Fabrication of Three-Dimensional Microstructure Film by Ni-Cu Alloy Electrodeposition for Joining Dissimilar Materials

2021 ◽  
Vol 1016 ◽  
pp. 738-743
Author(s):  
Tatsuya Kobayashi ◽  
Ikuo Shohji
Keyword(s):  
Current Density ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
Anchor Effect ◽  
Alloy Electrodeposition ◽  
Needle Type ◽  
Cu Alloy ◽  
Plating Solution

Metals with a three-dimensional microstructure film can be joined to plastics by the anchor effect. The three-dimensional microstructure films can be electrodeposited by a Ni-Cu alloy. In this study, the effects of the ratio of the concentration of Ni amidosulfate and Cu sulfate in the plating solution and plating current density on the shapes and microstructures of electrodeposited films were investigated. When the ratio of the concentration of the Ni amidosulfate and the Cu sulfate is 0.47-1.4:0.06 (M/L), a dendritic-type electrodeposited structure was generated at plating current density of 10 mA/cm2. When the ratio of the concentration of the Ni amidosulfate and the Cu sulfate is 0.47:0.6-1.2 (M/L), a feathery-type and needle-type electrodeposited structure was generated.

Three-dimensional porous copper-decorated bismuth-based nanofoam for boosting electrochemical reduction of CO2 to formate

2021 ◽  
Author(s):  
Yingchun Zhang ◽  
Changsheng Cao ◽  
Xintao Wu ◽  
Qi-Long Zhu
Keyword(s):  
Current Density ◽  
High Current Density ◽  
Three Dimensional ◽  
Co2 Reduction ◽  
Reduction Reaction ◽  
High Current ◽  
Porous Copper ◽  
Reduction Of Co2 ◽  
Co2 Reduction Reaction ◽  
Wide Potential

Bismuth (Bi)-based nanomaterials are considered as the promising electrocatalysts for electrocatalytic CO2 reduction reaction (CO2RR), but it is challenging to achieve high current density and selectivity in a wide potential...

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

1999 ◽  
Vol 122 (2) ◽  
pp. 121-127 ◽  
Author(s):  
Manjula N. Variyam ◽  
Weidong Xie ◽  
Suresh K. Sitaraman
Keyword(s):  
Thermal Expansion ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
3D Models ◽  
Material Behavior ◽  
Element Analysis

Components in electronic packaging structures are of different dimensions and are made of dissimilar materials that typically have time, temperature, and direction-dependent thermo-mechanical properties. Due to the complexity in geometry, material behavior, and thermal loading patterns, finite-element analysis (FEA) is often used to study the thermo-mechanical behavior of electronic packaging structures. For computational reasons, researchers often use two-dimensional (2D) models instead of three-dimensional (3D) models. Although 2D models are computationally efficient, they could provide misleading results, particularly under thermal loading. The focus of this paper is to compare the results from various 2D, 3D, and generalized plane-deformation strip models and recommend a suitable modeling procedure. Particular emphasis is placed to understand how the third-direction coefficient of thermal expansion (CTE) influences the warpage and the stress results predicted by 2D models under thermal loading. It is seen that the generalized plane-deformation strip models are the best compromise between the 2D and 3D models. Suitable analytical formulations have also been developed to corroborate the findings from the study. [S1043-7398(00)01402-X]

scholarly journals Three-dimensional Simulation of Dendritic Grain Structures of Gas-atomized Al-Cu Alloy Droplets.

1998 ◽  
Vol 38 (1) ◽  
pp. 63-70 ◽  
Author(s):  
Yi Hyun Chang ◽  
Sang Mok Lee ◽  
Kyong Yee Lee ◽  
Chun Pyo Hong
Keyword(s):  
Three Dimensional ◽  
Cu Alloy ◽  
Grain Structures ◽  
Dimensional Simulation

scholarly journals Effect of deposition current density and annealing temperature on the microstructure and magnetic properties of nanostructured Ni-Fe-W-Cu alloys

