Experiment Research on Temperature Field in Ultrasonic Assisted Grinding Engineering Ceramics

2007 ◽  
Vol 364-366 ◽  
pp. 728-732 ◽  
Author(s):  
Guo Fu Gao ◽  
Chuan Shao Liu ◽  
Bo Zhao ◽  
Feng Jiao ◽  
Qing Hua Kong
Keyword(s):  
Surface Temperature ◽  
Ground Surface ◽  
Ceramic Materials ◽  
Grinding Wheel ◽  
Key Factors ◽  
Engineering Ceramics ◽  
Grinding Parameters ◽  
Orthogonal Experiments ◽  
Ultrasonic Assisted ◽  
The Relationship

As one of the key factors grinding heat has a significant effect on the ground surface quality in grinding engineering ceramics using diamond grinding wheel. Differences between mechanical and physical performances of ceramic materials and grinding parameters have important influences on the surface temperature distribution. In the present research, experiments with/without ultrasonic assistance were carried out to study the temperature characteristics in the grinding field by thermocouple in grinding ZrO2 and Al2O3 engineering ceramics respectively. Moreover, the theoretical analysis and the experiment confirmation for the relationship between grinding parameters and temperature have been discussed. The results show that the further the heat source keeps against grinding surface, the lower the peak value of temperature, and the surface temperature increases with the grinding depth, grinding speed and work table speed. According to the results of orthogonal experiments on grinding parameters, the grinding depth is the most important factor affecting the grinding temperature on the workpiece surface.

Experimental Temperature Studies on Two Dimensional Ultrasonic Vibration Grinding the Nano-ZrO2 Ceramics

2009 ◽  
Vol 416 ◽  
pp. 540-545
Author(s):  
Ping Yan Bian ◽  
Bo Zhao ◽  
Yu Li
Keyword(s):  
Surface Temperature ◽  
Ultrasonic Vibration ◽  
High Surface ◽  
Grinding Wheel ◽  
Grinding Temperature ◽  
Two Dimensional ◽  
Workpiece Surface ◽  
Grinding Parameters ◽  
Thermocouple Method ◽  
The Relationship

In processing of engineering ceramics materials with diamond grinding wheel, grinding heat is one of vital factors influencing workpiece surface quality. Grinding parameters have important influences on workpiece surface temperature distributions. Contrast experiments on grinding temperature of nanoZrO2 under common and two dimensional ultrasonic vibration grinding(TDUVG) were carried out in this paper by manual thermocouple method. The relationship between grinding parameters and grinding temperature was clarified through theoretical analysis and experiment confirmation. The research results show that with the increases of grinding depth, grinding speed, and decrease of working table speed, the workpiece’s surface temperature would heighten accordingly. Furthermore, comparing with high surface layer temperature in common grinding, which often results in grinding burn, TDUVG can reduce grinding temperature effectively.

Research on Temperature Field of Nano-Composite Ceramics by Multi-Ultrasonic Grinding

2012 ◽  
Vol 522 ◽  
pp. 26-30 ◽  
Author(s):  
Jin Xue Xue ◽  
Bo Zhao
Keyword(s):  
Temperature Field ◽  
Surface Temperature ◽  
High Surface ◽  
Grinding Wheel ◽  
Grinding Temperature ◽  
Workpiece Surface ◽  
Grinding Parameters ◽  
Ultrasonic Grinding ◽  
Orthogonal Experiments ◽  
Grinding Temperature Field

In processing of structure ceramics materials with diamond grinding wheel, grinding heat is one of vital factors influencing workpiece surface quality. Grinding parameters have important influences on workpiece surface temperature distribution. Contrast experiments on grinding temperature field of ZrO2 in common and ultrasonic grinding were carried out in the paper by manual thermocouple method. The relationship between grinding parameters and temperature were researched theoretically and experimentally. The results show that the farther the distance from grinding surface, the smaller the peak value of temperature is. With the increases of grinding depth, grinding speed and feedrate, the surface temperature will heightens accordingly. It was proved that grinding depth is the most vital factor influencing grinding temperature field through orthogonal experiments. Furthermore, comparing with high surface layer temperature which often results in grinding burn in traditional grinding, ultrasonic grinding can reduce grinding temperature effectively.

