Photonic Curing Explanation and Application to Printing Copper Traces on Low Temperature Substrates

2011 ◽  
Vol 2011 (1) ◽  
pp. 001040-001046 ◽  
Author(s):  
K. A. Schroder ◽  
Ian M. Rawson ◽  
Dave S. Pope ◽  
S. Farnsworth
Keyword(s):  
Thin Film ◽  
Low Temperature ◽  
Web Applications ◽  
Printed Electronics ◽  
Low Cost ◽  
Processing Technique ◽  
Ambient Atmosphere ◽  
Roll To Roll ◽  
Photonic Curing ◽  
The Cost

Photonic curing is a transient thin-film thermal processing technique using flashlamps. It was developed by NovaCentrix® and incorporated in the PulseForge® toolset to address the need of the printed electronics industry to process high temperature materials on low temperature substrates such as paper and plastic on a moving web. Applications include photovoltaics, displays, solid state lighting, thin film batteries, RFID tags, and printed circuits. The ability to substitute inexpensive and flexible substrates for expensive, rigid substrates while achieving similar performance can dramatically reduce the cost of the final product and enable new products. In this paper, we discuss the technology and mechanisms of the process and illustrate a case study of forming copper traces on plastic and paper in a roll-to-roll environment. Here, a low cost copper oxide ink is printed on plastic or paper and chemically reacted using pulsed light from the PulseForge tool to form highly conductive copper traces. This process is performed in an ambient atmosphere.

An Investigation onto Polydimethylsiloxane (PDMS) Printing Plate of Multiple Functional Solid Line by Flexographic

2013 ◽  
Vol 844 ◽  
pp. 158-161 ◽  
Author(s):  
M.I. Maksud ◽  
Mohd Sallehuddin Yusof ◽  
M. Mahadi Abdul Jamil
Keyword(s):  
Laser Ablation ◽  
Line Width ◽  
High Speed ◽  
Printed Electronics ◽  
Low Cost ◽  
Flexible Substrates ◽  
Large Area ◽  
Printing Plate ◽  
Roll To Roll ◽  
Printing Processes

Recently low cost production is vital to produce printed electronics by roll to roll manufacturing printing process like a flexographic. Flexographic has a high speed technique which commonly used for printing onto large area flexible substrates. However, the minimum feature sizes achieved with roll to roll printing processes, such as flexographic is in the range of fifty microns. The main contribution of this limitation is photopolymer flexographic plate unable to be produced finer micron range due to film that made by Laser Ablation Mask (LAMs) technology not sufficiently robust and consequently at micron ranges line will not be formed on the printing plate. Hence, polydimethylsiloxane (PDMS) is used instead of photopolymer. Printing trial had been conducted and multiple solid lines successfully printed for below fifty microns line width with no interference between two adjacent lines of the printed images.

Achieving Performance and Longevity with Butane-operated Low-temperature Solid Oxide Fuel Cells using Low-Cost Cu and CeO2 Catalysts

2021 ◽  
Author(s):  
Cam-Anh Thieu ◽  
Sungeun Yang ◽  
Ho-Il Ji ◽  
Hyoungchul Kim ◽  
Kyung Joong Yoon ◽  
...  
Keyword(s):  
Thin Film ◽  
Fuel Cells ◽  
Low Temperature ◽  
Solid Oxide Fuel Cells ◽  
High Efficiency ◽  
Operating Temperature ◽  
Low Cost ◽  
Solid Oxide ◽  
Oxide Fuel

Thin-film solid oxide fuel cells (TF-SOFCs) effectively lower the operating temperature of typical solid oxide fuel cells (SOFCs) below 600 °C, while maintaining high efficiency and using low-cost catalyst. But...

Flexible, Monolithically Integrated Cu(In,Ga)Se2 Thin-Film Solar Modules

2005 ◽  
Vol 865 ◽  
Author(s):  
Dirk Herrmann ◽  
Friedrich Kessler ◽  
Ulf Klemm ◽  
Robert Kniese ◽  
Theresa Magorian Friedlmeier ◽  
...  
Keyword(s):  
Thin Film ◽  
Production Process ◽  
Low Cost ◽  
Single Cells ◽  
Production Method ◽  
Flexible Substrates ◽  
Metal Foil ◽  
Monolithically Integrated ◽  
Glass Substrates ◽  
Roll To Roll

AbstractCIGS (Cu(In,Ga)Se2) thin-film solar modules on glass substrates are currently on the verge of commercialization. Entirely new application areas could be accessed with CIGS modules fabricated on thin and flexible non-glass substrates. Additionally, the roll-to-roll manufacturing of such flexible CIGS modules promises to be a low-cost production method. Different external Na supply methods and a vacuum-deposited buffer were investigated in this contribution, a sample of the challenges we face when modifying the standard, industrial CIGS module production process to the particular requirements of flexible substrates. Both metal foil substrates and polymer films are considered. Our excellent best results of above 14 % for single cells on titanium, more than 11% on polyimide, and around 7 % for modules on both substrates indicate our progress in developing flexible CIGS.

