scholarly journals Enhanced Wirebonding Technique on QFN Device with Critical Die Reference

2021 ◽  
pp. 57-61
Author(s):  
Jonathan C. Pulido ◽  
Frederick Ray I. Gomez
Keyword(s):  
Pattern Recognition ◽  
Parameter Optimization ◽  
Manufacturing Processes ◽  
Alignment Error ◽  
Packaging Industry ◽  
Alignment Errors ◽  
Semiconductor Packaging

Wirebonding is one of the most challenging assembly manufacturing processes in semiconductor packaging industry. This paper discussed the wirebonding challenge and the solution to mitigate misplaced ball issues and prevent pattern recognition alignment errors. Parameter optimization particularly on wirebond looping was done to ensure that the silicon die’s L-fiducial is visible and not obstructed by the wires, which is the operator point or die reference of the unit during wirebonding setup. Ultimately, the optimized wirebonding parameter prevented the pattern recognition alignment error and misplaced ball issues during the lot process.  For future works, the configuration and technique could be applied on packages with the similar situation.

scholarly journals RSOB Shorting Defect Resolution through Looping Optimization and Ball Placement at Wirebond Process

2021 ◽  
pp. 34-38
Author(s):  
Norman S. Calma ◽  
Jonathan C. Pulido ◽  
Frederick Ray I. Gomez
Keyword(s):  
Parameter Optimization ◽  
Manufacturing Process ◽  
Packaging Industry ◽  
The Wire ◽  
Semiconductor Packaging

Wirebonding process is one of the most challenging assembly manufacturing process in semiconductor packaging industry. This paper discussed the wirebonding challenge and the solution to resolve the wire to die shorting on reverse stitch on ball (RSOB) and prevent irregular looping height for the substrate land grid array (LGA) device. Comprehensive parameter optimization was done particularly on the wirebond looping to ensure that no wire depression and no capillary hitting would occur wirebonding setup. Ultimately, the optimized wirebonding parameter prevented the occurrence of looping issues during the lot process.  For future works, the configuration and technique could be applied on packages with similar situation.

scholarly journals The Estimation of Angular Misalignments for Ultra Short Baseline Navigation Systems. Part II: Experimental Results

2013 ◽  
Vol 66 (5) ◽  
pp. 773-787 ◽  
Author(s):  
Hsin-Hung Chen
Keyword(s):  
Trial Data ◽  
Experimental Results ◽  
Experimental Result ◽  
Alignment Error ◽  
Navigation Systems ◽  
Analytical Prediction ◽  
Short Baseline ◽  
Sea Trial ◽  
Alignment Errors ◽  
Cross Track

An algorithm of alignment calibration for Ultra Short Baseline (USBL) navigation systems was presented in the companion work (Part I). In this part (Part II) of the paper, this algorithm is tested on the sea trial data collected from USBL line surveys. In particular, the solutions to two practical problems referred to as heading deviation and cross-track error in the USBL line survey are presented. A field experiment running eight line surveys was conducted to collect USBL positioning data. The numerical results for the sea trial data demonstrated that the proposed algorithm could robustly and effectively estimate the alignment errors. Comparisons of the experimental result with the analytical prediction of roll misalignment estimation in Part I is drawn, showing good agreement. The experimental results also show that an inappropriate estimation of roll alignment error will significantly degrade the quality of estimations of heading and pitch alignment errors.

Error Analysis by Square 3 x 3 Machining Method for Five-Axis Machining Centers

2020 ◽  
Author(s):  
Shigehiko Sakamoto ◽  
Atsushi Yokoyama ◽  
Kazumasa Nakayasu ◽  
Toshihiro Suzuki ◽  
Shinji Koike
Keyword(s):  
International Standards ◽  
Test Method ◽  
Accuracy Evaluation ◽  
Alignment Error ◽  
Machined Surface ◽  
Machining Center ◽  
Alignment Errors ◽  
Assembly Error ◽  
Five Axis ◽  
Machined Surfaces

