Microstructure and Thermal Physical Properties of a β­SiCp/Al Composite for Electronic Packaging Produced by Powder Metallurgy

2017 ◽  
Vol 727 ◽  
pp. 565-570
Author(s):  
Yan Yan Shi ◽  
Xiao Gang Wang ◽  
Jun Tao Liu
Keyword(s):  
Physical Properties ◽  
Electronic Packaging ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Weight Ratio ◽  
Pressing Method ◽  
Al Composite ◽  
The Relationship ◽  
Thermal Physical Properties ◽  
Sic Particle

The fabrication and thermal physical properties contain thermal conductivity (TC) and coefficient of thermal expansion (CTE) using 40%、50%、60% vol% β-SiC particle reinforced Al composite for electronic packaging respectively have been analyzed. The composites were produced by ball milling and pressing method. The composite which fabricated by tri-sized β-SiC particle with a weight ratio of 17:7:1,vol% of 50% and 60%.The dense and morphology were investigated. The relationship between volume fraction of β-SiC particle and thermal physical properties was discussed. Changed the volume fraction of β-SiC particle will led to a decreasing or increasing of TC and CTE. It found that values of TC and CTE were achieved their maximum balance when using tri-sized β-SiC particle of 160μm ,125μm as well as 38μm with a weight ratio of 17:7:1 and 50%vol of β-SiC particle reinforcing.

Effect of Diamond Shape on Thermal-Physical Properties of Diamond/Cu Composites

2015 ◽  
Vol 1095 ◽  
pp. 12-15
Author(s):  
Jian Hao Chen ◽  
Shu Bin Ren ◽  
Xin Bo He ◽  
Xuan Hui Qu
Keyword(s):  
Physical Properties ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
High Volume ◽  
Pressure Infiltration ◽  
Surface Areas ◽  
The Difference ◽  
Diamond Type ◽  
Thermo Physical Properties ◽  
Thermal Physical Properties

High volume fraction diamond/copper composites with different diamond shape were prepared by vacuum pressure infiltration. In this paper, the effect of diamond type on thermo-physical properties of the composites was researched. The results showed that the composites with broken diamond exhibited the lowest thermal conductivity and coefficient of thermal expansion, only 401W/m•k and 6.2×10-6m/K respectively, and the composites with monocrystalline diamond had the best properties, reaching to 527W/m•K and 8.3×10-6m/K respectively, and the properties of the composites with modified-shape diamond were in the middle. The difference in the properties of the composites with different-shape diamond is attributed to their various specific surface areas.

scholarly journals Effect of the Different High Volume Fraction of SiC Particles on the Junction of Bismuthate Glass-SiCp/Al Composite

Scanning ◽  
2018 ◽  
Vol 2018 ◽  
pp. 1-10
Author(s):  
Bin Wang ◽  
Shengguan Qu ◽  
Xiaoqiang Li
Keyword(s):  
Shear Strength ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
High Volume ◽  
Bonding Interface ◽  
Strength Testing ◽  
Infiltration Process ◽  
Sic Particles ◽  
Al Composite ◽  
Sic Particle

The in-house developed bismuthate glass and the SiCp/Al composites with different volume fractions of SiC particles (namely, 60 vol.%, 65 vol.%, 70 vol.%, and 75 vol.%) were jointed by vacuum hot-pressing process. The novel material can be used for the space mirror. The SiCp is an abbreviation for SiC particle. Firstly, the SiCp/Al composites with different vol.% of SiC particle were manufactured by using infiltration process. In order to obtain a stable bonding interface, the preoxide layers were fabricated on the surfaces of these composites for reacting with the bismuthate glass. The coefficient of thermal expansion (CTE) was carried out for characterizing the difference between the composites and bismuthate glass. The sealing quality of the composites and the bismuthate glass was quantified by using shear strength testing. The optical microstructures showed the particles were uniformly distributed in the Al matrix. The SEM image shows that a smooth oxidation layer was generated on the SiCp/Al composite. The CTE testing result indicated that the higher the vol.% of the particles in the composite, the lower the CTE value. The shear strength testing result disclosed that SiCp/Al composite with relatively low CTE value was favorable to obtain a bonding interface with high strength.

