Failure Analysis of Pipe's Repaired Mouth and its Improvement Measures and Suggestions

2013 ◽  
Vol 634-638 ◽  
pp. 3628-3635
Author(s):  
Qin Li ◽  
Shuang Jing ◽  
Zhi Qiang Huang ◽  
Wei Bin Wang ◽  
Ming Bo Wang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Failure Mechanism ◽  
Failure Modes ◽  
Oil Field ◽  
Improve Quality ◽  
Improvement Measures ◽  
Effective Use ◽  
Pipeline Corrosion

With the increment of the oil-field extract strength and the pipeline infusion load, the pipeline damage had become more serious and the effective use of cycle got shorter. Pipeline damage mainly appeared pipeline corrosion. The pipeline corrosion mainly occured in the place of pipe's repaired mouth and mending of blemishes. In this paper, through failure analysis of the pipe's Heat Shrinkable Wraparound Sleeve (HHWS) repaired mouth, we found the failure modes and failure causes of the repaired mouth of the existing pipeline and new pipeline, and grasped the failure mechanism. Then, improvement measures and suggestions were proposed to prevent failure, ensure safety, improve quality of the pipe's repaired mouth, slow or prevent pipeline corrosion and extend pipeline life.

Effective Use of Information Technology To Improve Quality of Care for Heart Failure Patients

2006 ◽  
Vol 12 (6) ◽  
pp. S104-S105
Author(s):  
Michael Rossi ◽  
Joshua Skibba ◽  
Patricia Parker ◽  
Katrina Fritz ◽  
Nancy Davies-Hathen ◽  
...  
Keyword(s):  
Heart Failure ◽  
Information Technology ◽  
Quality Of Care ◽  
Improve Quality ◽  
Heart Failure Patients ◽  
Effective Use

Latent Flash Single Bit and Multiple Bits Systematic Approach to Failure Analysis

2008 ◽  
Author(s):  
Hoang-Yen To ◽  
Dat Nguyen ◽  
Clyde Dunn ◽  
Detric Davis
Keyword(s):  
Failure Analysis ◽  
Failure Mechanism ◽  
Systematic Approach ◽  
Failure Modes ◽  
Fault Isolation ◽  
Wafer Fabrication ◽  
Electrical Failure ◽  
Non Volatile Memory ◽  
Different Temperatures ◽  
Volatile Memory

Abstract The flash considered for failure analysis in this paper is a non volatile memory with a NOR architecture in the array and a stacked gate for the bit cell. The flash failure was from data gain reported from various stages and at different temperatures after leaving the wafer fabrication. The failure can be single bit failure (SBF) or multiple bit failure (MBF). The FA process is comprised of two steps termed electrical failure analysis (EFA) and physical failure analysis (PFA). This paper discusses the method to differentiate failure modes and the efforts of fault isolation. Micro probing and nano probe characterization were important in the understanding of the failure mechanism. As seen in the EFA/PFA section, the reported SBF/MBF failures were actually due to a defect in the Mux and not at the bit cell.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

EXPERIENCE OF CREATING AND IMPLEMENTING INFORMATION-MANAGING EDUCATIONAL ENVIRONMENT AT UNIVERSITY AND FEATURES OF ITS ADAPTATION AT LYCEUM

2019 ◽  
pp. 47-55 ◽  
Author(s):  
E. V. Shevchuk ◽  
A. V. Shpak
Keyword(s):  
Continuous Process ◽  
Educational Environment ◽  
Educational Process ◽  
Information Resources ◽  
Improve Quality ◽  
Educational Organizations ◽  
Educational Processes ◽  
Facilitating Conditions ◽  
Oriented Approach

The article describes experience of creating and implementing information-managing educational environment at university. The model of creating information-managing educational environment of university with elements of artificial intelligence and indicative management is described. This environment contributes to improve quality of training and management of educational processes and resources. The stages of creating and implementing information-managing educational environment are considered systemically, as continuous process focused on a consumer. The inhibitory and facilitating conditions for introduction of the model at university are described. To provide subject-oriented approach to the use of information resources of environment, recommended clusters of information subsystems for each category of users are described.Practically implemented scientific and methodological recommendations for subjects of educational process to overcome resistance to innovations introduced in educational organizations are proposed.Features of adaptation of the developed information-managing educational environment for schools are presented.

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