Chip-Last (RDL-First) Fan-Out Panel-Level Packaging (FOPLP) for Heterogeneous Integration
2020 ◽
Vol 2020
(1)
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pp. 000042-000050
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Abstract In this investigation, the chip-last, RDL (redistribution-layer)-first, fan-out panel-level packaging (FOPLP) for heterogeneous integration is studied. Emphasis is placed on the materials, process, fabrication, and reliability of a heterogeneous integration of one large chip (10mm × 10mm) and two small chips (7mm × 5mm) by a FOPLP method on a 20mm × 20mm RDL-first substrate fabricated on a 515mm × 510mm temporary glass panel. Reliability test such as the drop test of the heterogeneous integration package on a PCB (printed circuit board) is performed and test results including failure analysis are presented. Some recommendations are also provided.
2020 ◽
Vol 17
(3)
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pp. 89-98
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2009 ◽
Vol 419-420
◽
pp. 37-40
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Keyword(s):
2018 ◽
Vol 15
(4)
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pp. 141-147
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Keyword(s):
Keyword(s):
1994 ◽
Vol 5
(1)
◽
pp. 25-29
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2020 ◽