The Research of β-SiCp/Al Electronic Packaging Composites Fabricated by Pressureless Infiltrating

2012 ◽  
Vol 490-495 ◽  
pp. 3816-3821 ◽  
Author(s):  
Xiao Gang Wang ◽  
Huai Yan Ren ◽  
Ming Zhu ◽  
Li Rong Deng ◽  
Shu He Lu
Keyword(s):  
Thermal Expansion ◽  
Electronic Packaging ◽  
Aluminum Matrix ◽  
Interface Reaction ◽  
Volume Ratio ◽  
Infiltration Rate ◽  
Packaging Materials ◽  
Pressureless Infiltration ◽  
Infiltration Process ◽  
Infiltration Temperature

The β-SiCp/Al electronic packaging composites with excellent performance were successfully fabricated by pressureless infiltration technology in air.The effects of alloying elements, infiltration temperature and time on infiltration process and application of -SiC were studied.The results show that by adding appropriate magnesium to aluminum matrix, a interface reaction between oxide films of SiC and magnesium occurs, and the interface reaction product MgAl2O4 is generated, the interface wettability of Al and SiC and pressureless infiltration are improved.The interface harmful phase Al4C3 can be inhibited by adding silicon to aluminum matrix.Identified 850°C for the best infiltration temperature, and the thickness with infiltration time and larger, infiltration rate is about 10mm/hour.Under the same parameter conditions, the thermal properties of β-SiCp/Al electronic packaging material are 4 ~ 6% higher than that of ɑ-SiCp/Al. The β-SiCp/Al electronic packaging materials with 66% SiC volume ratio has lower coefficiency of thermal expansion than those ɑ-SiCp/Al electronic packaging materials.And the thermal expansion coefficient and thermal conductivity of β-SiCp/Al electronic material can satisfy the requirements for electronic packaging materials.

The Research of Spraying SiC/Cu Electronic Packaging Composites

2011 ◽  
Vol 284-286 ◽  
pp. 620-623
Author(s):  
Ming Hu ◽  
Jing Gao ◽  
Yun Long Zhang
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Process Parameters ◽  
Electronic Packaging ◽  
High Speed ◽  
Volume Fraction ◽  
Flame Spraying ◽  
Packaging Materials ◽  
Excellent Performance ◽  
Chemical Plating

The SiC/Cu electronic packaging composites with excellent performance were successfully prepared by the chemical plating copper on the surface of SiC powders and high-speed flame spraying technology. The results showed that the homogeneous dense coated layers can be obtained on the surface of SiC powder by optimizing process parameters. The volume fraction of SiC powders in the composites could significantly increase and figure was beyond 55vol% after spraying Copper. The SiC and Cu were the main phases in the spraying SiC/Cu electronic packaging composite, at the same time Cu2O can be tested as the trace phase. The interface combination properties of SiC/Cu in the hot-pressed samples can obviously improve. The thermal expansion coefficient and thermal conductivity of SiC/Cu electronic packaging composite basic can satisfy the requirements for electronic packaging materials.

The mechanism of spontaneous infiltration of Al–Si alloy into SiC preform in air

1996 ◽  
Vol 11 (4) ◽  
pp. 1037-1044 ◽  
Author(s):  
X. M. Xi ◽  
L. M. Xiao ◽  
X. F. Yang
Keyword(s):  
Significant Influence ◽  
Infiltration Rate ◽  
Experimental Results ◽  
Infiltration Process ◽  
Infiltration Temperature ◽  
Spontaneous Infiltration ◽  
Sic Particle

Rapid, spontaneous infiltration can be achieved by dipping a SiC preform that contains pyrolyzed carbon into an Al–Si alloy bath in an open air environment. The mechanism for infiltration is investigated in the present work by studying the effects of several relevant parameters on the infiltration process. Experimental results have shown that the requirements for rapid spontaneous infiltration are an infiltration temperature higher than 1400 °C, the presence of a pyrolyzed carbon, and the presence of SiC particle in the preforms. The concentration of Si in the alloy does not have significant influence on the infiltration rate, but it strongly affects the resulting microstructures in the infiltrated composites.

