Prediction of Surface/Subsurface Crack Damage of Ground Ceramics

2006 ◽  
Vol 304-305 ◽  
pp. 271-275
Author(s):  
Bin Lin ◽  
Hong Tao Zhu ◽  
L. Han ◽  
S.Y. Yu
Keyword(s):  
Crack Propagation ◽  
Grinding Force ◽  
Grinding Process ◽  
Subsurface Crack ◽  
Layer Depth ◽  
Predicting Model ◽  
Damage Layer

Ceramic is prone to engender surface/subsurface crack damage layer because of great grinding force and high brittle. Prediction of crack damage of ground ceramic is important for design and assessment of grinding process. In this paper, an investigation for surface/subsurface crack damage of ground ceramic is introduced. Depth of crack damage layer can predicted by calculating crack propagation balance size and a predicting model of crack damage layer depth is obtained.

Evaluation and Measurement of Surface/Subsurface Crack Damage of Ground Ceramics

2004 ◽  
Vol 471-472 ◽  
pp. 47-51 ◽  
Author(s):  
Bin Lin ◽  
Hong Tao Zhu ◽  
Hui Wu ◽  
Z.F. Wang ◽  
S.Y. Yu
Keyword(s):  
Grinding Force ◽  
Subsurface Crack ◽  
Damage Layer ◽  
Crack System ◽  
Micro Cracks ◽  
Degree Of Damage

While be ground, ceramic is prone to engender surface/subsurface crack damage layer because of great grinding force and high brittle of the material. The crack damage layer was investigated in this research. In experiment, it is observed that the surface/subsurface crack damage layer consists of three kinds of cracks: surface micro-cracks, surface macro-cracks and subsurface crack system. To evaluate expediently the degree of damage to the machined components, the index of surface/subsurface crack damage - Dc, is defined.

scholarly journals Study on the Effect of Grinding Pressure on Material Removal Behavior Performed on a Self-Designed Passive Grinding Simulator

2021 ◽  
Vol 11 (9) ◽  
pp. 4128
Author(s):  
Peng-Zhan Liu ◽  
Wen-Jun Zou ◽  
Jin Peng ◽  
Xu-Dong Song ◽  
Fu-Ren Xiao
Keyword(s):  
Residual Stress ◽  
Surface Roughness ◽  
Service Life ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Grinding Temperature ◽  
Grinding Efficiency

Passive grinding is a new rail grinding strategy. In this work, the influence of grinding pressure on the removal behaviors of rail material in passive grinding was investigated by using a self-designed passive grinding simulator. Meanwhile, the surface morphology of the rail and grinding wheel were observed, and the grinding force and temperature were measured during the experiment. Results show that the increase of grinding pressure leads to the rise of rail removal rate, i.e., grinding efficiency, surface roughness, residual stress, grinding force and grinding temperature. Inversely, the enhancement of grinding pressure and grinding force will reduce the grinding ratio, which indicates that service life of grinding wheel decreases. The debris presents dissimilar morphology under different grinding pressure, which reflects the distinction in grinding process. Therefore, for rail passive grinding, the appropriate grinding pressure should be selected to balance the grinding quality and the use of grinding wheel.

In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process

2021 ◽  
Vol 154 ◽  
pp. 107550
Author(s):  
Fei Qin ◽  
Lixiang Zhang ◽  
Pei Chen ◽  
Tong An ◽  
Yanwei Dai ◽  
...  
Keyword(s):  
Silicon Wafer ◽  
Grinding Force ◽  
Grinding Process ◽  
Wireless Measurement

Grinding Force Model for Low-Speed Grinding Based on Impact Principle

2013 ◽  
Vol 797 ◽  
pp. 123-128
Author(s):  
Ming He Liu ◽  
Xiu Ming Zhang ◽  
Shi Chao Xiu
Keyword(s):  
Sliding Friction ◽  
Impact Load ◽  
Grinding Force ◽  
Calculation Model ◽  
Force Model ◽  
Grinding Process ◽  
Low Speed ◽  
Impact Area ◽  
Force Mechanism ◽  
The Impact

In the low-speed grinding process, the force generated when the wheel grinding the workpiece is the result of sliding friction, plough and cutting. While in the actual study, the cutting process has attracted extensive attention. Impact effect to the entire grinding process on the contact is ignored so that the error exists between the calculation grinding force and the measured grinding force. Basing on the shock effect to the grinding process, the paper divides the contact area into impact area and cutting area. And the model of impact load generated from single grit is built. Moreover, the grinding force theoretical calculation model and total grinding force mathematical model is also constructed by analyzing the impact load affecting on the grinding force mechanism. Finally experimental study verifies the correctness of theoretical analysis.

Subsurface and Surface Cracking Due to Hertzian Contact

1982 ◽  
Vol 104 (3) ◽  
pp. 347-351 ◽  
Author(s):  
L. M. Keer ◽  
M. D. Bryant ◽  
G. K. Haritos
Keyword(s):  
Crack Propagation ◽  
Half Space ◽  
Elastic Half Space ◽  
Contact Stresses ◽  
Numerical Results ◽  
Hertzian Contact ◽  
Vertical Crack ◽  
Subsurface Crack ◽  
Surface Cracking ◽  
Crack Geometry

Numerical results are presented for a cracked elastic half-space surface-loaded by Hertzian contact stresses. A horizontal subsurface crack and a surface breaking vertical crack are contained within the half-space. An attempt to correlate crack geometry to fracture is made and possible mechanisms for crack propagation are introduced.

