Study and Design of a Heat Dissipation System in a Junction Box for Chinese Experimental Ocean Observatory Network

2016 ◽  
Vol 50 (2) ◽  
pp. 63-74 ◽  
Author(s):  
Dejun Li ◽  
Jun Wang ◽  
Jianshe Feng ◽  
Canjun Yang ◽  
Yanhu Chen
Keyword(s):  
Temperature Field ◽  
Heat Dissipation ◽  
Thermal Contact ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Laboratory Setup ◽  
Temperature Field Model ◽  
Cooling Mechanism ◽  
Dissipation System

AbstractGood heat dissipation is highly significant for long-term reliable functioning of a junction box (JB) for a cable ocean observatory network. An innovative heat dissipation system consisting of circumferentially equi-spaced chassis heat sinks and an adaptive elastic support structure is proposed based on the analysis of the cooling mechanism of the JB. A temperature field model of the JB is established. The parameters include seawater pressure, precision of machine workpieces, seawater flow rate, and thermal contact resistance. A 3D dynamic simulation of heat dissipation is conducted using the commercial software ANSYS to describe the temperature field inside the JB. The proposed heat dissipation system is applied and tested on a laboratory setup of the Experimental Underwater Observatory Network System of China. Experimental results agree well with the theoretical model and simulated results. The increase in maximum temperature in the JB is between 7°C and 10°C under different sea conditions.

scholarly journals Mathematical modeling and numerical simulation of heat dissipation in led bulbs

2020 ◽  
Vol 24 (3 Part A) ◽  
pp. 1877-1884 ◽  
Author(s):  
Diego Alarcón ◽  
Eduardo. Balvís ◽  
Ricardo Bendaña ◽  
Alberto Conejero ◽  
de Fernández ◽  
...  
Keyword(s):  
Mathematical Modeling ◽  
Numerical Simulation ◽  
Numerical Simulations ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Contact ◽  
Heat Sinks ◽  
Experimental Measurements ◽  
Heating And Cooling ◽  
The Common

We present a detailed study of heating and cooling processes in LED luminaires with passive heat sinks. Our analysis is supported by numerical simulations as well as experimental measurements, carried on commercial systems used for outdoor lighting. We have focused our analysis on the common case of a single LED source in thermal contact with an aluminum passive heat sink, obtaining an excellent agreement with experimental measurements and the numerical simulations performed. Our results can be easily expanded, without loss of generality, to similar systems.

Improved Heat Dissipation Capability on Electronic Motor Control Devices

2005 ◽  
Author(s):  
Wei Tong
Keyword(s):  
Heat Transfer ◽  
Motor Control ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Vortex Generators ◽  
Maximum Temperature ◽  
Complex Heat Transfer ◽  
Pin Fins ◽  
Control Devices

Heat sinks have been widely used in electronic industry to maintain the operation temperatures of electronic devices lower than their allowable values and thus are often critical to the device performance and life. However, it is difficult to design heat sinks to satisfy all design specifications optimally under complex heat transfer phenomena. The present work discloses a new design of heat sinks to improve heat dissipation capability for electric motor control devices. The heat sink contains a plurality of raindrop-shaped pin fins, acting as vortex generators to increase the rate of heat transfer and in turn, to increase the cooling efficiency of the heat sinks. Numerical results have shown that with the new designed heat sinks, the maximum temperature can reduce about 30% over the conventional heat sinks.

Plastic Dissipation and Temperature Field around a Steady Running Crack

2006 ◽  
Vol 324-325 ◽  
pp. 895-898
Author(s):  
Wen Bo Luo ◽  
Ting Qing Yang
Keyword(s):  
Temperature Field ◽  
Heat Source ◽  
Plastic Zone ◽  
Temperature Rise ◽  
Heat Dissipation ◽  
Crack Tip ◽  
Maximum Temperature ◽  
Growth Speed ◽  
Density Distribution Function ◽  
Plastic Dissipation

Temperature field is formed due to heat dissipation when material is subjected to irreversible deformation. In this paper, the heat dissipation in the crack-tip plastic zone was considered. By considering the propagating crack-tip plastic zone as a running heat source and constructing a reasonable heat source density distribution function, the temperature field around a steady running crack was obtained. It is shown that temperature rise is dependent on the crack growth speed and the material parameters. The maximum temperature rise reaches to >50 oC in our example calculations for a steady running crack in PMMA.

