scholarly journals RSOB Shorting Defect Resolution through Looping Optimization and Ball Placement at Wirebond Process

2021 ◽  
pp. 34-38
Author(s):  
Norman S. Calma ◽  
Jonathan C. Pulido ◽  
Frederick Ray I. Gomez
Keyword(s):  
Parameter Optimization ◽  
Manufacturing Process ◽  
Packaging Industry ◽  
The Wire ◽  
Semiconductor Packaging

Wirebonding process is one of the most challenging assembly manufacturing process in semiconductor packaging industry. This paper discussed the wirebonding challenge and the solution to resolve the wire to die shorting on reverse stitch on ball (RSOB) and prevent irregular looping height for the substrate land grid array (LGA) device. Comprehensive parameter optimization was done particularly on the wirebond looping to ensure that no wire depression and no capillary hitting would occur wirebonding setup. Ultimately, the optimized wirebonding parameter prevented the occurrence of looping issues during the lot process.  For future works, the configuration and technique could be applied on packages with similar situation.

scholarly journals Wire Shorting Elimination through Wirebond Process Optimization of Semiconductor Sensor Device

2020 ◽  
pp. 10-14
Author(s):  
Anthony Moreno ◽  
Edwin Graycochea Jr. ◽  
Frederick Ray Gomez
Keyword(s):  
Process Optimization ◽  
Parameter Optimization ◽  
Manufacturing Process ◽  
Semiconductor Devices ◽  
Process Parameter ◽  
Process Parameter Optimization ◽  
Bill Of Materials ◽  
Semiconductor Sensor ◽  
Sensor Device ◽  
The Wire

New and upcoming semiconductor devices and technologies are getting more challenging in assembly manufacturing process due to many factors such as complex package layout, process capability and critical bill of materials. This paper focused on the mitigation of the top major assembly reject of a semiconductor sensor device, that is the wire-to-wire shorting issue at wirebonding process. Parameter optimization particularly the looping segment 1 parameter, as well as using a reverse stitch on ball (RSOB) were employed to eliminate the wire-to-wire defect in wirebonding process. Finally, with the process optimization and improvement, a reduction of 98 percent wire-to-wire shorting occurrence was attained.

scholarly journals Enhanced Wirebonding Technique on QFN Device with Critical Die Reference

2021 ◽  
pp. 57-61
Author(s):  
Jonathan C. Pulido ◽  
Frederick Ray I. Gomez
Keyword(s):  
Pattern Recognition ◽  
Parameter Optimization ◽  
Manufacturing Processes ◽  
Alignment Error ◽  
Packaging Industry ◽  
Alignment Errors ◽  
Semiconductor Packaging

Wirebonding is one of the most challenging assembly manufacturing processes in semiconductor packaging industry. This paper discussed the wirebonding challenge and the solution to mitigate misplaced ball issues and prevent pattern recognition alignment errors. Parameter optimization particularly on wirebond looping was done to ensure that the silicon die’s L-fiducial is visible and not obstructed by the wires, which is the operator point or die reference of the unit during wirebonding setup. Ultimately, the optimized wirebonding parameter prevented the pattern recognition alignment error and misplaced ball issues during the lot process.  For future works, the configuration and technique could be applied on packages with the similar situation.

The wire sweep analysis based on the evaluation of the bending and twisting moments for semiconductor packaging

2006 ◽  
Vol 83 (10) ◽  
pp. 1931-1939 ◽  
Author(s):  
Huang-Kuang Kung ◽  
Jeng-Nan Lee ◽  
Chin-Yu Wang
Keyword(s):  
The Wire ◽  
Semiconductor Packaging

Approaches for Measurement System Analysis Considering Randomness and Fuzziness

2020 ◽  
Vol 9 (2) ◽  
pp. 98-131
Author(s):  
Liang-Hsuan Chen ◽  
Chia-Jung Chang
Keyword(s):  
Measurement System ◽  
System Analysis ◽  
Sum Of Squares ◽  
Measurement System Analysis ◽  
Repeatability And Reproducibility ◽  
Packaging Industry ◽  
Relationship Of ◽  
Semiconductor Packaging ◽  
The Relationship ◽  
Fuzzy Random

