Vibration ◽  
Wheel Speed ◽  
Depth Of Cut ◽  
Grinding Wheel ◽  
Grinding Forces ◽  
Ultrasonic Assisted Grinding ◽  
Grinding Parameters ◽  
Force Ratio ◽  
Ultrasonic Assisted ◽  
Vibration Assistance

Grinding forces characteristics in elliptical ultrasonic assisted grinding (EUAG) of sapphire are investigated experimentally. The EUAG is a new grinding method proposed by the present authors in which an elliptical ultrasonic vibration is imposed on the workpiece by using an elliptical ultrasonic vibrator. In this paper, grinding experiments under the presence/absence of ultrasonic vibration assistance are performed. The effects of the vibration amplitude and grinding parameters such as the depth of cut, the grinding wheel speed on the grinding forces, grinding force ratioFn/Ftare clarified. The obtained conclusions are as follows: the grinding forces during EUAG lowers to 50% and grinding forces ratio becomes reduced by 33% compared that during conventional grinding (CG); the grinding forces during EUAG have the less variation rate than those during CG as grinding parameters change; higher grinding wheel speed causes the larger grinding forces in CG, but has little effect on the variation of grinding forces in EUAG. By using EUAG method, the grinding forces and force ratio are greatly decreased, and surface quality is better, meaning that grindability of sapphire material is improved.

Effects of Ultrasonic Assisted Grinding on CBN Grinding Wheels Performance

2009 ◽  
Author(s):  
Taghi Tawakoli ◽  
Bahman Azarhoushang
Keyword(s):  
Ultrasonic Vibration ◽  
Specific Energy ◽  
Grinding Process ◽  
Grinding Wheels ◽  
Grinding Forces ◽  
Workpiece Surface ◽  
Ultrasonic Assisted Grinding ◽  
Ultrasonic Assisted ◽  
Vitrified Cbn

The effects of ultrasonic assisted grinding on vitrified CBN grinding wheels performance have been investigated. The ultrasonic vibration has been superimposed to the workpiece in feed and cross feed directions and the kinematics of the process in both directions have been discussed. The obtained results show that applying ultrasonic vibration to the grinding process can improve the quality of the workpiece surface, the efficiency of the process and decrease the grinding forces and specific energy considerably.

An Experimental Investigation of Ultrasonic Assisted Grinding in DOE Approach

2012 ◽  
Vol 565 ◽  
pp. 129-134 ◽  
Author(s):  
Kyeong Tae Kim ◽  
Yun Hyuck Hong ◽  
Kyung Hee Park ◽  
Young Jae Choi ◽  
Seok Woo Lee ◽  
...  
Keyword(s):  
Experimental Investigation ◽  
Ultrasonic Vibration ◽  
Feed Rate ◽  
Rotation Speed ◽  
Grinding Force ◽  
Machining Parameters ◽  
Grinding Forces ◽  
Ultrasonic Assisted Grinding ◽  
Ultrasonic Assisted ◽  
Conventional Grinding

In this work, grinding test was performed in terms of machining parameters, such as grinding speed, feed rate, etc., in order to study effect of ultrasonic vibration in grinding. The design of experiment (DOE) approach was used for an optimal condition of ultrasonic assisted grinding, which can minimize the grinding forces. In DOE, ultrasonic amplitude power, feed rate, and rotation speed of spindle were chosen as the major machining factors. The grinding forces were measured and compared between the conventional grinding and ultrasonic assisted grinding. From the experiment, it was found that the grinding forces decreased as the ultrasonic vibration power and the rotation speed of spindle increased while the grinding force was reduced as the feed rate increased. In addition, regression model was formulated for obtaining optimal grinding condition.

