Evaluation of PulseForge Tool for Processing Metallic Conductive Inks on Low Temperature Substrates Part II: Screen Inks

2010 ◽  
Vol 2010 (1) ◽  
pp. 000920-000923
Author(s):  
S. Farnsworth ◽  
I. Rawson ◽  
K. A. Schroder ◽  
D. Pope

At this event in 2009, the authors discussed the need for advanced tooling and materials for printed electronics device development and manufacturing. We went on to describe and evaluate a novel toolset called PulseForge® which is based on photonic curing and capable of drying and sintering metallic-based inks on low-temperature substrates in milliseconds. Example inks manufactured by NovaCentrix used in the initial evaluation were silver and copper-based inkjet inks, with nanoparticles as the functional material. These inks were only 100's of nm thick when printed and dried. As part of on-going work, the authors are now presenting the same toolset applied to thicker screen print inks of silver and copper. A PulseForge 3100 in 12-inch width configuration is used to process improved silver screen ink on PET, and a new copper-based screen ink on copy paper. The tools produce equal or improved results over oven processing. Additionally, we demonstrate the PulseForge tools can process material at speeds consistent with volume manufacturing.

2011 ◽  
Vol 2011 (1) ◽  
pp. 001040-001046 ◽  
Author(s):  
K. A. Schroder ◽  
Ian M. Rawson ◽  
Dave S. Pope ◽  
S. Farnsworth

Photonic curing is a transient thin-film thermal processing technique using flashlamps. It was developed by NovaCentrix® and incorporated in the PulseForge® toolset to address the need of the printed electronics industry to process high temperature materials on low temperature substrates such as paper and plastic on a moving web. Applications include photovoltaics, displays, solid state lighting, thin film batteries, RFID tags, and printed circuits. The ability to substitute inexpensive and flexible substrates for expensive, rigid substrates while achieving similar performance can dramatically reduce the cost of the final product and enable new products. In this paper, we discuss the technology and mechanisms of the process and illustrate a case study of forming copper traces on plastic and paper in a roll-to-roll environment. Here, a low cost copper oxide ink is printed on plastic or paper and chemically reacted using pulsed light from the PulseForge tool to form highly conductive copper traces. This process is performed in an ambient atmosphere.


2012 ◽  
Vol 43 (1) ◽  
pp. 430-433 ◽  
Author(s):  
Stan Farnsworth ◽  
Kurt Schroder ◽  
Bob Wenz ◽  
Dave Pope ◽  
Ian Rawson

2021 ◽  
Author(s):  
Dongjin Xie ◽  
Qiuyi Luo ◽  
Shen Zhou ◽  
Mei Zu ◽  
Haifeng Cheng

Inkjet printing of functional material has shown a wide range of application in advertzing, OLED display, printed electronics and other specialized utilities that require high-precision, mask-free, direct-writing deposition technique. Nevertheless,...


2018 ◽  
Vol 459 ◽  
pp. 249-256 ◽  
Author(s):  
Yun Mou ◽  
Yuru Zhang ◽  
Hao Cheng ◽  
Yang Peng ◽  
Mingxiang Chen

2014 ◽  
Vol 2014 (1) ◽  
pp. 000251-000257
Author(s):  
Steven Grabey ◽  
Samson Shahbazi ◽  
Sarah Groman ◽  
Catherine Munoz

An increased interest in low temperature polymer thick film products has become apparent due to the rise of the printed electronics market. The specifications for these products are becoming more demanding with expectations that the low temperature products should perform at a level that is typically reserved for their high temperature counterparts; including solderability with lead free solders, high reliability and strong adhesion. Traditionally, it has only been possible to use leaded solders for soldering to polymer based thick film conductors. Over the last 15 years environmental concerns and legislation have pushed the industry towards a lead free approach. The shift to lead free solders, while beneficial, provides new challenges during processing. The high temperatures required for a lead-free soldering process yield a naturally harsher environment for polymer thick film pastes. In the past these conditions have proven too harsh for the pastes to survive. The polymer thick film discussed in this document aims to address some of these concerns for a highly reliable and easy to process polymer thick film paste. Due to the poor leaching characteristics of polymer thick films, at elevated temperatures, the predecessors of this paste typically soldered at low temperatures with leaded solders. The goal of this paper is to present a low temperature paste that is compatible with a variety of substrates and readily accepts lead-free solder. This paper will discuss a newly formulated low temperature curing (150°C – 200°C) RoHS and REACH compliant paste that shows excellent solderability with SAC305 solder. The paste was evaluated using a dip soldering method at 235°C–250°C on a variety of substrates. The data presented includes solder acceptance, adhesion data, thermal analysis and SEM analysis.


RSC Advances ◽  
2015 ◽  
Vol 5 (95) ◽  
pp. 77760-77790 ◽  
Author(s):  
Venkata Krishna Rao R. ◽  
Venkata Abhinav K. ◽  
Karthik P. S. ◽  
Surya Prakash Singh

Conductive inks have been widely investigated in recent years due to their popularity in printed electronics (PE) and flexible electronics (FE).


2007 ◽  
Vol 10 (3) ◽  
pp. 212-218 ◽  
Author(s):  
Katsumi TANINO ◽  
Yoshiyuki YOKOYAMA ◽  
Satoshi FUJIKI ◽  
Yuuji YAMAMICHI

Sensors ◽  
2020 ◽  
Vol 20 (3) ◽  
pp. 841 ◽  
Author(s):  
Mauro Serpelloni ◽  
Edoardo Cantù ◽  
Michela Borghetti ◽  
Emilio Sardini

Printed electronics is an expanding research field that can reach the goal of reducing the environmental impact on electronics exploiting renewable and biodegradable materials, like paper. In our work, we designed and tested a new method for fabricating hybrid smart devices on cellulose substrates by aerosol jet printing (AJP) and photonic curing, also known as flash lamp annealing (FLA), capable to cure low temperature materials without any damage. Three different cellulose-based materials (chromatographic paper, photopaper, cardboard) were tested. Multilayer capability and SMDs (surface mount devices) interconnections are possible permitting high flexibility in the fabrication process. Electrical and geometrical tests were performed to analyze the behavior of printed samples. Resulted resistivities are 26.3 × 10−8 Ω⋅m on chromatographic paper, 22.3 × 10−8 Ω⋅m on photopaper and 13.1 × 10−8 Ω⋅m on cardboard. Profilometer and optical microscope evaluations were performed to state deposition quality and penetration of the ink in cellulose materials (thicknesses equal to 24.9, 28.5, and 51 μm respectively for chromatographic paper, photopaper, and cardboard). Furthermore, bending (only chromatographic paper did not reach the break-up) and damp environment tests (no significant variations in resistance) where performed. A final prototype of a complete functioning multilayer smart devices on cellulose 3D-substrate is shown, characterized by multilayers, capacitive sensors, SMDs interconnections.


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