Influence of Cd and In on the Formation Kinetics of the δ' Metastable Phase in Al-Li-In(Cd) Alloys

2006 ◽  
Vol 519-521 ◽  
pp. 479-482 ◽  
Author(s):  
A. Raho ◽  
Kadi-Hanifi Mouhyddine

The influence of the cadmium and the indium on the kinetics of the δ’ metastable phase precipitation has been studied in Al-8.5at.%Li and Al-8.5%at.%Li- 0.2at.%In(0.3%at.%Cd) solid solutions. From the hardness isotherms the volumic fraction of the formed δ’ metastable phase is determined for different times of ageing at 150, 180 and 200°C. The incubation times of δ’ deduced from the precipitation kinetics show that In and Cd atoms retard the δ’ precipitation.

2018 ◽  
Vol 941 ◽  
pp. 1411-1417
Author(s):  
Jan Herrnring ◽  
Nikolai Kashaev ◽  
Benjamin Klusemann

The development of simulation tools for bridging different scales are essential for understanding complex joining processes. For precipitation hardening, the Kampmann-Wagner numerical model (KWN) is an important method to account for non-isothermal second phase precipitation. This model allows to describe nucleation, growth and coarsening of precipitation hardened aluminum alloys based on a size distribution for every phase which produces precipitations. In particular, this work investigates the performance of a KWN model by [1-3] for Al-Mg-Si-alloys. The model is compared against experimental data from isothermal heat treatments taken partially from [2]. Additionally, the model is used for investigation of the precipitation kinetics for a laser beam welding process, illustrating the time-dependent development of the different parameters related to the precipitation kinetics and the resulting yield strength.


2021 ◽  
pp. 160583
Author(s):  
N.R. Bochvar ◽  
O.V. Rybalchenko ◽  
N. Yu. Tabachkova ◽  
G.V. Rybalchenko ◽  
N.P. Leonova ◽  
...  

Author(s):  
A. Leineweber ◽  
M. Löffler ◽  
S. Martin

Abstract Cu6Sn5 intermetallic occurs in the form of differently ordered phases η, η′ and η′′. In solder joints, this intermetallic can undergo changes in composition and the state of order without or while interacting with excess Cu and excess Sn in the system, potentially giving rise to detrimental changes in the mechanical properties of the solder. In order to study such processes in fundamental detail and to get more detailed information about the metastable and stable phase equilibria, model alloys consisting of Cu3Sn + Cu6Sn5 as well as Cu6Sn5 + Sn-rich melt were heat treated. Powder x-ray diffraction and scanning electron microscopy supplemented by electron backscatter diffraction were used to investigate the structural and microstructural changes. It was shown that Sn-poor η can increase its Sn content by Cu3Sn precipitation at grain boundaries or by uptake of Sn from the Sn-rich melt. From the kinetics of the former process at 513 K and the grain size of the η phase, we obtained an interdiffusion coefficient in η of (3 ± 1) × 10−16 m2 s−1. Comparison of this value with literature data implies that this value reflects pure volume (inter)diffusion, while Cu6Sn5 growth at low temperature is typically strongly influenced by grain-boundary diffusion. These investigations also confirm that η′′ forming below a composition-dependent transus temperature gradually enriches in Sn content, confirming that Sn-poor η′′ is metastable against decomposition into Cu3Sn and more Sn-rich η or (at lower temperatures) η′. Graphic Abstract


2021 ◽  
pp. 2101869
Author(s):  
Daniel García‐Lojo ◽  
Evgeny Modin ◽  
Sergio Gómez‐Graña ◽  
Marianne Impéror‐Clerc ◽  
Andrey Chuvilin ◽  
...  

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