scholarly journals Die Attach Process Defect Mitigation through Design Improvement on Anvil Block Tooling

2020 ◽  
pp. 1-6
Author(s):  
Rennier S. Rodriguez ◽  
Frederick Ray I. Gomez ◽  
Bryan Christian S. Bacquian
Keyword(s):  
Process Improvement ◽  
Design Improvement ◽  
Die Attach ◽  
Augmented Design ◽  
Selection Of

Process improvement through modification in the design of indirect material is one potential direction to improve the productivity during assembly manufacturing. In this paper, an augmented design of anvil block is presented to reduce the crumpled strips, leadframe bending and dents, uneven bonding of die, localized insufficient epoxy, and misaligned die encountered during the conversion and setup stage. The implementation of the augmented design improves the current assembly practice through eliminating the replacement of anvil block that is the cause of misalignment on the indexer handler of the die attach machine. Through this design, the selection of appropriate vacuum hole setup can be through the sliding insert only without pulling out the anvil block from the machine.

scholarly journals Glue Voids Reduction on QFN Device through Material and Process Improvement

2021 ◽  
pp. 15-19
Author(s):  
Edwin M. Graycochea Jr. ◽  
Endalicio D. Manalo ◽  
Rennier S. Rodriguez ◽  
Frederick Ray I. Gomez
Keyword(s):  
Process Optimization ◽  
Process Improvement ◽  
Machine Process ◽  
Stencil Printing ◽  
Main Contributor ◽  
Die Attach ◽  
Material Preparation

The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sintering glue which is a main contributor on the voids occurrence. Eventually, the glue voids were reduced to less than the allowed 5% limit. For future works, the learnings and configuration could be used on devices with similar requirement.

Proposed guidelines for treatment of recurrent failures for sustainability of results in the post-project improvement stage process

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Caio Melo Almeida ◽  
Fernando Oliveira Araujo ◽  
Chrystyane Gerth Silveira Abreu ◽  
Haydee Maria Correia da Silveira Batista
Keyword(s):  
Process Improvement ◽  
Process Performance ◽  
Mining Company ◽  
Improvement Project ◽  
Content Type ◽  
Stage Process ◽  
Improvement Programs ◽  
Low Performance ◽  
Methodological Aspects ◽  
Selection Of

PurposeThe maintenance of process improvement programs within organizations is not an easy task. Some processes do not maintain the results achieved with the improvement project and again present low performance shortly after completion of the project. This paper aims to identify the socio-technical causes responsible for the loss of process performance after applying improvement projects, in order to support the mitigation of the problem.Design/methodology/approachA systematic review of the literature was carried out, which allowed the selection of 28 articles. The empirical stage used the benchmarking technique, along a large Brazilian mining company with an international standard of production and quality. This organization has been using improvement projects for more than ten years.FindingsThe research complements the literature regarding the prioritization of the 26 identified failures and the identification of seven new failure factors and two resources. Findings in this study can be an inspiration for other organizations, considering the similarity of methodological aspects of improvement projects since internationally standardized methodologies such as Six Sigma, Lean, Kaizen and 5S are used.Originality/valueThe research presented a proposal of guidelines that corroborate to the mitigation of loss of process performance after improvement project.

scholarly journals Glass Die Ink Marking Media Selection for a Robust Glass Attach Process

2021 ◽  
pp. 110-115
Author(s):  
Jerome Dinglasan ◽  
Aiza Marie Agudon ◽  
Frederick Ray Gomez
Keyword(s):  
Semiconductor Device ◽  
Recognition System ◽  
Modern World ◽  
Process Yield ◽  
Process Robustness ◽  
Die Attach ◽  
Selection Of Variables ◽  
Scrap Reduction ◽  
Selection For ◽  
Selection Of

Glass material used on a semiconductor device for isolating currents are one of the new breakthroughs of the modern world. Challenges are inevitable due to its complex characteristics and unique appearance. The study focuses on the phenomenon of reject glass die unrecognized, picked and bonded by die attach machine on good units of the semiconductor quad-flat no-leads (QFN) device in focus. This QFN device utilizes glass die as interposer on two active dice that separates the dielectric current of each die. During die attach process, machine photo recognition system failed to recognize and detect the glass die reject marking due to its unique transparent design and will be attached on good units. Thus, resulting to gross rejection and low process yield. Practical solutions to prevent the said phenomenon are simulated and determined by performing selection of variables like the contrast of the reject mark related to the product structure and compatibility through statistical analysis. The improvement drives to promote process robustness and scrap reduction that will help the manufacturing to be competitive through innovative resolutions on problems.

scholarly journals Sputtering Physical Vapour Deposition (PVD) Coatings: A Critical Review on Process Improvement and Market Trend Demands

Coatings ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 402 ◽  
Author(s):  
Andresa Baptista ◽  
Francisco Silva ◽  
Jacobo Porteiro ◽  
José Míguez ◽  
Gustavo Pinto
Keyword(s):  
Process Improvement ◽  
Vapour Deposition ◽  
Chemical Vapour ◽  
Physical Vapour Deposition ◽  
Market Demand ◽  
Tribological Behaviour ◽  
Plasma Ionization ◽  
Wide Range ◽  
Industrial Context ◽  
Selection Of