Production and Properties of a 90%Si-Al Alloy for Electronic Packaging Applications

2009 ◽  
Vol 610-613 ◽  
pp. 542-545 ◽  
Author(s):  
Kun Yu ◽  
Chao Li ◽  
Jun Yang ◽  
Zhi Yong Cai
Keyword(s):  
Physical Properties ◽  
Electronic Packaging ◽  
Heat Dissipation ◽  
Thermal Conductivity Coefficient ◽  
Coefficient Of Thermal Expansion ◽  
Spray Forming ◽  
Al Alloy ◽  
Scanning Electronic Microscopy ◽  
Alloy Specimen ◽  
Forming Process

The high silicon content Si-Al alloy is a typical heat dissipation material that used in the electrical packaging field. A spray forming process wais used to produce a 90%Si-Al alloy specimen as a heat dissipation material in the present study. Then the spray formed 90%Si-Al specimens weare hot pressed at 1000°C with different pressure ranged from 2MPa to 10MPa to increase their density. The physical properties of the experimental alloy specimen weare measured. And the microstructure wass are observed by using optical microscopy and scanning electronic microscopy. The results showed that the Spray forming wais suitable forto producinge a 90%Si-Al alloy. With hot pressure of 10MPa, the relative density value of 90%Si-Al reachedcan obtain 94%. The typical physical properties such as the thermal conductivity, coefficient of thermal expansion and electrical conductivity of 90%Si-Al alloy are acceptable as a heat dissipation material for many electronic packaging applications.

Study on Thermal Physical Properties of Al-Si8-Cu2-Mg Alloy

2016 ◽  
Vol 877 ◽  
pp. 62-66
Author(s):  
Liang Gao ◽  
Ping He ◽  
Gang Yin Guo ◽  
Zheng Bo Xiang ◽  
Fei Liu
Keyword(s):  
Heat Capacity ◽  
Thermal Expansion ◽  
Physical Properties ◽  
Specific Heat ◽  
Specific Heat Capacity ◽  
Coefficient Of Thermal Expansion ◽  
Mg Alloy ◽  
Heat Of Fusion ◽  
Capacity Coefficient ◽  
Thermal Physical Properties

Parts of thermal physical properties of Al-Si8-Cu2-Mg alloy were studied. The curves were plotted showing the relationship between density, specific heat capacity, coefficient of thermal expansion and the variation of temperature for the first time with this alloy. The results show that the density was decreased when the temperature was raised, but the specific heat capacity and the coefficient of thermal expansion were first increased and then decreased. The solidus-liquidus temperatures, latent heat of fusion were studied, and the results show that the melting temperature range of this alloy was 507-596°C.

Thermal, Electrical and Physical Properties of Recycled Copper Filled Epoxy Composites

2012 ◽  
Vol 620 ◽  
pp. 208-212
Author(s):  
Mohamd Nur Fuadi Pargi ◽  
Pei Leng Teh ◽  
Salmah Husseinsyah ◽  
Cheow Keat Yeoh
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Physical Properties ◽  
Volume Fraction ◽  
Epoxy Composite ◽  
Coefficient Of Thermal Expansion ◽  
Filler Loading ◽  
Epoxy Composites ◽  
Milling Machine

The effect of recycled copper filled epoxy composites on thermal, electrical and physical properties were investigated. The recycled copper was collected as a waste from the milling machine. The recycled copper filled epoxy composite was mixed using mechanical stirrer. The effect of volume fraction of recycled copper of the epoxy composites were studied based on the coefficient of thermal expansion (CTE), electrical conductivity hardness and density. Incorporation of recycled copper has decreased the CTE of the composites. The electrical conductivity, hardness and density of the composites increased with increasing of volume fraction and filler loading.

