Influence of Polishing Parameters on Chemical Mechanical Polishing Processes of LiTaO3 Wafer
2006 ◽
Vol 315-316
◽
pp. 561-565
Keyword(s):
Lithium tantalite (LiTaO3) possesses a combination of unique electro-optical, acoustic, piezoelectric, pyroelectric and non-linear optical properties, making it a suitable material for applications in high frequency, broad width-band SAW and BAW components, filters in television receivers, etc. The surface quality of LiTaO3 wafers decides the performances of the devices. In this paper, the technique of chemical mechanical polishing (CMP) was used to polish LiTaO3 wafers. The influences of the polishing parameters on the CMP processes of LiTaO3 wafers were analyzed in detail based on the measurement of the material removal rate, surface roughness and topograph of the polished wafers in different polishing conditions.
2014 ◽
Vol 1027
◽
pp. 213-216
2014 ◽
Vol 1027
◽
pp. 167-170
◽
2011 ◽
Vol 279
◽
pp. 287-290
◽
2015 ◽
Vol 727-728
◽
pp. 244-247
2013 ◽
Vol 9
(2)
◽
pp. 155-159
◽
2008 ◽
Vol 600-603
◽
pp. 831-834
◽
2014 ◽
Vol 6
◽
pp. 528-537
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