scholarly journals Modeling the Temperature Field in the Ground with an Installed Slinky-Coil Heat Exchanger

Energies ◽  
2021 ◽  
Vol 14 (13) ◽  
pp. 4010
Author(s):  
Monika Gwadera ◽  
Krzysztof Kupiec
Keyword(s):  
Temperature Field ◽  
Heat Exchanger ◽  
Surface Temperature ◽  
Ground Surface ◽  
Heat Sources ◽  
Ground Surface Temperature ◽  
Coil Heat Exchanger ◽  
The Relationship ◽  
Temperature Responses ◽  
Coil Heat

In order to find the temperature field in the ground with a heat exchanger, it is necessary to determine temperature responses of the ground caused by heat sources and the influence of the environment. To determine the latter, a new model of heat transfer in the ground under natural conditions was developed. The heat flux of the evaporation of moisture from the ground was described by the relationship taking into account the annual amount of rainfall. The analytical solution for the equations of this model is presented. Under the conditions for which the calculations were performed, the following data were obtained: the average ground surface temperature Tsm = 10.67 °C, the ground surface temperature amplitude As = 13.88 K, and the phase angle Ps = 0.202 rad. This method makes it possible to easily determine the undisturbed ground temperature at any depth and at any time. This solution was used to find the temperature field in the ground with an installed slinky-coil heat exchanger that consisted of 63 coils. The results of calculations according to the presented model were compared with the results of measurements from the literature. The 3D model for the ground with an installed heat exchanger enables the analysis of the influence of miscellaneous parameters of the process of extracting or supplying heat from/to the ground on its temperature field.

Grinding a Hard-to-Grind Materials with Ultrasonic-Assisted Fluid

2014 ◽  
Vol 8 (3) ◽  
pp. 478-483 ◽  
Author(s):  
Jun Ishimatsu ◽  
◽  
Atsushi Iwaita ◽  
Hiromi Isobe ◽  
Keyword(s):  
Stainless Steel ◽  
Pure Titanium ◽  
Ground Surface ◽  
High Accuracy ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Machining Processes ◽  
Fluid Supply ◽  
Ultrasonic Assisted ◽  
Wheel Loading

Grinding is one of the machining processes used in the manufacture of high-accuracy parts. When materials which easily adhere to the grinding wheel are used, such as aluminum, stainless steel, and titanium, wheel loading must be considered, as this could have a limiting effect. In this research, the application of ultrasonic energy to the grinding fluid is carried out with a specially-designed effector inserted into the fluid supply flow with the expectation that loading will be removed from the wheel. The experiment is carried out on stainless steel and pure titanium. The grinding force and accession of temperature are investigated during grinding, and the reduction of both grinding force and thermal escalation is confirmed. Burn marks on the ground surface of titanium are also prevented.

Research on Predicting Model of Surface Roughness for Ground Engineering Ceramics

2012 ◽  
Vol 476-478 ◽  
pp. 1036-1040
Author(s):  
Xin Li Tian ◽  
Jian Quan Wang ◽  
Bao Guo Zhang ◽  
Fu Qiang Li
Keyword(s):  
Ground Surface ◽  
Texture Features ◽  
Engineering Ceramics ◽  
Texture Parameters ◽  
Digital Microscope ◽  
Occurrence Matrix ◽  
The Relationship ◽  
Regression Theory ◽  
Surface Images

Grinding is the mostly leading machining technology for engineering ceramics. The quality of ground surface can be evaluated by various roughness parameters. And a textural analysis method based on Gray Level Co-occurrence Matrix was employed in researching the roughness of ground ceramics. The relationship between texture features and roughness was investigated through a series of surface images of engineering ceramics collected by a digital microscope. The sampling offset and total gray levels of surface images were determined firstly. Then 4 GLCMs were built up to calculate the average of texture features. And 6 parameters were fixed as main texture parameters. Furthermore, the multiple nonlinear regression theory was used to assess the relation between the texture features and roughness Ra. By statistic test and comparison, the deviation of calculated Ra and actual Ra is less than 0.25. It is shown that this relation is much satisfactory and the method may be suitable for quickly measuring the roughness of ground ceramics.