Analytical and Numerical Simulation of Ultrasonic Assisted Grinding

2010 ◽  
Author(s):  
Ahmad Farhadi ◽  
Amir Abdullah ◽  
Javad Zarkoob ◽  
Abbas Pak
Keyword(s):  
Ultrasonic Vibration ◽  
Equations Of Motion ◽  
Motion Path ◽  
Grinding Forces ◽  
Wheel Wear ◽  
Ultrasonic Assisted Grinding ◽  
Ultrasonic Assisted ◽  
Single Grain ◽  
Workpiece Interaction ◽  
Cutting Path

Ultrasonic assisted grinding of hard materials is a novel technique which is used in order to decrease grinding forces and energy. Grinding force is in direct connection with wheel wear, grinding accuracy, grinding temperature and surface integrity. In this paper the effects of ultrasonic vibration in creep feed grinding process which is superimposed to the workpiece in feed direction has been represented. The mechanism of grain-workpiece interaction in the presence of ultrasonic vibration has been investigated both analytically and numerically. The cutting path of a single grain in ultrasonic assisted grinding has been derived using equations of motion and has been compared to the grain cutting path in ordinary grinding. Using displacement equations of a single grain in ultrasonic assisted grinding and drawing the motion path, it has been shown that there exist a multiple-impact between grain and workpiece. By implementing a 2-D finite element modeling, the mechanism of chip formation in ultrasonic assisted grinding and ordinary grinding has been compared. Furthermore the effects of longitudinal workpiece vibration on the grinding forces have been investigated. FE analysis of grain-workpiece interaction in case of using ultrasonic vibration has shown a reduction of about 40% of grinding forces compared to ordinary grinding.

Generation mechanism modeling of surface topography in tangential ultrasonic vibration-assisted grinding with green silicon carbide abrasive wheel

2021 ◽  
pp. 095440542110406
Author(s):  
Yutong Qiu ◽  
Jingfei Yin ◽  
Yang Cao ◽  
Wenfeng Ding
Keyword(s):  
Surface Roughness ◽  
Surface Topography ◽  
Ultrasonic Vibration ◽  
Generation Mechanism ◽  
Surface Generation ◽  
Depth Of Cut ◽  
Abrasive Wheel ◽  
Grinding Parameters ◽  
Conventional Grinding ◽  
Ultrasonic Vibration Assisted Grinding

Tangential ultrasonic vibration-assisted grinding (TUAG) has a wide prospect in machining difficult-to-machine materials. However, the surface generation mechanism in TUAG is not fully recovered. This study proposes an analytical model of the surface topography produced by TUAG. Based on the model, the surface topography and roughness are predicted and experimentally verified. In addition, the influence of the grinding parameters on the surface topography is analyzed. The predicted surface topography well coincides with experimental measurements, and the prediction error in surface roughness Ra by the proposed model is less than 5%. Compared with conventional grinding, TUAG produces a surface with more uniform scratches and surface roughness Ra was reduced by up to 27% with the proper parameters. However, the improvement of surface roughness in TUAG is weakened when grinding speed or depth of cut increases. Moreover, the influence of the ultrasonic vibration amplitude on the surface roughness is not monotonous. With the grinding parameters selected in this study, TUAG with an ultrasonic amplitude of 7.5 μm produces the minimum surface roughness.

scholarly journals Study on Effect of Ultrasonic Vibration on Grinding Force and Surface Quality in Ultrasonic Assisted Micro End Grinding of Silica Glass

2014 ◽  
Vol 2014 ◽  
pp. 1-10 ◽  
Author(s):  
Zhang Jianhua ◽  
Zhao Yan ◽  
Zhang Shuo ◽  
Tian Fuqiang ◽  
Guo Lanshen ◽  
...  
Keyword(s):  
Surface Quality ◽  
Ultrasonic Vibration ◽  
Silica Glass ◽  
Removal Rate ◽  
Surface Characteristics ◽  
Diamond Wheel ◽  
Grinding Force ◽  
Grinding Forces ◽  
Grinding Parameters ◽  
Ductile Machining

Ultrasonic vibration assisted micro end grinding (UAMEG) is a promising processing method for micro parts made of hard and brittle materials. First, the influence of ultrasonic assistance on the mechanism of this processing technology is theoretically analyzed. Then, in order to reveal the effects of ultrasonic vibration and grinding parameters on grinding forces and surface quality, contrast grinding tests of silica glass with and without ultrasonic assistance using micro radial electroplated diamond wheel are conducted. The grinding forces are measured using a three-component dynamometer. The surface characteristics are detected using the scanning electron microscope. The experiment results demonstrate that grinding forces are significantly reduced by introducing ultrasonic vibration into conventional micro end grinding (CMEG) of silica glass; ultrasonic assistance causes inhibiting effect on variation percentages of tangential grinding force with grinding parameters; ductile machining is easier to be achieved and surface quality is obviously improved due to ultrasonic assistance in UAMEG. Therefore, larger grinding depth and feed rate adopted in UAMEG can lead to the improvement of removal rate and machining efficiency compared with CMEG.

