A Novel Approach for MEMS Vacuum Packaging
MEMS vacuum packaging now is the impediment of the MEMS appliance in some specified fields. The major problem of current packaging approach is that the packaging process can not match the requirement of the ultra low leak. But the process now can not be improved with the existing technology. In this situation, authors proposed a novel approach for MEMS vacuum packaging, which can remarkably lower the leak rate. This paper analyzed the vacuum maintaining time of the vacuum packaging and compared the current design and new packaging method.