Finite Element Analysis on the Ability of Solder Joints to Resist Thermal Fatigue

2010 ◽  
Vol 118-120 ◽  
pp. 738-742
Author(s):  
Xue Xia Yang ◽  
Yu Zhang ◽  
Xue Feng Shu
Keyword(s):  
Finite Element ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Strain Response ◽  
Shape Parameters ◽  
Element Analysis ◽  
Finite Element Software ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Fatigue Characteristics

The purpose of this paper is to study the ability of solder joints to resist thermal fatigue. 2D simplified models of Plastic Ball Grid Array package (PBGA) structures with ten different solder joints obtained from surface mount experiment are established by finite element software, then stress-strain response of solder joints subjected to the thermal cycle load are calculated. And the effects of shape parameters of solder joints on the ability to resist thermal fatigue are discussed. Results indicate that for the same material and volume solders, the solder joints which have higher height, smaller diameter and contact angle have a stronger ability against thermal fatigue, and that the thermal fatigue characteristics are also greatly influenced by the solder outlines. Comparing with SP solder joints, LF solder joints have stronger ability against thermal fatigue.

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

Hygrothermal stress analysis of a plastic ball grid array package during solder reflow

2004 ◽  
Vol 218 (9) ◽  
pp. 957-970 ◽  
Author(s):  
K-C Chang ◽  
M-K Yeh ◽  
K-N Chiang
Keyword(s):  
Finite Element ◽  
Moisture Absorption ◽  
Ball Grid Array ◽  
Design Parameters ◽  
Shear Stresses ◽  
Packaging Materials ◽  
Element Analysis ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Solder Reflow

This study investigated how the internal temperature and moisture of a plastic ball grid array (PBGA) package affect interfacial hygrothermal stresses (primarily peeling and shear stresses) during solder reflow. Two-dimensional finite element analysis was applied to evaluate temperature distribution, moisture diffusion and hygrothermal stresses inside the PBGA package. A series of popcorn experiments on PBGA packages was carried out to verify the accuracy of the finite element model. The design parameters of the PBGA package were varied to assess their effect on hygrothermal stresses at the interfaces. Moisture absorption and desorption experiments on the PBGA packaging materials were conducted in a hygrothermal chamber and an oven, to obtain moisture diffusivity data and saturated moisture contents of PBGA packaging materials. Results in this study can be applied to optimize the design parameters of the PBGA package and thus reduce interfacial hygrothermal stresses during solder reflow.

Thermal Fatigue Analysis of PBGA Solder Joints With the Consideration of Damage Evolution

2000 ◽  
Author(s):  
Shi-Wei Ricky Lee ◽  
Keith Newman ◽  
Livia Hu
Keyword(s):  
Thermal Fatigue ◽  
Life Prediction ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Hysteresis Loops ◽  
Fatigue Analysis ◽  
Circuit Board ◽  
Element Analysis ◽  
Pcb Assembly ◽  
Plastic Ball

Abstract This paper presents a computational thermal fatigue analysis for the life prediction of solder joints in a plastic ball grid array-printed circuit board (PBGA-PCB) assembly. The PBGA has a full grid array of 256 solder balls with 1.0 mm ball pitch. The PCB is a 4-layer FR-4 laminate with a thickness of 1.57 mm (62 mils). The assembly is subjected to −40∼125°C thermal cycling (one-hour cycle). Finite element analysis is performed to obtain the creep hysteresis loops. Based on a previously developed model, the evolution of damage is considered in the life prediction of solder joints. Besides, PCBs with various thicknesses (40 mils and 20 mils) are investigated. The results from different cases are compared and discussed.

A Systematic Approach for Determining the Thermal Fatigue-Life of Plastic Ball Grid Array (PBGA) Lead-Free Solder Joints

2005 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Walter Dauksher ◽  
Dongkai Shangguan ◽  
Fubin Song ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of plastic ball grid array (PBGA) SnAgCu lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a PBGA package assembly is predicted and compared with thermal cycling test results.

Thermal Fatigue-Life Prediction of Lead-Free Solder Joints

2004 ◽  
Author(s):  
John Lau ◽  
Ricky Lee ◽  
Dongkai Shangguan
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Thermal Fatigue Life ◽  
Plastic Ball ◽  
Plastic Ball Grid Array ◽  
Free Solder

Reliability of lead-free solder joints is investigated. Emphasis is placed on the design for reliability (DFR) of lead-free solder joints. In particular, the thermal-fatigue life of the lead-free solder joints of a plastic ball grid array (PBGA) package assembly is predicted and discussed.

Finite Element Analysis of Main Stand of Ф140 Pipe Rolling Mill and Split Casting

2013 ◽  
Vol 690-693 ◽  
pp. 2327-2330
Author(s):  
Ming Bo Han ◽  
Li Fei Sun
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Rolling Mill ◽  
Analysis Model ◽  
Element Analysis ◽  
Pipe Rolling ◽  
Full Load ◽  
Finite Element Software ◽  
Theoretical Position ◽  
Technical Requirements

By using finite element software, the paper establishes the main stand analysis model of the Ф140 pipe rolling mill and provides the model analysis of main stand in cases of full load. Verify the design of main stand fully comply with the technical requirements .In this paper, it provides the theoretical position of split casting and welding method using electric slag welding.

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