Letter: A low-cost low-temperature thin-film-transistor backplane based on oxide semiconductor

2012 ◽  
Vol 20 (4) ◽  
pp. 175 ◽  
Author(s):  
Linfeng Lan ◽  
Nana Xiong ◽  
Peng Xiao ◽  
Wen Shi ◽  
Miao Xu ◽  
...  
Keyword(s):  
Thin Film ◽  
Low Temperature ◽  
Low Cost ◽  
Thin Film Transistor ◽  
Oxide Semiconductor

Evaluation of PulseForge Tool for Processing Metallic Conductive Inks on Low Temperature Substrates Part II: Screen Inks

2010 ◽  
Vol 2010 (1) ◽  
pp. 000920-000923
Author(s):  
S. Farnsworth ◽  
I. Rawson ◽  
K. A. Schroder ◽  
D. Pope
Keyword(s):  
Low Temperature ◽  
Printed Electronics ◽  
Initial Evaluation ◽  
Functional Material ◽  
Conductive Inks ◽  
Device Development ◽  
Photonic Curing ◽  
Screen Print ◽  
Process Material ◽  
Screen Ink

At this event in 2009, the authors discussed the need for advanced tooling and materials for printed electronics device development and manufacturing. We went on to describe and evaluate a novel toolset called PulseForge® which is based on photonic curing and capable of drying and sintering metallic-based inks on low-temperature substrates in milliseconds. Example inks manufactured by NovaCentrix used in the initial evaluation were silver and copper-based inkjet inks, with nanoparticles as the functional material. These inks were only 100's of nm thick when printed and dried. As part of on-going work, the authors are now presenting the same toolset applied to thicker screen print inks of silver and copper. A PulseForge 3100 in 12-inch width configuration is used to process improved silver screen ink on PET, and a new copper-based screen ink on copy paper. The tools produce equal or improved results over oven processing. Additionally, we demonstrate the PulseForge tools can process material at speeds consistent with volume manufacturing.

Low temperature and high performance ZnSnO thin film transistors engineered by in-situ thermal manipulation

2022 ◽  
Author(s):  
Wengao Pan ◽  
Xiaoliang Zhou ◽  
Qingping Lin ◽  
Jie Chen ◽  
Lei Lu ◽  
...  
Keyword(s):  
Thin Film ◽  
Low Temperature ◽  
Thin Film Transistors ◽  
High Performance ◽  
Low Cost ◽  
High Mobility ◽  
Processing Temperature ◽  
Practical Application ◽  
Thermal Manipulation

Thin film transistors (TFT) with low cost, high mobility and low processing temperature are key enablers for practical application, which are always contradictory. In this work, we achieved high performance...

Recent advances in flexible perovskite solar cells

2015 ◽  
Vol 51 (79) ◽  
pp. 14696-14707 ◽  
Author(s):  
B. Susrutha ◽  
Lingamallu Giribabu ◽  
Surya Prakash Singh
Keyword(s):  
Thin Film ◽  
Solar Cells ◽  
Solar Cell ◽  
Low Cost ◽  
Perovskite Solar Cells ◽  
Large Area ◽  
Roll To Roll ◽  
Recent Developments ◽  
Reduced Dimension ◽  
Thin Film Photovoltaics

Flexible thin-film photovoltaics facilitate the implementation of solar devices into portable, reduced dimension, and roll-to-roll modules. In this review, we describe recent developments in the fabrication of flexible perovskite solar cells that are low cost and highly efficient and can be used for the fabrication of large-area and lightweight solar cell devices.

Low-Temperature Polycrystalline Silicon Thin-Film Transist or Technologies for System-on-Glass Displays

MRS Bulletin ◽  
2002 ◽  
Vol 27 (11) ◽  
pp. 881-886 ◽  
Author(s):  
Shuichi Uchikoga
Keyword(s):  
Thin Film ◽  
Low Temperature ◽  
Polycrystalline Silicon ◽  
Large Scale ◽  
Low Cost ◽  
Silicon Thin Film ◽  
Light Emitting ◽  
Light Emitting Devices ◽  
Large Scale Integration ◽  
Scale Integration

AbstractThe elimination of conventional peripheral LSI (large-scale integration) drivers is considered essential to the development of future low-cost, energy-efficient, lightweight, and thin displays. System-on-glass (SOG) displays are a type of display with various functional circuits integrated on a glass substrate. Low-temperature polycrystalline silicon (LTPS) thin-film transistors (TFTs) make the integration of circuits possible because they can be assembled into complex, high-current driver circuits. Furthermore, LTPS TFTs are attracting attention for driving organic light-emitting devices (OLEDs). This article introduces present and future LTPS TFT technologies for SOG displays.

CIMDW – A New Technique of Corona Ignited Micro-Discharge in Microwelding

2010 ◽  
Vol 126-128 ◽  
pp. 823-828
Author(s):  
Yunn Shiuan Liao ◽  
J.Y. Lin ◽  
Y.C. Chung ◽  
T.Y. Yang
Keyword(s):  
Low Cost ◽  
Welding Process ◽  
Weld Bead ◽  
Heat Affect Zone ◽  
Ambient Atmosphere ◽  
Temperature Plasma ◽  
Butt Welding ◽  
Hardness Tests ◽  
A New Technique ◽  
The Cost

Microtechnologies have been vigorously developed recently. Micro products have been widely used in many fields, for instance, the sensors in electronic, medical, optical and automotive applications. Thermocouples, which are used for temperature measurement, are usually fabricated by utilizing the joining technology of argon arc welding. However, the weld bead is so big that the conductivity and repeatability of temperature signals would be degraded. Laser welding may fix the weld bead problem, but the cost of equipment is relatively high. This study is about butt-welding thin brass wire of 250 m by mean of micro discharge. At first a low temperature plasma torch is formed to ignited arc, then discharge happens to complete the welding. Argon is added at ambient atmosphere during the welding process. The joined interfaces and heat affect zone of the welding is examined by optical and scanning electronic microscopies. Tensile and hardness tests as well as the microscopy examination indicate that this technology is feasible for thin brass welding. The features of this technology include low cost, easy to maneuver, and applicable in industry. This CIMDW technology offer choice for the applications of micro discharge in the field of microtechnology.

Sign in / Sign up

Export Citation Format

Share Document