Deformation and Failure of Ultrafine-Grained Cu at Subambient Temperature
Keyword(s):
The ultrafine-grained copper was obtained by 12 passes of equal-channel angular pressing method. The uniaxial tensile tests at room temperature and the subambient temperature of 77 K show that the yield stress increases from the value of 128 MPa to the value of 138 MPa, respectively. In addition, the lowering the test temperature tends to the increase of the deformation before the failure. The fractographic analysis shows the transcrystalline ductile failure for all samples. Due to the high plasticity of nanostructured copper no influence of the nanoporosity on the failure process was observed.
2019 ◽
Vol 799
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pp. 103-108
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2012 ◽
Vol 706-709
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pp. 1781-1786
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Keyword(s):
2008 ◽
Vol 584-586
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pp. 281-286
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2016 ◽
Vol 725
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pp. 202-207
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2012 ◽
Vol 706-709
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pp. 1817-1822
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2010 ◽
Vol 667-669
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pp. 973-978
Keyword(s):
Effect of Ultrasonic Treatment on the Characteristics of Superplasticity of Titanium Alloy Ti-6Al-4V
2018 ◽
Vol 385
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pp. 53-58
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