A Study of Solid State Bonding Strength of Nonferrous Metals by Using Metal Salt Generation Bonding Method

2014 ◽  
Vol 783-786 ◽  
pp. 2450-2455
Author(s):  
Shinji Koyama
Keyword(s):  
Solid State ◽  
Formic Acid ◽  
Metal Salt ◽  
Bonding Temperature ◽  
Copper Surface ◽  
Solid State Bonding ◽  
Bonded Joint ◽  
Set Up ◽  
Bonding Method ◽  
Aluminum Surfaces

In recent years, an enormous pressure was put on the need to design and develop products that are compliant with the stringent environmental regulations set up various countries. Among the problems that need to be addressed is the need to design and develop environmentally friendly products that are energy efficient and easy to recycle. In this study, the effect of metal salt generation processing on the tensile strength of the bonded interface of Al/Al and Al/Cu was investigated by SEM observations of interfacial microstructures and fractured surfaces. Aluminum surfaces were modified by boiling in 5% aqueous solution of NaOH for 30 s and 98% formic acid for 60 s. Copper surface were modified by boiling 98% formic acid for 60 s. Solid-state bonding was performed at bonding temperature of 673 ~ 813 K and under a pressure of 6 MPa ( bonding time of 1.8 ks). Using metal salt generation bonding technique, the bonded joint is able to reach 0.2% proof stress at lower bonding temperature and with less deformation.

Solid-State Diffusion Bonding of Titanium by Using Metal Salt Coated Aluminum Sheet

2017 ◽  
Vol 741 ◽  
pp. 31-35
Author(s):  
Shinji Koyama ◽  
Van Phu Nguyen
Keyword(s):  
Solid State ◽  
Metal Salt ◽  
Bonding Temperature ◽  
High Strength ◽  
Bonding Process ◽  
Aluminum Surface ◽  
Solid State Diffusion ◽  
State Diffusion ◽  
Aluminum Surfaces ◽  
Salt Coating

In this study, the effect of metal salt coating processing of aluminum surface on the bond strength of the solid-state diffusion bonded interface of titanium and aluminum has been investigated by SEM observation of the interfacial microstructures and fractured surfaces after tensile test. Aluminum surfaces were coated by boiling in 5% aqueous solution of NaOH for 90 s and 98% formic acid for 60 s. Bonding process was performed at a bonding temperature of 713 ~ 773 K under a load of 12 MPa (for a bonding time of 900 s). As a result of the metal salt coating processing, high strength joint can be achieved with lower bonding temperature compared with unmodified joints. From this study, it is found out that metal salt coating processing is effective at removing oxide film and substitution to metal salt on the aluminum bonding surface.

Effect of various parameters on the shear strength of solid-state nanoporous Cu bonding in Cu–Cu disks for power device packaging

2021 ◽  
Author(s):  
Byungho Park ◽  
Duy le Han ◽  
Mikkiko Saito ◽  
Jun Mizuno ◽  
Hiroshi Nishikawa
Keyword(s):  
Electron Microscopy ◽  
Shear Strength ◽  
Solid State ◽  
Formic Acid ◽  
Bonding Temperature ◽  
X Ray Diffraction ◽  
Promising Alternative ◽  
Transmission Electron ◽  
Cu Bonding ◽  
Bonding Method

Abstract Nanoparticle sintering is considered a promising alternative bonding method to Pb- based soldering for the attachment of components in high-temperature electronic devices. However, the technology still poses certain challenges, such as difficulty controlling joint thickness and the generation of voids owing to solvent evaporation. In this study, a solid-state (solvent-free), nanoporous-Cu (NPC) bonding method was examined. The effect of bonding temperatures (200–400°C) and atmospheres (N2 or formic acid) on the shear strength of joints formed between NPC sheets and bare Cu disks were investigated by scanning electron microscopy, X-ray diffraction, and transmission electron microscopy. It was shown that the bondability of NPC under an N2 atmosphere is closely related to the oxide layer formed on its surface that impairs the diffusion of Cu atoms between the NPC and Cu substrate. Furthermore, the coarsening of the NPC microstructure under a formic acid atmosphere at ≥ 350°C owing to the rapid diffusion of Cu atoms and accompanying plastic deformation induced by surface stress enhances the shear strength of the resulting NPC/Cu joint. The shear strength of NPC/Cu joints formed under a formic acid atmosphere increased from 14.1 to 35.9 MPa with increasing bonding temperature. Based on the results of the investigation, a mechanism was proposed to explain the superiority of the Cu–Cu joints achieved using this method.

