High Temperature Silicon Carbide Power Modules for High Performance Systems

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000159-000166 ◽  
Author(s):  
J. Hornberger ◽  
B. McPherson ◽  
J. Bourne ◽  
R. Shaw ◽  
E. Cilio ◽  
...  

The demands of modern high-performance power electronics systems are rapidly surpassing the power density, efficiency, and reliability limitations defined by the intrinsic properties of silicon-based semiconductors. The advantages of silicon carbide (SiC) are well known, including high temperature operation, high voltage blocking capability, high speed switching, and high energy efficiency. In this discussion, APEI, Inc. presents two newly developed high performance SiC power modules for extreme environment systems and applications. These power modules are rated to 1200V, are operational at currents greater than 100A, can perform at temperatures in excess of 250 °C, and are designed to house various SiC devices, including MOSFETs, JFETs, or BJTs. One newly developed module is designed for high performance, ultra-high reliability systems such as aircraft and spacecraft, and features a hermetically sealed package with a ring seal technology capable of sustaining temperatures in excess of 400°C. The second module is designed for high performance commercial and industrial systems such as hybrid electric vehicles or renewable energy applications, implements a novel ultra-low parasitic packaging approach that enables high switching frequencies in excess of 100 kHz, and weighs in at just over 130 grams (offering ~5× mass reduction and ~3× size reduction in comparison with industry standard power brick packaging technology). It is configurable as either a half or full bridge converter. In this discussion, APEI, Inc. introduces these products and presents practical testing of each.

2012 ◽  
Vol 717-720 ◽  
pp. 1219-1224 ◽  
Author(s):  
Alexander B. Lostetter ◽  
J. Hornberger ◽  
B. McPherson ◽  
J. Bourne ◽  
R. Shaw ◽  
...  

The demands of modern high-performance power electronics systems are rapidly surpassing the power density, efficiency, and reliability limitations defined by the intrinsic properties of silicon-based semiconductors. The advantages of silicon carbide (SiC) are well known, including high temperature operation, high voltage blocking capability, high speed switching, and high energy efficiency. In this discussion, APEI, Inc. presents two newly developed high performance SiC power modules for extreme environment systems and applications. These power modules are rated to 1200V, are operational at currents greater than 100A, can perform at temperatures in excess of 250 °C, and are designed to house various SiC devices, including MOSFETs, JFETs, or BJTs.


2012 ◽  
Vol 2012 (HITEC) ◽  
pp. 000402-000406
Author(s):  
B. Passmore ◽  
J. Hornberger ◽  
B. McPherson ◽  
J. Bourne ◽  
R. Shaw ◽  
...  

A high temperature, high performance power module was developed for extreme environment systems and applications to exploit the advantages of wide bandgap semiconductors. These power modules are rated > 1200V, > 100A, > 250 °C, and are designed to house any SiC or GaN device. Characterization data of this power module housing trench MOSFETs is presented which demonstrates an on-state current of 1500 A for a full-bridge switch position. In addition, switching waveforms are presented that exhibit fast transition times.


2010 ◽  
Author(s):  
A. B. Lostetter ◽  
J. Hornberger ◽  
B. McPherson ◽  
R. Shaw ◽  
B. Reese ◽  
...  

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000297-000304 ◽  
Author(s):  
B. Reese ◽  
B. McPherson ◽  
R. Shaw ◽  
J. Hornberger ◽  
R. Schupbach ◽  
...  

Arkansas Power Electronics International, Inc., in collaboration with the University of Arkansas and Rohm, Ltd., have developed a high-temperature, high-performance Silicon-Carbide (SiC) based power module with integrated gate driver. This paper presents a description of the single phase half-bridge module containing eight Rohm 30 A SiC DMOSFETs in parallel per switch position. The electrical and thermal performance of the system under power is also presented.


2012 ◽  
Vol 614-615 ◽  
pp. 1299-1302
Author(s):  
Ming Jing Li ◽  
Yu Bing Dong ◽  
Guang Liang Cheng

Multiple high speed CMOS cameras composing intersection system to splice large effect field of view(EFV). The key problem of system is how to locate multiple CMOS cameras in suitable position. Effect field of view was determined according to size, quantity and dispersion area of objects, so to determine camera position located on below, both sides and ahead to moving targets. This paper analyzes effect splicing field of view, operating range etc through establishing mathematical model and MATLAB simulation. Location method of system has advantage of flexibility splicing, convenient adjustment, high reliability and high performance-price ratio.


2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Zhi Dong ◽  
Zongqing Ma ◽  
Liming Yu ◽  
Yongchang Liu

AbstractWith excellent creep resistance, good high-temperature microstructural stability and good irradiation resistance, oxide dispersion strengthened (ODS) alloys are a class of important alloys that are promising for high-temperature applications. However, plagued by a nerve-wracking fact that the oxide particles tend to aggregate at grain boundary of metal matrix, their improvement effect on the mechanical properties of metal matrix tends to be limited. In this work, we employ a unique in-house synthesized oxide@W core-shell nanopowder as precursor to prepare W-based ODS alloy. After low-temperature sintering and high-energy-rate forging, high-density oxide nanoparticles are dispersed homogeneously within W grains in the prepared alloy, accompanying with the intergranular oxide particles completely disappearing. As a result, our prepared alloy achieves a great enhancement of strength and ductility at room temperature. Our strategy using core-shell powder as precursor to prepare high-performance ODS alloy has potential to be applied to other dispersion-strengthened alloy systems.


1976 ◽  
Vol 98 (4) ◽  
pp. 1125-1134 ◽  
Author(s):  
R. Komanduri ◽  
M. C. Shaw

Attritious wear of silicon carbide in simulated grinding tests against a cobalt base superalloy at high speed and extremely small feed rate was studied using a scanning electron microscope (SEM) and an auger electron spectroscope (AES). In many cases the wear area of silicon carbide was found to be concave rather than planar in shape. Several microcracks and grain boundary fracture were also observed. No evidence of metal build-up was observed on silicon carbide which was not the case with aluminum oxide. AES study of the rubbed surface on the work material and transmission electron microscope (TEM) investigation of the wear debris suggest that attritious wear of silicon carbide is due to one or more of the following mechanisms: 1 – Preferential removal of surface atoms on the abrasive, layer by layer, by oxidation under high temperature and a favorably directed shear stress; 2 – disassociation of silicon carbide at high temperature and (a) diffusion of silicon into the work material and formation of metal silicides and (b) diffusion of carbon into the work material and formation of unstable metal carbides (in the present case Ni3C and Co3C) which decompose during cooling to metal and carbon atoms; 3 – pinocoidal cleavage fracture of silicon carbide on basal planes c(0001) resulting in the removal of many micron-sized crystallites.


2016 ◽  
Vol 64 ◽  
pp. 434-439 ◽  
Author(s):  
J. Ortiz Gonzalez ◽  
A.M. Aliyu ◽  
O. Alatise ◽  
A. Castellazzi ◽  
L. Ran ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document