scholarly journals Glue Voids Reduction on QFN Device through Material and Process Improvement

2021 ◽  
pp. 15-19
Author(s):  
Edwin M. Graycochea Jr. ◽  
Endalicio D. Manalo ◽  
Rennier S. Rodriguez ◽  
Frederick Ray I. Gomez
Keyword(s):  
Process Optimization ◽  
Process Improvement ◽  
Machine Process ◽  
Stencil Printing ◽  
Main Contributor ◽  
Die Attach ◽  
Material Preparation

The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sintering glue which is a main contributor on the voids occurrence. Eventually, the glue voids were reduced to less than the allowed 5% limit. For future works, the learnings and configuration could be used on devices with similar requirement.

scholarly journals Die Crack Resolution through Pick-up Process Optimization for BGA Package

2021 ◽  
pp. 32-36
Author(s):  
R. Rodriguez ◽  
E. Graycochea Jr. ◽  
F. R. Gomez ◽  
E. Manalo
Keyword(s):  
Process Optimization ◽  
Process Improvement ◽  
Parameter Optimization ◽  
New Technologies ◽  
Semiconductor Industry ◽  
Ball Grid Array ◽  
Main Root ◽  
Root Cause ◽  
Die Attach ◽  
Bga Package

With the new devices and new technologies in the semiconductor industry are getting more challenging to process because issues are unavoidable especially on thin dies. The paper is focused on the improvement done on a ball grid array (BGA) substrate package assembly to address the quantity of rejection of die crack during die picking at the die attach process station. High pick force and high needle top height found out during the pick-up process is the main root cause of die crack. Parameter optimization particularly for die picking with the combination of pick force and needle top height parameter was done to eliminate this type of issue after the die attaches process. With the die attach process improvement, a reduction of 100 percent of die crack occurrence was successfully achieved. For future works, the improvement and learnings could be used for devices with similar constraints.

Rapid Process Optimization

2016 ◽  
Vol 32 (2) ◽  
pp. 172-177 ◽  
Author(s):  
Jennifer L. Wiler ◽  
Kelly Bookman ◽  
Derek B. Birznieks ◽  
Robert Leeret ◽  
April Koehler ◽  
...  
Keyword(s):  
Health Care ◽  
Length Of Stay ◽  
Process Optimization ◽  
Process Improvement ◽  
Care Delivery ◽  
Health Care Systems ◽  
Process Redesign ◽  
Rapid Process ◽  
Left Without Being Seen ◽  
Care Systems

Health care systems have utilized various process redesign methodologies to improve care delivery. This article describes the creation of a novel process improvement methodology, Rapid Process Optimization (RPO). This system was used to redesign emergency care delivery within a large academic health care system, which resulted in a decrease: (1) door-to-physician time (Department A: 54 minutes pre vs 12 minutes 1 year post; Department B: 20 minutes pre vs 8 minutes 3 months post), (2) overall length of stay (Department A: 228 vs 184; Department B: 202 vs 192), (3) discharge length of stay (Department A: 216 vs 140; Department B: 179 vs 169), and (4) left without being seen rates (Department A: 5.5% vs 0.0%; Department B: 4.1% vs 0.5%) despite a 47% increased census at Department A (34 391 vs 50 691) and a 4% increase at Department B (8404 vs 8753). The novel RPO process improvement methodology can inform and guide successful care redesign.

scholarly journals Ball Misplace Mitigation through Process Optimization of Advanced Leadframe Package

2020 ◽  
pp. 35-38
Author(s):  
Bryan Christian S. Bacquian ◽  
Frederick Ray I. Gomez ◽  
Edwin M. Graycochea Jr.
Keyword(s):  
Process Optimization ◽  
Parameter Optimization ◽  
Semiconductor Manufacturing ◽  
Manufacturing Industry ◽  
Solder Ball ◽  
Development Phase ◽  
Solder Paste ◽  
Stencil Printing ◽  
Printing Process ◽  
Centered Ball

One of the challenging assembly processes in semiconductor manufacturing industry is stencil printing using solder paste as direct material. With this technology, some issues were encountered during the development phase of an advanced leadframe device and one of which is the solder ball misplace or off-centered ball. This paper, hence, focused on addressing the ball misplace issue at stencil printing process. Comprehensive parameter optimization particularly on the print speed and print force was employed to eliminate or significantly reduce the ball misplace defect at stencil printing process. With this process optimization and improvement, a reduction of around 96 percent ball misplace occurrence was achieved.

scholarly journals Pick and Place Process Optimization for Thin Semiconductor Packages

2019 ◽  
pp. 1-9
Author(s):  
Rennier S. Rodriguez ◽  
Frederick Ray I. Gomez
Keyword(s):  
Process Optimization ◽  
Ball Grid Array ◽  
Innovative Approach ◽  
Die Attach ◽  
Bga Packages ◽  
Pick And Place ◽  
Thin Semiconductor ◽  
Early Production ◽  
Semiconductor Packages ◽  
Related Process