Physical vapour deposition (PVD) is a well-known technology that is widely used for the deposition of thin films regarding many demands, namely tribological behaviour improvement, optical enhancement, visual/esthetic upgrading, and many other fields, with a wide range of applications already being perfectly established. Machining tools are, probably, one of the most common applications of this deposition technique, sometimes used together with chemical vapour deposition (CVD) in order to increase their lifespan, decreasing friction, and improving thermal properties. However, the CVD process is carried out at higher temperatures, inducing higher stresses in the coatings and substrate, being used essentially only when the required coating needs to be deposited using this process. In order to improve this technique, several studies have been carried out optimizing the PVD technique by increasing plasma ionization, decreasing dark areas (zones where there is no deposition into the reactor), improving targets use, enhancing atomic bombardment efficiency, or even increasing the deposition rate and optimizing the selection of gases. These studies reveal a huge potential in changing parameters to improve thin film quality, increasing as well the adhesion to the substrate. However, the process of improving energy efficiency regarding the industrial context has not been studied as deeply as required. This study aims to proceed to a review regarding the improvements already studied in order to optimize the sputtering PVD process, trying to relate these improvements with the industrial requirements as a function of product development and market demand.

Trait Based Modelling Approach for Selection of Elite Germplasm Accessions in Soybean [Glycine max (L). Merrill]

2021 ◽  
Author(s):  
K. Shruthi ◽  
R. Siddaraju ◽  
K. Naveena ◽  
T.M. Ramanappa ◽  
C. Gireesh ◽  
...  
Keyword(s):  
Random Forest ◽  
Linear Regression ◽  
Seed Yield ◽  
Crop Improvement ◽  
Regression Tree ◽  
Morphological Characters ◽  
Morphometric Traits ◽  
Random Forest Models ◽  
Augmented Design ◽  
Selection Of

Background: Identification of suitable factors that influence significantly to the response is crucial for the traits based breeding program to make a better decision about improvement in productivity. Multiple linear regression (MLR) is the benchmark method commonly using to identify suitable factors for crop improvement. It doesn’t work always due to stringent assumption (Multicollinearity, Linearity) behind the MLR model. Here we tried to develop an efficient model for the selection of major traits that contribute to seed yield in soybean by comparing different models.Methods: Field experiment was conducted using 98 soybean core population through augmented design.18 morphometric traits obtain from soybean core population were considered under the study as regressors.Multiple linear regression (MLR), Principle component Regression (PCR), Regression tree and Random Forest models were compared to select traits based on prediction accuracy.Result: All the models identified the number of pods per plant (NPP) has the most influencing variable to the soybean yield. However random forest has a much higher prediction power (RMSE=4.59, MAPE=0.18) compared to other models under study. The results of random forest revealed that the number of pods per plant, number of branches per plant and other associated characters like plant height at harvest as highly influencing traits for seed yield in soybean.Finally, tried to identify genotypesthat possess superiority about most influencing morphological characters on seed yield using cluster analysis.

Study on Thermochemical Iodine-Sulfur Cycle at JAERI

2004 ◽  
Author(s):  
Kaoru Onuki ◽  
Shinji Kubo ◽  
Seiji Kasahara ◽  
Shintaro Ishiyama ◽  
Hayato Nakajima ◽  
...  
Keyword(s):  
Hydrogen Production ◽  
Process Improvement ◽  
Large Scale ◽  
Sulfur Cycle ◽  
Side Reactions ◽  
Operation Technique ◽  
Energy Research ◽  
Promising Candidate ◽  
Representative Process ◽  
Selection Of

Japan Atomic Energy Research Institute (JAERI) has been conducting an R&D on thermochemical water-splitting processes of Iodine-Sulfur family, which is a promising candidate of heat-utilization process of High Temperature Gas-cooled Reactors. Present activity at JAERI covers the following three subjects, (a) closed-loop operation technique for stable and continuous hydrogen production by e.g. suppressing possible side reactions, (b) process improvement in terms of thermal efficiency of hydrogen production utilizing membrane technologies, and (c) selection of materials for constructing the large-scale plant mainly focusing on corrosion resistance in the representative process environments. Recent progress on these studies is briefly described.

Selection of critical processes for “process improvement”

2011 ◽  
Vol 2 (4) ◽  
pp. 356-370 ◽  
Author(s):  
Ashok Sarkar ◽  
Arup Ranjan Mukhopadhyay ◽  
Sadhan Kumar Ghosh
Keyword(s):  
Process Improvement ◽  
Selection Of

scholarly journals Silicon Die with Integrated Epoxy for Improved Interface Adhesion

2021 ◽  
pp. 50-53
Author(s):  
F. R. Gomez ◽  
R. Rodriguez
Keyword(s):  
Electronic Packaging ◽  
Die Design ◽  
Interface Adhesion ◽  
Die Attach ◽  
Epoxy Material ◽  
Packaging Industry ◽  
Thin Silicon ◽  
Augmented Design

Breakthroughs and innovations are constantly being developed in electronic packaging industry to address the manufacturing challenges and overcome existing assembly limitations. An augmented design of thin Silicon die is introduced to establish a robust and improved interface adhesion between the die and the die attach material during the die attach process. The wafer preparation flow is also presented. The realization of the augmented die design with integrated epoxy material would ultimately provide a robust connection and would mitigate the die attach related issues such delamination, die cracks and voids.

scholarly journals Seleksi Ketahanan Ubi Jalar Madu Genotipe F1 terhadap Penyakit Kudis (Sphaceloma batatas Saw.)