Grinding Behavior of Yttrium Partially Stabilized Zirconia Using Diamond Grinding Wheel

2016 ◽  
Vol 1136 ◽  
pp. 15-20 ◽  
Author(s):  
P. Suya Prem Anand ◽  
N. Arunachalam ◽  
L. Vijayaraghavan
Keyword(s):  
Ceramic Materials ◽  
Dental Restoration ◽  
Prosthetic Material ◽  
Depth Of Cut ◽  
Grinding Wheel ◽  
Stabilized Zirconia ◽  
Partially Stabilized Zirconia ◽  
Diamond Grinding Wheel ◽  
Diamond Grinding ◽  
Grinding Parameters

In recent development of dental restoration, zirconia has been used as a prosthetic material due to their enhanced properties of fracture strength and toughness compared to other ceramic materials. Zirconia based ceramic materials are used in structural application in engineering, such as in the manufacture of cutting tools, gas sensors, refractories. Grinding was used as the efficient technique to finish ceramic materials. Due to the hard and brittle nature of a ceramic material, the grounded components were left with surface and subsurface damages. In this paper, the influence of the grinding parameters on the grindability of yttrium partially stabilized zirconia was carried out using a diamond grinding wheel. The resin bonded grinding wheel was used to analyze the grinding behavior of the material. The grinding force and surface roughness were measured during the grinding process and the experiments were conducted under conventional flooded conditions. The relationship between the surface finish and grinding parameters such as depth of cut, wheel speed were analyzed.

Radial Directional Vibration-Assisted Ductile-Mode Grinding of Engineering Ceramic

2014 ◽  
Vol 1017 ◽  
pp. 218-221 ◽  
Author(s):  
Kenichiro Imai
Keyword(s):  
Radial Direction ◽  
Thermal Damage ◽  
Removal Rate ◽  
Ground Surface ◽  
Grinding Wheel ◽  
Engineering Ceramics ◽  
Engineering Ceramic ◽  
Ductile Mode ◽  
Hard And Brittle Material ◽  
Significant Attention

Engineering ceramics have received significant attention in the recent years owing to their exceptional mechanical properties, which are expected to be beneficial for engineering applications. However, it has always been a great challenge to realize ductile-mode grinding in engineering ceramics, with one of the critical obstacles being the heat generation that limits the removal rate. As a result, thermal damages are often observed on the ground surfaces. This paper presents the ductile-mode grinding. In the process the grinding wheel is excited along the radial direction by applying an ultrasonic vibration of frequency is 38.5 kHz and amplitude of 0-2 μm. The wheel comes in contact with the Al2O3 ceramic at constant forces 18-24 N. Experimental results indicate that the ground surface is devoid of thermal damages, when removal rate of the vibration-assisted process is approximately 1.5 times higher than without vibration.Keywords: ductile-mode grinding, radial directional vibration, hard and brittle material, engineering ceramic, thermal damage

scholarly journals Evaluation of the Relationship Among Dressing Conditions Using Prismatic Dresser, Dressing Resistance, and Grinding Characteristics

2022 ◽  
Vol 16 (1) ◽  
pp. 12-20
Author(s):  
Gen Uchida ◽  
Takazo Yamada ◽  
Kouichi Ichihara ◽  
Makoto Harada ◽  
Tatsuya Kohara ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Condition ◽  
Ground Surface ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Practical Application ◽  
Wheel Surface ◽  
The Difference ◽  
Ground Surface Roughness ◽  
The Relationship

