Microstructure and Mechanical Properties of Cement Mortar Incorporate with Coated Expanded Polystyrene Beads

2017 ◽  
Vol 888 ◽  
pp. 234-238 ◽  
Author(s):  
Izwan Johari ◽  
Amri Hamid ◽  
Shah Rizal Kasim ◽  
Zainal Arifin Ahmad
Keyword(s):  
Mechanical Properties ◽  
Electron Microscope ◽  
High Resolution ◽  
Cement Mortar ◽  
Expanded Polystyrene ◽  
High Resolution Imaging ◽  
Interfacial Surface ◽  
Bonding Properties ◽  
Resolution Imaging ◽  
Scanning Electron

Abstract. Coated Expanded polystyrene (CEPS) mortar is a new lightweight building material that demonstrate a good mechanical properties by improving it interfacial bonding properties. By using the field emission scanning electron microscope (FESEM) with high resolution imaging, the mortar morphology at different ages (7, 14 and 28 days) can be observed. The results shows that coated EPS bead provide a good bonding as there is no gap in the interfacial surface at 28 days.

FIB Enhancement of Mechanically Polished Cross-sections

2019 ◽  
Author(s):  
Becky Holdford
Keyword(s):  
Electron Microscope ◽  
High Resolution ◽  
Scanning Electron Microscope ◽  
Cross Sections ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
High Resolution Imaging ◽  
Chemical Attack ◽  
Resolution Imaging ◽  
Scanning Electron

Abstract On mechanically polished cross-sections, getting a surface adequate for high-resolution imaging is sometimes beyond the analyst’s ability, due to material smearing, chipping, polishing media chemical attack, etc.. A method has been developed to enable the focused ion beam (FIB) to re-face the section block and achieve a surface that can be imaged at high resolution in the scanning electron microscope (SEM).

scholarly journals A Study on Biological Sample Preparation for High Resolution Imaging of Scanning Electron Microscope

2020 ◽  
Vol 1447 ◽  
pp. 012034
Author(s):  
Siti Rahmah Aid ◽  
Nik Nur Anis Awadah Nik Zain ◽  
Nur Nadhirah Mohd Rashid ◽  
Hirofumi Hara ◽  
Kamyar Shameli ◽  
...  
Keyword(s):  
Electron Microscope ◽  
High Resolution ◽  
Scanning Electron Microscope ◽  
Sample Preparation ◽  
Biological Sample ◽  
High Resolution Imaging ◽  
Resolution Imaging ◽  
Scanning Electron

Performance Evaluation of a Novel Type of Low-Energy Electron Microscope

1990 ◽  
Vol 48 (1) ◽  
pp. 354-355
Author(s):  
Bertholdand Senftinger ◽  
Helmut Liebl
Keyword(s):  
Electron Microscope ◽  
High Resolution ◽  
Field Strength ◽  
Numerical Aperture ◽  
Low Energy ◽  
Energy Electron ◽  
High Resolution Imaging ◽  
Lens System ◽  
Resolution Imaging ◽  
Low Energy Electron

During the last few years the investigation of clean and adsorbate-covered solid surfaces as well as thin-film growth and molecular dynamics have given rise to a constant demand for high-resolution imaging microscopy with reflected and diffracted low energy electrons as well as photo-electrons. A recent successful implementation of a UHV low-energy electron microscope by Bauer and Telieps encouraged us to construct such a low energy electron microscope (LEEM) for high-resolution imaging incorporating several novel design features, which is described more detailed elsewhere.The constraint of high field strength at the surface required to keep the aberrations caused by the accelerating field small and high UV photon intensity to get an improved signal-to-noise ratio for photoemission led to the design of a tetrode emission lens system capable of also focusing the UV light at the surface through an integrated Schwarzschild-type objective. Fig. 1 shows an axial section of the emission lens in the LEEM with sample (28) and part of the sample holder (29). The integrated mirror objective (50a, 50b) is used for visual in situ microscopic observation of the sample as well as for UV illumination. The electron optical components and the sample with accelerating field followed by an einzel lens form a tetrode system. In order to keep the field strength high, the sample is separated from the first element of the einzel lens by only 1.6 mm. With a numerical aperture of 0.5 for the Schwarzschild objective the orifice in the first element of the einzel lens has to be about 3.0 mm in diameter. Considering the much smaller distance to the sample one can expect intense distortions of the accelerating field in front of the sample. Because the achievable lateral resolution depends mainly on the quality of the first imaging step, careful investigation of the aberrations caused by the emission lens system had to be done in order to avoid sacrificing high lateral resolution for larger numerical aperture.

scholarly journals Combining Focused Ion Beam and Scanning Electron Microscopy for IC Fab Support and Defect Review

1996 ◽  
Vol 4 (3) ◽  
pp. 18-19
Author(s):  
Janet Tashima ◽  
Jay Lindquist
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
The Other ◽  
High Resolution Imaging ◽  
Resolution Imaging ◽  
Twin Beam ◽  
Edge Tool ◽  
Scanning Electron

The cutting-edge tool for IC fab support and defect review brings together the Focused Ion Beam (FIB) technology with the Scanning Electron Microscope (SEM) into a single workstation. The twin beam FIB/SEM workstation, FEI Company's DualBeam™ 820 for example, combines the unique micromachining, microdeposition, and analysis capabilities of a FIB with the high resolution imaging power of a Schottky field emission scanning electron microscope (FE SEM). The full functionality of both instruments is available and neither is compromised by the other.

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