Electronic packaging materials prepared by powder injecting molding and pressure infiltration process

Rare Metals ◽  
2007 ◽  
Vol 26 (6) ◽  
pp. 625-629 ◽  
Author(s):  
F YIN ◽  
H GUO ◽  
C JIA ◽  
J XU ◽  
X ZHANG ◽  
...  
Keyword(s):  
Electronic Packaging ◽  
Packaging Materials ◽  
Infiltration Process ◽  
Pressure Infiltration

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

1999 ◽  
Vol 122 (2) ◽  
pp. 121-127 ◽  
Author(s):  
Manjula N. Variyam ◽  
Weidong Xie ◽  
Suresh K. Sitaraman
Keyword(s):  
Thermal Expansion ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
3D Models ◽  
Material Behavior ◽  
Element Analysis

Components in electronic packaging structures are of different dimensions and are made of dissimilar materials that typically have time, temperature, and direction-dependent thermo-mechanical properties. Due to the complexity in geometry, material behavior, and thermal loading patterns, finite-element analysis (FEA) is often used to study the thermo-mechanical behavior of electronic packaging structures. For computational reasons, researchers often use two-dimensional (2D) models instead of three-dimensional (3D) models. Although 2D models are computationally efficient, they could provide misleading results, particularly under thermal loading. The focus of this paper is to compare the results from various 2D, 3D, and generalized plane-deformation strip models and recommend a suitable modeling procedure. Particular emphasis is placed to understand how the third-direction coefficient of thermal expansion (CTE) influences the warpage and the stress results predicted by 2D models under thermal loading. It is seen that the generalized plane-deformation strip models are the best compromise between the 2D and 3D models. Suitable analytical formulations have also been developed to corroborate the findings from the study. [S1043-7398(00)01402-X]

scholarly journals Ponding time in infiltration process for different land use

2021 ◽  
Vol 930 (1) ◽  
pp. 012054
Author(s):  
I K Hidayati ◽  
Suhardjono ◽  
D Harisuseno ◽  
A Suharyanto
Keyword(s):  
Land Use ◽  
Physical Properties ◽  
River Basin ◽  
Sugar Cane ◽  
Infiltration Rate ◽  
Soil Types ◽  
Land Uses ◽  
Infiltration Process ◽  
Double Ring ◽  
Density Values

Abstract Ponding time is the period from the beginning of rainfall/infiltration until the occurrence of ponding. This paper aims to determine the infiltration rate and ponding time on different land uses, such as open fields, residential, agriculture, and vegetation. This research was conducted in one of the watersheds in the Brantas River Basin, namely the Lesti River Basin, which is administratively included in the Malang Regency, East Java. The Lesti River is one of the tributaries of the Brantas River, which originates around Mount Semeru, a very intensive area for planting rice, sugar cane, and coffee. Infiltration data were collected at 35 points using a double-ring infiltrometer spread across the Lesti watershed with Andosol, Mediterranean, and Regosol soil types. At the same time, ponding time was obtained from infiltration measurements in the field using the flooding method. The physical properties of the soils were tested in the laboratory to obtain water content, porosity, and bulk density values. This study resulted in the infiltration rate and ponding time for each land use and shows how the physical properties of the soil affect the ponding time.

Ceramic Materials for Electronic Packaging

1989 ◽  
Vol 111 (3) ◽  
pp. 183-191 ◽  
Author(s):  
E. M. Rabinovich
Keyword(s):  
Electronic Packaging ◽  
Sol Gel ◽  
Glass Ceramics ◽  
Ceramic Materials ◽  
Packaging Materials ◽  
Ceramic Powders ◽  
Main Attention

The paper reviews ceramic materials that are used or can be used in electronic packaging. Main attention is given in relatively new packaging materials such as highly thermal conductive AlN and SiC (BeO-doped) or low-firing cordierite and spodumene glass-ceramics. Application of sol-gel processes in preparation of ceramic powders is discussed.

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