Cu/Cu Direct Bonding by Metal Salt Generation Bonding Technique with Formic Acid and Citric Acid

2014 ◽  
Vol 922 ◽  
pp. 219-223 ◽  
Author(s):  
Naoki Hagiwara ◽  
Shinji Koyama ◽  
Ikuo Shohji
Keyword(s):  
Surface Modification ◽  
Citric Acid ◽  
Solid State ◽  
Formic Acid ◽  
Metal Salt ◽  
Bonding Temperature ◽  
Maximum Load ◽  
Bonded Joints ◽  
Copper Surfaces ◽  
Modified Surfaces

The effect of formic acid and citric acid surface modification on the bonded strength of the solid-state direct bonded interface of copper was investigated by SEM observations of interfacial microstructures and fractured surfaces. Copper surfaces were modified by boiling in 98% formic acid for 0.6 ks and 17% aqueous solution of citric acid for 0.96 s. Solid-state bonding was performed in a vacuum chamber at bonding temperature of 423 ~ 673 K under a pressure of 588 N (bonding time of 0.9 ks). As a result of surface modification by formic acid and citric acid, bonded joints were obtained at a bonding temperature 150 K (formic acid) and 100 K (citric acid) lower than that required for non-modified surfaces, and the bond strength was comparable to that of the maximum load.

Study on rigid restraint thermal self-compressing bonding – A new solid state bonding method

2014 ◽  
Vol 129 ◽  
pp. 43-45 ◽  
Author(s):  
Yunhua Deng ◽  
Qiao Guan ◽  
Bing Wu ◽  
Xichang Wang ◽  
Jun Tao
Keyword(s):  
Solid State ◽  
Solid State Bonding ◽  
Bonding Method

A low-temperature solid-state bonding method based on copper bump coated with nickel microcones and silver buffer

2016 ◽  
Vol 181 ◽  
pp. 165-168 ◽  
Author(s):  
Fengtian Hu ◽  
Penghui Xu ◽  
Wenqi Zhang ◽  
Anmin Hu ◽  
Ming Li
Keyword(s):  
Solid State ◽  
Low Temperature ◽  
Solid State Bonding ◽  
Bonding Method

Solid State Bonding of Al Alloy/SUS304 by Metal Salt Generation Bonding Technique with Acetic Acid

2014 ◽  
Vol 922 ◽  
pp. 491-496 ◽  
Author(s):  
Kota Matsubara ◽  
Shinji Koyama ◽  
Hideo Nagata ◽  
Yoshiyuki Suda ◽  
Ikuo Shohji
Keyword(s):  
Acetic Acid ◽  
Surface Modification ◽  
Metal Salt ◽  
Bonding Temperature ◽  
Maximum Load ◽  
Al Alloy ◽  
Bonded Joints ◽  
Modified Surfaces ◽  
Aluminum Surfaces ◽  
Effect Of Surface

The effect of surface modification on the tensile strength of the bonded interface of Al alloy and SUS304 stainless steel was investigated by SEM observations of interfacial microstructures and fractured surfaces. Aluminum surfaces were modified by boiling in 5% aqueous solution of NaOH for 20 s and 99.7% Acetic acid for 60 s. Bonding was performed at bonding temperature of 753 ~ 813 K under a pressure of 6 MPa (bonding time of 1.8 ks). As a result of surface modification, bonded joints were obtained at a bonding temperature 20 K lower than that required for non-modified surfaces, and the bonded strength was comparable to that of the maximum load.

Low Temperature Solid State Gold Bonding of Si Chips to Alumina Substrates

2011 ◽  
Vol 133 (2) ◽  
Author(s):  
Chu-Hsuan Sha ◽  
Chin C. Lee
Keyword(s):  
Solid State ◽  
Static Pressure ◽  
Coefficient Of Thermal Expansion ◽  
Bonding Temperature ◽  
Bond Line ◽  
Bonding Process ◽  
Pure Gold ◽  
Solid State Bonding ◽  
Reflow Temperature ◽  
Atomic Distance

Pure gold (Au) is used as a bonding medium to bond silicon (Si) chips to alumina substrates. The bonding process is performed at 260 °C with only 150 psi (1.0 MPa) static pressure applied. This is a solid-state bonding without any molten phase involved. The Au layer plated on alumina is ductile enough to deform for its surface to mate with the thin Au layer coated on Si. Au atoms on both sides of the bond line are brought within atomic distance and bonding is achieved. The ductile Au joint also accommodates the significant mismatch in coefficient of thermal expansion (CTE) between Si and alumina. Scanning electron microscope (SEM) evaluations show that nearly perfect joints are achieved and no voids are observed. Five samples are shear tested. They all pass the MIL-STD-883G standard. This bonding technique can be applied to bonding any two objects that can be coated with smooth Au layers. The 260 °C bonding temperature is compatible with typical reflow temperature of Sn3.5Ag solders used in electronic industries.

Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones

2013 ◽  
Vol 268 ◽  
pp. 368-372 ◽  
Author(s):  
Qin Lu ◽  
Zhuo Chen ◽  
Wenjing Zhang ◽  
Anmin Hu ◽  
Ming Li
Keyword(s):  
Solid State ◽  
Low Temperature ◽  
Solid State Bonding ◽  
Bonding Method
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