Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 001328-001360
Author(s):  
Mustafa Oezkoek ◽  
Gustavo RamosArnd ◽  
KilianJens Wegricht
Keyword(s):  
Solder Joint ◽  
Surface Finish ◽  
Copper Wire ◽  
Wire Bonding ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Gold Silver ◽  
Copper Wire Bonding ◽  
Packaging Industry ◽  
New Challenges

New challenges in the industry, new technical requirements, as well as cost and environmental regulations, require a constant search for alternative manufacturing solutions for the electronic packaging industry. Finer lines and spaces, higher frequencies, improved solder joint reliability and new challenges in wire bonding – both with existing wire technology such as Al and Au or novel types such as Cu or Cu-Pd – are just a few examples of technological advancements for surface finishes in the packaging industry. Additionally, the reduction and elimination of toxic and hazardous materials, as well as the drive to further reduce the manufacturing costs, are important requirements which has to be addressed. The new direct pure EP/EPAG surface finish is suggested as a solution to these challenges for the future. The direct EP/EPAG process allows the direct deposition of palladium on copper, without using any nickel. It is suitable for high frequency, for flexible applications, for gold, aluminum, gold, silver and copper wire bonding applications. The process proves superior solder joint strength for lead free and eutectic soldering and is compatible with many new base materials and soldermask types owing to its short deposit time and low temperature needs. Finally, the EP/EPAG process operates at a thickness of less than 300 nm, ideal for very fine lines and spaces. The EP/EPAG finish also features several environmental benefits, such as less water and energy consumption owing to reduced process steps and line lengths. The suggested paper will provide new wire bond data with silver, gold and copper wire bonding results. A technical comparison to a thin ENEPIG finish will be provided to show the differences in terms of soldering and solder joint reliability.

Solder-Joint Reliability of a Radar Processor for Semi-Autonomous Driving Applications

2018 ◽  
Vol 2018 (1) ◽  
pp. 000104-000109
Author(s):  
Mollie Benson ◽  
Burton Carpenter ◽  
Andrew Mawer
Keyword(s):  
Solder Joint ◽  
Thermal Shock ◽  
Surface Finish ◽  
Solder Ball ◽  
Digital Signal ◽  
Autonomous Driving ◽  
Solder Joint Reliability ◽  
Automotive Safety ◽  
Safety Integrity Level ◽  
Joint Reliability

Abstract Radar is currently employed in automotive applications to provide the range, angle, and velocity of objects using RF waves (77GHz). This paper outlines solder joint reliability of a specific micro-processor that processes data received from a SRR (short range radar operating from 0.2 to 30 meters). It is a powerful digital signal processing accelerator, which targets safety applications that require a high Automotive Safety Integrity Level (ASIL-B). The paper explores the package design and construction, SMT (surface mount technology) assembly, and board level reliability testing of various BGA pad surface finish and solder ball alloy materials on a 0.65 mm pitch, 10 × 10 mm body 141 MAPBGA (mold array process-ball grid array) package. The package configurations include two BGA pad surface finishes (Ni/Au and OSP [organic solderability protectant]) and three solder alloys (SnAg, SAC405, and SAC-Bi [a Bi containing SAC derivative]). Solder joint reliability analysis was performed through AATS (air-to-air thermal shock) between 40°C and +125°C and JEDEC Drop Testing at 1500G's. Thermal shock was extended until at least 75% of the populations failed, which was well past the points needed to qualify the packages for the intended end-use applications. The evaluations of the micro-processor indicate that the MAPBGA package can meet the ASIL-B specification requirements with optimized combinations of BGA pad surface finish and solder alloy. The focus of this paper was to determine the baseline solder-joint thermal shock and JEDEC drop performance with varied BGA pad surface finish and solder ball alloy materials.

Direct Palladium-Gold on copper as a Surface Finish for next generation Packages.

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001145-001184
Author(s):  
Mustafa Ozkok ◽  
Sven Lamprecht ◽  
Gustavo Ramos ◽  
Arnd Kilian
Keyword(s):  
Surface Finish ◽  
Copper Wire ◽  
Environmental Issues ◽  
Wire Bonding ◽  
Gold Layer ◽  
Test Results ◽  
Fine Line ◽  
Surface Finishes ◽  
Copper Wire Bonding ◽  
Bond Tests

A new surface finish is entering the market. The need for this finish comes from needs for new assembly technologies like copper wire bonding or chip assembly by thermo compression bond. Furthermore Nickel an element, which is the base of many surface finishes like ENIG or ENEPIG, is more and more regarded as an unpleasant element as of several disadvantages, such as for high frequency applications, for environmental issues or for fine line applications were a 5 μm Ni Layer is just simply too thick. All these concerns supporting the introduction of a new surface finish, a direct EP and direct EPAG finish. In particular, its suitability for copper wire bonding and its fine line capability makes it very attractive from a cost standpoint of view. In addition, the mentioned technological handicaps of nickel based finishes could be solved by applying a revolutionary surface finish – A Direct Palladium with an optional gold layer. The direct deposition of palladium on copper with an optional gold layer does have further technological, environmental and economical advantages. The suggested paper will describe and discuss the advantages and chances using this new surface finish, as well as demonstrate soldering on various wire bond tests on the Direct EP and EPAG finishes as well as soldering test results.

Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding.

2013 ◽  
Vol 2013 (CICMT) ◽  
pp. 000257-000260
Author(s):  
Maren Bruder ◽  
Guenter Heinz ◽  
Mustafa Oezkoek
Keyword(s):  
Surface Finish ◽  
Copper Wire ◽  
Economic Benefits ◽  
Wire Bonding ◽  
Gold Layer ◽  
Ceramic Substrates ◽  
Main Layer ◽  
Surface Finishes ◽  
Copper Wire Bonding ◽  
Assembly Technology

Surface finishes for ceramic electronics are an important feature. . The suitable surface finish allows the appropriate assembly technology to be performed on the ceramic substrate. The paper will present the possible surface finish options for ceramic substrates and include the advantages and challenges of each surface finish. Furthermore it will show the potential of a new surface finish called “Direct EPAG”. The demand for these new finishes is based on needs for new assembly technologies like copper wire bonding and for high frequency applications. Furthermore Nickel which the main layer of many surface finishes like ENIG or ENEPIG, is more and more regarded as an unpleasant element due to several disadvantages. All these concerns are supporting the introduction of a new surface finish called “direct EPAG” (Electroless Palladium, Autocatalytic Gold) finish. In particular, its suitability for copper wire bonding and its fine line capability makes it very attractive from a cost standpoint. In addition, the mentioned technological drawbacks of nickel based finishes could be solved by applying a revolutionary surface finish: “direct palladium with an optional direct gold layer on copper”. The direct deposition of palladium on copper with an optional gold layer does have a number of technological, environmental and economic benefits. The suggested paper will describe and discuss the advantages and challenges using this new surface finish. It will also exhibit the results of various soldering and wire bond tests on the EPAG finish.

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