Molecular Dynamics Study of Abrasive Grain Morphology and Orientation in Nanometric Grinding

2016 ◽  
Vol 686 ◽  
pp. 7-12 ◽  
Author(s):  
Angelos P. Markopoulos ◽  
Nikolaos E. Karkalos ◽  
Dimitrios E. Manolakos
Keyword(s):  
Molecular Dynamics ◽  
Grain Morphology ◽  
Rake Angle ◽  
Depth Of Cut ◽  
Grinding Forces ◽  
Abrasive Grain ◽  
Proposed Model ◽  
On Chip ◽  
Diamond Grain ◽  
Dynamics Method

A simulation of the material removal by a single abrasive grain in nanometric grinding is presented in this paper. Molecular Dynamics method is used for modeling the diamond grain and the copper workpiece. The Morse potential function is used to simulate the interactions between the atoms involved in the procedure. The abrasive grain follows a trajectory with decreasing depth of cut within the workpiece to simulate the interaction of the grain with the workpiece. The influence of the grain shape, being either square or rectangular, and of the orientation of the grain, where the grain has rake angle 10o, -10o and-20o, are studied. From the analysis it is apparent that both grain morphology and orientation play a significant role on chip formation, grinding forces and temperatures. With the appropriate modifications, the proposed model can be used for the simulation of various nanomachining processes and operations, in which continuum mechanics cannot be applied or experimental techniques are subjected to limitations.

Modeling and Predicting Grinding Force of the Grinding Process

2014 ◽  
Vol 1055 ◽  
pp. 165-170 ◽  
Author(s):  
Nai Li Zhao ◽  
Wen Fang Guan
Keyword(s):  
Chip Thickness ◽  
Rayleigh Distribution ◽  
Processing Parameters ◽  
Grinding Force ◽  
Dynamic Effects ◽  
Grinding Forces ◽  
Undeformed Chip Thickness ◽  
Deformation Force ◽  
Cutting Deformation ◽  
Sliding Force

A new method for predicting the grinding force is developed in this paper. The grinding forces model is build by divided it into cutting deformation force and sliding force and combine the undeformed chip thickness which assume the height of grits obey the Rayleigh distribution. In this model, the influence of processing parameters on friction is considered and takes into consideration the kinematic conditions, material properties, wheel microstructure and dynamic effects. In the last, this new grinding model is tested and verified.Keywords Grinding force; Undeformed chip thickness; Ground finish

Research on the Topography Feature of the Diamond Grinding Wheel under Elliptical Ultrasonic Assisted Dressing with Diamond Stylus

2010 ◽  
Vol 42 ◽  
pp. 126-130
Author(s):  
Quan Cai Wang ◽  
Nan Fang He ◽  
Guo Fu Gao ◽  
Bo Zhao
Keyword(s):  
Ultrasonic Vibration ◽  
Feed Rate ◽  
Grinding Wheel ◽  
Diamond Grinding Wheel ◽  
Diamond Grinding ◽  
Abrasive Grain ◽  
Ultrasonic Assisted

In this paper, topography feature of the diamond grinding wheel under the diamond stylus elliptical ultrasonic vibration assisted dressing was studied experimentally. The results indicate that: the increase in dressing power of elliptical ultrasonic vibration will result in the increase in amplitude, and that can increase abrasive protrusion height of the dressing grinding wheel, and also increase the depth of chip pocket. With the increase of feed rate, surface peak and valley values of elliptical ultrasonic vibration dressing grinding wheel increase, that is the average protrusion height of abrasive grain increases. With the increase of dressing depth, surface peak and valley values of elliptical ultrasonic vibration dressing grinding wheel increases, while the number of static effective abrasive grain reduces. In comparison with the ordinary dressing grinding wheel, elliptical ultrasonic assisted dressing in the same parameters can bring about more static effective abrasive grain , more uniform abrasive distribution, a higher abrasive protrusion height and more chip space.

Sign in / Sign up

Export Citation Format

Share Document