Development of Three-Dimensional Dynamometer for Wafer Grinder

2010 ◽  
Vol 126-128 ◽  
pp. 361-366 ◽  
Author(s):  
Xiang Long Zhu ◽  
Ren Ke Kang ◽  
Yong Qing Wang ◽  
Dong Ming Guo
Keyword(s):  
Three Dimensional ◽  
High Sensitivity ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Performance Parameters ◽  
Grinding Forces ◽  
Grinding Method ◽  
Static Performance ◽  
Good Repeatability

Grinding forces during grinding silicon wafer have great influences on the accuracy, surface quality and grinding yield of the wafer. It is necessary to develop an accurate and reliable grinding dynamometer for measuring and monitoring the grinding process of the large and thin wafer. In this work, a new 3D (three-dimensional) grinding dynamometer using piezoelectric sensors is designed and developed, which is used for a wafer grinder based on wafer rotating grinding method. The calibrating experiments of the 3D grinding dynamometer are carried out. The FEA and modal analysis are made and compared with the results of mode testing. Furthermore, the static performance parameters of the dynamometer are obtained from the loading experiment. The experiment results indicate that the 3D grinding dynamometer can measure axial, radial and tangential grinding force of grinding wheel with high sensitivity, good linearity, good repeatability and high natural frequency, and fully satisfied requirement for measuring and monitoring of the grinding force in wafer grinding process.

The Adaptive Control of Grinding Force of CNC Cam Grinder Based on Neural Network

2012 ◽  
Vol 217-219 ◽  
pp. 2051-2055
Author(s):  
Ming Li Xie ◽  
Ling Lu
Keyword(s):  
Neural Network ◽  
Adaptive Control ◽  
Control Method ◽  
Metal Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Control Measures ◽  
Numerical Control ◽  
Grinding Wheel ◽  
Grinding Process

In the process of cam grinding, the fluctuation of grinding force can lead to the abnormal wear of the grinding wheel, the decrease of the grinding surface quality and even the damage of the grinding process system. The paper took the grinding process of numerical control cam grinding machine as research subject, the grinding force mathematical model was built, the indirect test and control measures were researched and an adaptive control method based on neural network was proposed and applied to the grinding force control of the cam grinding process. At last, the controller was designed and the grinding simulation was performed with MATLAB, which proved that the system could solve the fluctuation of grinding force during the process of cam grinding and the controller was equipped with good dynamic characteristic. The results indicate that the method can realize the purpose of optimal metal removal rate and enhance the grinding quality of cams.

Study on the Shape Error in the Cylindrical Traverse Grinding of a Workpiece with High Aspect Ratio

2014 ◽  
Vol 1017 ◽  
pp. 78-81
Author(s):  
Takashi Onishi ◽  
Takuya Kodani ◽  
Kazuhito Ohashi ◽  
Moriaki Sakakura ◽  
Shinya Tsukamoto
Keyword(s):  
Aspect Ratio ◽  
Elastic Deformation ◽  
High Aspect Ratio ◽  
Grinding Force ◽  
Grinding Process ◽  
Shape Error ◽  
Shape Accuracy ◽  
Low Stiffness ◽  
Traverse Grinding ◽  
Main Factor

In cylindrical traverse grinding of a long workpiece with high aspect ratio, the shape accuracy of a workpiece worsens due to its low stiffness. In this study, the grinding force was measured during grinding process to calculate the elastic deformation of a workpiece caused by the normal grinding force. By comparing calculated elastic deformation with the measured shape error of ground workpiece, the cause for the shape error in case of grinding a long workpiece was investigated experimentally. From experimental results, it is confirmed that the main factor of the shape error of the long workpiece is its elastic deformation during grinding process.

Fuzzy Control in Profile Envelope Process of Form Cutter for Involute Gear and its Movement Control

2007 ◽  
Vol 24-25 ◽  
pp. 265-272 ◽  
Author(s):  
Jing Kang ◽  
L.N. Guan
Keyword(s):  
Fuzzy Control ◽  
Large Scale ◽  
Fuzzy Controller ◽  
Movement Control ◽  
Grinding Force ◽  
Force Characteristic ◽  
Grinding Process ◽  
Loop Control ◽  
Evaluation Indexes ◽  
Involute Gear

In profile envelope process of form cutter for involute gear, the grinding depth is variable which causes grinding force to change on a large scale and the profile error of envelope to increase. To improve form cutter accuracy, a closed-loop control system was designed to accomplish control of envelope process. For complicated dynamic process, fuzzy controller is used to adjust parameters online. By measuring grinding force, characteristic information of grinding process is acquired. Regulation factor of feed rate is determined by grinding force ratio, force deviation and its change rate used as evaluation indexes. Thus, fuzzy control of constant force grinding process is accomplished. Simulation and cutter grinding test indicates that the system has high precision and stability, and reduces cutter error effectively.

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