In the grinding process, the grinding wheel surface condition changes depending on the dressing conditions, which affects the ground surface roughness and grinding resistance. Several studies have been reported on the practical application of dressing using prismatic dressers in recent years. However, only a few studies that quantitatively evaluate the effects of differences in dressing conditions using prismatic dresser on the ground surface roughness and grinding resistance have been reported. Thus, this study aims to evaluate quantitatively the effect of the difference in dressing conditions using the prismatic dresser on the ground surface roughness and grinding resistance by focusing on the dressing resistance. In the experiment, dressing is performed by changing the dressing lead and the depth of dressing cut with a prismatic dresser, and the ground surface roughness and grinding resistance are measured. Consequently, by increasing the dressing lead and the depth of dressing cut, the ground surface roughness increased, and the grinding resistance decreased. This phenomenon was caused by the increase in dressing resistance when the dressing lead and the depth of dressing cut were increased, which caused a change in the grinding wheel surface condition. Furthermore, the influence of the difference in dressing conditions using the prismatic dresser on the ground surface roughness and grinding resistance can be quantitatively evaluated by using the dressing resistance.

Grinding Marks in Back Grinding of Wafer with Outer Rim

2020 ◽  
Vol 234 (16) ◽  
pp. 3195-3206
Author(s):  
Xianglong Zhu ◽  
Yu Li ◽  
Zhigang Dong ◽  
Renke Kang ◽  
Shang Gao ◽  
...  
Keyword(s):  
Simulation Model ◽  
Process Parameters ◽  
Rotational Speed ◽  
Wheel Speed ◽  
Silicon Wafers ◽  
New Method ◽  
Grinding Wheel ◽  
Abrasive Grains ◽  
Grinding Parameters ◽  
The Relationship

Back Grinding of Wafer with Outer Rim (BGWOR) is a new method for carrier-less thinning of silicon wafers. In this paper, the simulation model of grinding marks of wafer in BGWOR was developed. With the model, the relationship between process parameters, including wheel rotational speed, wafer rotational speed, wheel infeed rate, spark out time and the protruding height of the abrasive grains in the grinding wheel, and grinding marks was discussed. Reasonable grinding parameters to control the grinding marks were also proposed. The model was verified by the experiments of BGWOR. The results showed that: (1) The pattern of the grinding marks of the wafers in BGWOR was depended on the grinding wheel rotational speed, the wafer rotational speed, the wheel infeed rate, the spark out time and the protruding height of the abrasive grains on the grinding wheel; (2) The angle between two adjacent grinding marks changes as the variation of the wheel rotational speed and wafer rotational speed; (3) The grinding marks density can be controlled by selecting the proper ratio of wheel speed to wafer speed. The depth of grinding marks can be reduced by increasing the spark out time and reducing the protruding height of the abrasive grains.

The Computation of Grinding Parameters for the Modified Shaper Cutter

2011 ◽  
Vol 121-126 ◽  
pp. 2701-2705
Author(s):  
Chao Huang ◽  
Guo Long Li
Keyword(s):  
Coordinate System ◽  
Relative Motion ◽  
Tooth Profile ◽  
Tooth Surface ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Grinding Parameters ◽  
The Relationship

Grinding process is regarded as the most effective way to generate the tooth profile of spur shaper cutter. However, for the purpose of generating a tip chamfer of gear, the semi-topping is always required on the tooth surface of shaper cutter, which is difficult to process by grinding wheel. This paper proposes a method to compute the profile of grinding wheel which is used to process the spur shaper cutter with a semi–topping. Firstly, translate the points on the surface of shaper cutter into auxiliary rack; Secondly, building the relationship between the coordinate system of grinding wheel and coordinate system of auxiliary rack; Lastly, the points on the surface of auxiliary rack are translated into the coordinate system of grinding wheel based on the relative motion between the grinding wheel and shaper cutter.

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