Application of Thermal Contact Resistance in Simulation of Heat Dissipation by CPU Heat Sinks Based on ANSYS

2014 ◽  
Vol 941-944 ◽  
pp. 2465-2468 ◽  
Author(s):  
Yong Zhen Liu ◽  
Zhi Shi Huang ◽  
Bin Feng ◽  
Jin He Wei ◽  
Jian Min Zeng
Keyword(s):  
Contact Resistance ◽  
Heat Dissipation ◽  
Thermal Contact Resistance ◽  
Thermal Contact ◽  
Heat Sinks ◽  
Ansys Software ◽  
Electronic Elements ◽  
Good Heat ◽  
Main Factor

With development in electronic technology, more and more electronic elements have been integrated into one chip, which has resulted in the cooling problem of the chips. In this case, heat dissipation has become the main factor that affecting the design reliability and package cost. Therefore, good heat dissipation designs are urgently need to solve the problem. An important issue resulted from simulation of heat dissipation is the determination of boundary condition between the heat sink and the CPU. The concept of thermal contact resistance was introduced to simulation of heat dissipation of CPU heat sinks in this paper. The temperature distribution of CPU heat sinks was calculated Based on ANSYS software. The result of calculation can help to understand the heat transfer characteristics of CPU heat sinks, and also offer a reference for the design and improvement of the electronic equipment.

Experimental Study on Natural Convection From Vertical Cylinders With Branched Fins

2013 ◽  
Author(s):  
Kuen Tae Park ◽  
Byeongdong Kang ◽  
Hyun Jung Kim ◽  
Dong-Kwon Kim
Keyword(s):  
Natural Convection ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Electronic Systems ◽  
Electronic Components ◽  
Cooling Systems ◽  
Cooling Technology ◽  
Vertical Cylinders

Advances in semiconductor technology and trends in slim and light electronic systems have led to a significant increase in heat dissipation density of the electronic devices. Therefore, effective cooling technology is essential for reliable operation of electronic components. Among various cooling systems, natural convection heat sinks have been proven to be appropriate because of their inherent simplicity, reliability, and low long-term cost. The present study is focused on natural convective heat transfer from the cylindrical heat sink. Especially, the branched fins, which are motivated by the branched design of nature shown in trees and lungs, are used. The heating power and surface temperature are measured for various types of branched fins and numbers of fins. The result showed that the branched fin dissipates 20% more heat compared to the normal plate fins. Therefore, heat sinks with branched fins have a potential as a next-generation cooling device.

scholarly journals Influence of Ambient Temperature on Radiative and Convective Heat Dissipation Ratio in Polymer Heat Sinks

Polymers ◽  
2021 ◽  
Vol 13 (14) ◽  
pp. 2286
Author(s):  
Jan Kominek ◽  
Martin Zachar ◽  
Michal Guzej ◽  
Erik Bartuli ◽  
Petr Kotrbacek
Keyword(s):  
Heat Transfer ◽  
Ambient Temperature ◽  
Convective Heat ◽  
Heat Dissipation ◽  
High Surface ◽  
Heat Sinks ◽  
Fourth Power ◽  
Molding Process ◽  
Ambient Temperatures ◽  
University Of Technology

Miniaturization of electronic devices leads to new heat dissipation challenges and traditional cooling methods need to be replaced by new better ones. Polymer heat sinks may, thanks to their unique properties, replace standardly used heat sink materials in certain applications, especially in applications with high ambient temperature. Polymers natively dispose of high surface emissivity in comparison with glossy metals. This high emissivity allows a larger amount of heat to be dissipated to the ambient with the fourth power of its absolute surface temperature. This paper shows the change in radiative and convective heat transfer from polymer heat sinks used in different ambient temperatures. Furthermore, the observed polymer heat sinks have differently oriented graphite filler caused by their molding process differences, therefore their thermal conductivity anisotropies and overall cooling efficiencies also differ. Furthermore, it is also shown that a high radiative heat transfer leads to minimizing these cooling efficiency differences between these polymer heat sinks of the same geometry. The measurements were conducted at HEATLAB, Brno University of Technology.

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

2015 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Computational Study ◽  
Heat Sinks ◽  
Channel Diameter ◽  
Internal Channel ◽  
Study Results ◽  
Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

Sign in / Sign up

Export Citation Format

Share Document