Agrikultura ◽  
2015 ◽  
Vol 26 (1) ◽  
Author(s):  
Fitri Widiantini ◽  
Endah Yulia ◽  
Aina Anna Roosda ◽  
Agung Karuniawan
Keyword(s):  
Sweet Potato ◽  
High Resistance ◽  
Economic Value ◽  
Potato Scab ◽  
Open Pollination ◽  
Sweet Potatoes ◽  
Local Varieties ◽  
Different Seasons ◽  
Augmented Design ◽  
Selection Of

ABSTRACTResistant Selection of Sweet Potato Genotypes F1 against Scab Disease (Sphaceloma batatas)Variety of sweet potato in Indonesia is very diversed which is an advantage to develop sweet potatovarieties. However, local sweet potato often replaced with higher economic value varieties. The aim of thisresearch was to determine the resistant ability of genotype F1 from open pollination of local sweet potatolandraces against scab disease (Sphaceloma batatas ). As much as 661 genotypes F1 were grown on researchplantation centre at Ciparanje, Faculty of Agriculture Universitas Padjadjaran. The experiment was doneusing randomized blocked augmented design. The result demonstrated that genotypes F1 as results ofcrossing over between local varieties of sweet potatoes had high resistance against scab. This wasdemonstrated by more than 50% of the assessed population were resistant to scab as showed by low value ofdiseases severity. However, growing those genotypes at different seasons and locations need to be done todetermine the resistance stability.Keywords: sweet potato, scab, Sphaceloma batatasABSTRAKVarietas lokal ubi jalar di Indonesia sangat beragam. Keragaman yang ada tersebut sangat bermanfaat dalampengembangan ubi jalar. Namun, varietas lokal semakin tergeser seiring dengan nilai ekonomi yang lebihmenguntungkan. Tujuan dari penelitian ini adalah untuk mngetahui ketahanan genotipe-genotipe F1 ubijalar madu hasil dari open pollination dari aksesi-aksesi ubi jalar lokal terhadap penyakit kudis (Sphacelomabatatas). Sebanyak 661 genotpe F1 beserta aksesinya digunakan dalam penelitian ini. Percobaan dilaksanakandi kebun percobaan Ciparanje Fakultas Pertanian Universitas Padjadjaran pada bulan Januari 2013-Juni2013. Percobaan disusun dengan menggunakan rancanga acak dengan perluasan (augmented design).Pengamatan dilakukan dengan menghitung intesitas serangan penyakit kudis dengan interval 30 hari. Hasilpercobaan menunjukkan bahwa genotipe-genotipe F1 yang diuji menunjukkan potensi ketahanan terhadapserangan penyakit kudis. Hal ini ditunjukkan dengan banyaknya genotipe ubi jalar yang relatif tahanterhadap serangan penyakit kudis. Lebih dari 50% dari genotipe F1 ubi jalar yang diuji tahan terhadapserangan penyakit kudis yang ditunjukkan dengan rendahnya nilai assessment serangan penyakit. Pengujiandi berbagai musim tanam dan lokasi perlu dilakukan untuk mengetahui kestabilan ketahanan yang dimilikoleh genotipe-genotipe F1 tersebut.Kata kunci: ubi jalar madu, kudis, Sphaceloma batatas

scholarly journals Die Crack Resolution through Pick-up Process Optimization for BGA Package

2021 ◽  
pp. 32-36
Author(s):  
R. Rodriguez ◽  
E. Graycochea Jr. ◽  
F. R. Gomez ◽  
E. Manalo
Keyword(s):  
Process Optimization ◽  
Process Improvement ◽  
Parameter Optimization ◽  
New Technologies ◽  
Semiconductor Industry ◽  
Ball Grid Array ◽  
Main Root ◽  
Root Cause ◽  
Die Attach ◽  
Bga Package

With the new devices and new technologies in the semiconductor industry are getting more challenging to process because issues are unavoidable especially on thin dies. The paper is focused on the improvement done on a ball grid array (BGA) substrate package assembly to address the quantity of rejection of die crack during die picking at the die attach process station. High pick force and high needle top height found out during the pick-up process is the main root cause of die crack. Parameter optimization particularly for die picking with the combination of pick force and needle top height parameter was done to eliminate this type of issue after the die attaches process. With the die attach process improvement, a reduction of 100 percent of die crack occurrence was successfully achieved. For future works, the improvement and learnings could be used for devices with similar constraints.

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