Nowadays, electronic manufacturers trend are to become thinner and thinner especially those electronic gadgets that is very handy and convenient on our daily necessity. Challenge with the leading manufacturers is the production and development of less size gadget yet with richness of available application and uses that we can work on with what can please its consumer for their convenience and satisfaction. As with the semiconductor company, correlation between becoming thinner versus manufacturing capability become significantly opposite, as the package become thinner the more complex its related process can be. This study covers innovative approach in die attach station on critical handling of thin die packages. Lessons and learning were documented from Ball Grid Array (BGA) packages as first to be evaluated with thin package requirements.  Also discussed herewith are documented defects and related issues during trials and die attach builds that has been a show stopper on its early production.

scholarly journals Silver Sintering for Silicon Carbide Die Attach: Process Optimization and Structural Modeling

2021 ◽  
Vol 11 (15) ◽  
pp. 7012
Author(s):  
Michele Calabretta ◽  
Alessandro Sitta ◽  
Salvatore Massimo Oliveri ◽  
Gaetano Sequenzia
Keyword(s):  
Silicon Carbide ◽  
Process Optimization ◽  
Acoustic Microscopy ◽  
Experimental Methodology ◽  
Uniaxial Tensile ◽  
Uniaxial Tensile Test ◽  
Element Analysis ◽  
Electric Parameter ◽  
Die Attach ◽  
Silver Sintering

The increasing demand in automotive markets is leading the semiconductor industries to develop high-performance and highly reliable power devices. Silicon carbide MOSFET chips are replacing silicon-based solutions through their improved electric and thermal capabilities. In order to support the development of these novel semiconductors, packaging technologies are evolving to provide enough reliable products. Silver sintering is one of the most promising technologies for die attach. Due to their superior reliability properties with respect to conventional soft solder compounds, dedicated reliability flow and physical analyses should be designed and employed for sintering process optimization and durability assessment. This paper proposes an experimental methodology to optimize the pressure value applied during the silver sintering manufacturing of a silicon carbide power MOSFET molded package. The evaluation of the best pressure value is based on scanning electron microscopy performed after a liquid-to-liquid thermal shock reliability test. Furthermore, the sintering layer degradation is monitored during durability stress by scanning the acoustic microscopy and electric measurement of a temperature sensitive electric parameter. Moreover, mechanical elastoplastic behavior is characterized by uniaxial tensile test for a bulk sample and finite element analysis is developed to predict the mechanical behavior as a function of void fraction inside sintering layer.

scholarly journals A Robust Approach of Maintaining Epoxy Position on Die Attach Process of Tapeless QFN Packages

2021 ◽  
pp. 109-114
Author(s):  
Jerome J. Dinglasan ◽  
Leandro D. Saria ◽  
Frederick Ray I. Gomez
Keyword(s):  
Design Optimization ◽  
Process Improvement ◽  
Innovative Approach ◽  
Great Role ◽  
Robust Approach ◽  
Die Attach ◽  
Current Design ◽  
Position Shift ◽  
Improved Design ◽  
Set Up

Epoxy quality contributes a great role in defining quality products of quad flat no lead multi row packages. In dealing with certain problems related to epoxy position shift caused by unoptimized design, innovation on the dispenser module is considered and focused at. This paper discusses the phenomenal issue of epoxy position shifting in die attach process and the solutions applied. The current design of dispenser module in die attach machine demonstrates flaws that need to be improved through design optimization. Innovative approach was applied, removing variables on the design that caused rejections during die attachment due to the shifted epoxy position. The improved design was able to address the issue as projected on the study, and helps not only the epoxy position performance, but also the set-up time of epoxy during syringe replacement. This design can be adapted by other manufacturing for process improvement and robustness.

scholarly journals Die Attach Process Defect Mitigation through Design Improvement on Anvil Block Tooling

2020 ◽  
pp. 1-6
Author(s):  
Rennier S. Rodriguez ◽  
Frederick Ray I. Gomez ◽  
Bryan Christian S. Bacquian
Keyword(s):  
Process Improvement ◽  
Design Improvement ◽  
Die Attach ◽  
Augmented Design ◽  
Selection Of

Process improvement through modification in the design of indirect material is one potential direction to improve the productivity during assembly manufacturing. In this paper, an augmented design of anvil block is presented to reduce the crumpled strips, leadframe bending and dents, uneven bonding of die, localized insufficient epoxy, and misaligned die encountered during the conversion and setup stage. The implementation of the augmented design improves the current assembly practice through eliminating the replacement of anvil block that is the cause of misalignment on the indexer handler of the die attach machine. Through this design, the selection of appropriate vacuum hole setup can be through the sliding insert only without pulling out the anvil block from the machine.

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