2019 ◽  
Vol 51 (2) ◽  
pp. 209-221 ◽  
Author(s):  
Milica Spasojevic ◽  
Dusan Markovic ◽  
Miroslav Spasojevic ◽  
Zoran Vukovic ◽  
Aleksa Maricic ◽  
...  
Keyword(s):  
Current Density ◽  
Amorphous Matrix ◽  
Ammonium Citrate ◽  
High Current ◽  
Cathodic Polarization Curve ◽  
Cu Alloy ◽  
Powder Particles ◽  
Current Densities ◽  
Deposition Current Density ◽  
Microstructure And Magnetic Properties

Ni-Fe-W-Cu alloy powders were obtained by electrodeposition from an ammonium citrate bath at current densities ranging between 70 and 600 mA cm-2. As the deposition current density increased, the contents of Fe and W in the alloy increased, and those of Ni and Cu decreased. The total cathodic polarization curve was recorded, and partial polarization curves for Ni, Fe and W deposition and hydrogen evolution were determined. The current efficiency of alloy deposition was measured. The powders contained an amorphous matrix and FCC nanocrystals of the solid solution of Fe, W and Cu in Ni. At high current densities, small-sized nanocrystals exhibiting high internal microstrain values were formed. Powder particles were dendrite- and cauliflower-shaped. The dendrites had a large number of secondary branches and higher-order branches containing interconnected globules. The density of branches was higher in particles formed at high current densities. The powders formed at high current densities exhibited higher magnetization. Annealing at temperatures up to 460?C resulted in structural relaxation, accompanied by an increase in magnetization. At temperatures above 460?C, amorphous matrix crystallization and FCC crystal growth took place, accompanied by a decrease in magnetization.

Effect of Bump Shape on Current Density and Temperature Distributions in Solder Bump Joints under Electromigration

2012 ◽  
Vol 569 ◽  
pp. 82-87
Author(s):  
Yi Li ◽  
Xiu Chen Zhao ◽  
Ying Liu ◽  
Hong Li
Keyword(s):  
Current Density ◽  
Solder Bump ◽  
Three Dimensional ◽  
Maximum Temperature ◽  
Time To Failure ◽  
Element Analysis ◽  
Temperature Distributions ◽  
Maximum Current ◽  
Mean Time ◽  
Waist Radius

Three dimensional thermo-electrical finite element analysis was employed to simulate the current density and temperature distributions for solder bump joints with different bump shapes. Mean-time-to-failure (MTTF) of electromigration was discussed. It was found that as the bump volume increased from hourglass bump to barrel bump, the maximum current density increased but the maximum temperature decreased. Hourglass bump with waist radius of 240 μm has the longest MTTF.

scholarly journals Mechanically interlocked 3D multi-material micromachines

2020 ◽  
Vol 11 (1) ◽  
Author(s):  
C. C. J. Alcântara ◽  
F. C. Landers ◽  
S. Kim ◽  
C. De Marco ◽  
D. Ahmed ◽  
...  
Keyword(s):  
Drug Loading ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
Elastic Behavior ◽  
Small Scale ◽  
Shape Transformation ◽  
On Demand ◽  
Mold Casting ◽  
Metal Organic ◽  
Novel Applications

AbstractMetals and polymers are dissimilar materials in terms of their physicochemical properties, but complementary in terms of functionality. As a result, metal-organic structures can introduce a wealth of novel applications in small-scale robotics. However, current fabrication techniques are unable to process three-dimensional metallic and polymeric components. Here, we show that hybrid microstructures can be interlocked by combining 3D lithography, mold casting, and electrodeposition. Our method can be used to achieve complex multi-material microdevices with unprecedented resolution and topological complexity. We show that metallic components can be combined with structures made of different classes of polymers. Properties of both metals and polymers can be exploited in parallel, resulting in structures with high magnetic responsiveness, elevated drug loading capacity, on-demand shape transformation, and elastic behavior. We showcase the advantages of our approach by demonstrating new microrobotic locomotion modes and controlled agglomeration of swarms.

Investigation of Au-Ag-Cu Alloy Electrodeposition to Electromechanical Systems

2020 ◽  
Vol MA2020-01 (20) ◽  
pp. 1237-1237
Author(s):  
Berkay Cagan ◽  
Metehan Erdogan ◽  
Ishak Karakaya ◽  
Cemil Yilmaz ◽  
Burak Yurdakul
Keyword(s):  
Electromechanical Systems ◽  
Alloy Electrodeposition ◽  
Cu Alloy
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