For some quality inspection practices, subjective judgements based on the inspectors' experience and knowledge, such as visual inspection, may be required for some particular quality characteristics. This kind of measurement system, including its associated randomness and fuzziness, should be assessed by Measurement system analysis (MSA) before its application. For such purpose, this article represents observations with randomness and fuzziness from MSAs as fuzzy random variables, and then two pairs of descriptive parameters, i.e., expected value and variance, are derived. Then, the relationship of the total sum of squares of factors is proven to hold, so that fuzzy analysis of variance (FANOVA) in terms of gauge repeatability and reproducibility can be developed. The proposed approach has the advantage that FANOVA is developed based on the relationship of the total sum of squares of factors, considering randomness and fuzziness. A real case in the semiconductor packaging industry is used to demonstrate the applicability of the proposed approaches to MSA.

Wire Bond Shear Test Simulation on Sharp Groove Surface Bond Pad

2012 ◽  
Vol 622-623 ◽  
pp. 647-651 ◽  
Author(s):  
Z. Sauli ◽  
V. Retnasamy ◽  
S. Taniselass ◽  
A.H.M. Shapri ◽  
R. Vairavan
Keyword(s):  
Stress Response ◽  
Shear Test ◽  
Copper Wire ◽  
Gold Wire ◽  
Shear Tests ◽  
Groove Surface ◽  
Wire Bond ◽  
Packaging Industry ◽  
Semiconductor Packaging ◽  
Surface Bond

Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.

Fabrication of iron-rich Fe–Al intermetallics using the wire-arc additive manufacturing process

2015 ◽  
Vol 7 ◽  
pp. 20-26 ◽  
Author(s):  
Chen Shen ◽  
Zengxi Pan ◽  
Yan Ma ◽  
Dominic Cuiuri ◽  
Huijun Li
Keyword(s):  
Additive Manufacturing ◽  
Manufacturing Process ◽  
The Wire ◽  
Wire Arc Additive Manufacturing

Mechanism to Improve the Reliability of Cu Wire Bonding by Pd-Coating of the Wire

2016 ◽  
Author(s):  
Wentao Qin ◽  
Tom Anderson ◽  
George Chang ◽  
Harold Anderson ◽  
Denise Barrientos
Keyword(s):  
Corrosion Resistance ◽  
Wire Bonding ◽  
Reliability Improvement ◽  
Binary Phase Diagrams ◽  
Coated Wire ◽  
Bond Wire ◽  
The Wire ◽  
Semiconductor Packaging ◽  
Kinetics Of ◽  
Insight Into

Abstract Coating of the Cu bond wire with Pd has been a rather widely accepted method in semiconductor packaging to improve the wire bonding reliability. Based on comparison of a Cu bond wire and a Pd-coated Cu bond wire on AlCu pads that had passed HAST, new insight into the mechanism of the reliability improvement is gained. Our analysis showed the dominant Cu-rich intermetallics (IMC) were Cu3Al2 for the Cu wire, and (CuPdx)Al for the Pd-coated wire. The results have verified the Cu-rich IMC being suppressed by the Pd-coating, which has been extensively reported in literature. Binary phase diagrams of Al, Cu, and Pd indicate that the addition of Pd elevates the melting point and bond strength of (CuPdx)Al compared with CuAl that formed with the bare Cu wire. The improvements are expected to decrease the kinetics of phase transformation toward the more Cu-rich IMC. With the suppression of the Cu-rich IMC, the corrosion resistance of the wire bonding is enhanced and the wire bonding reliability improved. We find that Ni behaves thermodynamically quite similar to Pd in the ternary system of Cu wire bonding, and therefore possesses the potential to improve the corrosion resistance.

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