Research Progress on Preparation of SiC/Al for Electronic Packaging by Liquid Infiltration

2021 ◽  
Vol 1035 ◽  
pp. 906-917
Author(s):  
Meng Qin Chen ◽  
Yue Long Bai ◽  
Zhi Feng Zhang
Keyword(s):  
Electronic Packaging ◽  
Volume Fraction ◽  
High Volume ◽  
Development Trend ◽  
Research Progress ◽  
Preparation Methods ◽  
Advantages And Disadvantages ◽  
Liquid Infiltration ◽  
Al Composite ◽  
The Development Trend

High volume fraction SiC/Al composite material, with its excellent thermal properties and flexible preparation process, has been widely used in the field of electronic packaging. In the paprer, the development of SiC/Al materials for electronic packaging and their preparation methods are reviewed. The preparation processes for preparing SiC/Al by liquid infiltration are mainly introduced. The advantages and disadvantages of several important processes are analyzed. Finally, the development trend of SiC/Al for electronic packaging prepared by liquid infiltration is prospected.

Thermo-Physical Properties of Ti-Coated Diamond/Al Composites Prepared by Pressure Infiltration

2010 ◽  
Vol 654-656 ◽  
pp. 2572-2575 ◽  
Author(s):  
Yang Zhang ◽  
Xi Tao Wang ◽  
Sen Bao Jiang ◽  
Jian Hua Wu
Keyword(s):  
Physical Properties ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Metal Layer ◽  
Interfacial Bonding ◽  
Molten Salt Method ◽  
Pressure Infiltration ◽  
Diamond Particles ◽  
Interfacial Characteristic ◽  
Thermo Physical Properties

Thermo-physical properties of diamond reinforced Al composites were investigated. Volume fraction of diamond particles was up to 55%. In order to improve the interfacial bonding between diamond and aluminum, diamond particles were pre-coated with titanium using molten salt method. XRD and SEM observation showed that the Ti coating on diamond consists of carbide layer and metal layer, which mainly depend on temperature and time. The influences of the Ti coating on interfacial characteristic and the thermo-physical properties of the composites were studied. The interfacial characterization and thermal diffusivity measurements indicated that Ti coated diamond was more favorable on interfacial bonding and thermal properties. Ti coating on diamond resulted in an increase of thermal conductivity of the composites, from 200 to 430 W/mK along with a coefficient of thermal expansion of 6.40 × 10-6/K.

Microstructural Characterization and Properties of SiC/Al Composites for Electronic Packaging Fabricated by Pressureless Infiltration

2007 ◽  
Vol 546-549 ◽  
pp. 1597-1602
Author(s):  
Yan Cui
Keyword(s):  
Electronic Packaging ◽  
Volume Fraction ◽  
Coefficient Of Thermal Expansion ◽  
Microstructural Characterization ◽  
High Volume ◽  
Xrd Analysis ◽  
Mechanical Tests ◽  
Thermal Resistivity ◽  
Pressureless Infiltration ◽  
Reaction Products

High volume fraction (63vol.%) SiCp/Al composite for electronic packaging fabricated by pressureless infiltration was characterized by microscopy, physical and mechanical tests. Microscopy observations and XRD analysis indicated that the composite appeared to be free of porosity and macroscopically homogeneous, SiC-Al interface was atomic bonding interface with low thermal resistivity and electrical resistivity, no interfacial reaction products was detected. Examination of the fracture surfaces of the composites revealed that the cracks passed through the SiC particles and Al matrix, no debonding of SiC-Al interface was observed. The fracture mode indicated that the bonding between SiC-Al was sufficient strong. The properties of the composite were noted for its ultrahigh thermal conductivity of 235W/m·K and specific modulus (79.9×105m), low coefficient of thermal expansion (7.2×10-6/K) and density of 2.99g/cm3. The advantages of the composite over traditional materials used as the electronic packages for aerospace applications were analyzed.

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