Abstract The establishment of international standards for 5-axis control machining centers has been supported by the high interest of each country. Internationally, various accuracy inspection methods have been proposed and widely discussed. Accuracy measuring devices for these purposes have also been proposed. In 2014, inspection methods for 5-axis machines were published in ISO 10791-6 and 10791-7. In this research, we propose a test method to process 9 square faces as a new accuracy evaluation method. We simulate the influence of assembly error by the proposed square 3 × 3 machining method on the machined surface. By processing 9 square faces with different tool angle on the same plane, it was possible to evaluate the influence of assembly errors in the 5-axis machining center on the machined surface. Nine surfaces machined by the square 3 × 3 processing method cause differences in surface height due to alignment errors. In addition, nine machined surfaces become all diagonal not parallelism. The alignment errors of the 5-axis machining center is identified by evaluating the orientation of the machined surfaces. Specifically, we propose a newly method to measure the height difference of nine surfaces. Then, the possibility of identifying the alignment error of the 5-axis machining center using the measurement results is shown.

Approaches for Measurement System Analysis Considering Randomness and Fuzziness

2020 ◽  
Vol 9 (2) ◽  
pp. 98-131
Author(s):  
Liang-Hsuan Chen ◽  
Chia-Jung Chang
Keyword(s):  
Measurement System ◽  
System Analysis ◽  
Sum Of Squares ◽  
Measurement System Analysis ◽  
Repeatability And Reproducibility ◽  
Packaging Industry ◽  
Relationship Of ◽  
Semiconductor Packaging ◽  
The Relationship ◽  
Fuzzy Random

For some quality inspection practices, subjective judgements based on the inspectors' experience and knowledge, such as visual inspection, may be required for some particular quality characteristics. This kind of measurement system, including its associated randomness and fuzziness, should be assessed by Measurement system analysis (MSA) before its application. For such purpose, this article represents observations with randomness and fuzziness from MSAs as fuzzy random variables, and then two pairs of descriptive parameters, i.e., expected value and variance, are derived. Then, the relationship of the total sum of squares of factors is proven to hold, so that fuzzy analysis of variance (FANOVA) in terms of gauge repeatability and reproducibility can be developed. The proposed approach has the advantage that FANOVA is developed based on the relationship of the total sum of squares of factors, considering randomness and fuzziness. A real case in the semiconductor packaging industry is used to demonstrate the applicability of the proposed approaches to MSA.

Ultra-thin glasses for semiconductor packaging

2016 ◽  
Vol 2016 (1) ◽  
pp. 000293-000298
Author(s):  
Ruediger Sprengard ◽  
Matthias Jotz ◽  
Martin Letz ◽  
Lutz Parthier ◽  
Fredrik Prince ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
Laser Ablation ◽  
Semiconductor Manufacturing ◽  
Mechanical Stability ◽  
Manufacturing Processes ◽  
Position Accuracy ◽  
Semiconductor Packaging ◽  
Thick Glass

Abstract Glasses are homogeneous, many glasses have excellent dielectric properties at GHz frequencies and some have thermal expansions (CTE) which are close to silicon. Ultrathin glasses (UTG) with thicknesses of 25 μm to 200 μm (0.001 to 0.0079 inch) offer numerous options for packaging, integration and co-processing in semiconductor manufacturing processes. We introduce SCHOTT UTG including paths to further improve their mechanical stability and strength. We use laser ablation in 50μm thick glass and show via fabrication with a potential of mass manufacturing with via diameters of 30μm, 38μm pitch and a position accuracy of +/− 1μm. The structures are metallized using sputtering and electroplating which leads to hermetic, tight conducting through glass-vias (TGV).

Wire Bond Shear Test Simulation on Sharp Groove Surface Bond Pad

2012 ◽  
Vol 622-623 ◽  
pp. 647-651 ◽  
Author(s):  
Z. Sauli ◽  
V. Retnasamy ◽  
S. Taniselass ◽  
A.H.M. Shapri ◽  
R. Vairavan
Keyword(s):  
Stress Response ◽  
Shear Test ◽  
Copper Wire ◽  
Gold Wire ◽  
Shear Tests ◽  
Groove Surface ◽  
Wire Bond ◽  
Packaging Industry ◽  
Semiconductor Packaging ◽  
Surface Bond

Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.

scholarly journals 50 nm Scale Alignment Method for Hybrid Manufacturing Processes for Full 3D Structuring

2020 ◽  
Vol 21 (12) ◽  
pp. 2407-2417
Author(s):  
Ki-Hwan Jang ◽  
Hae-Sung Yoon ◽  
Hyun-Taek Lee ◽  
Eunseob Kim ◽  
Sung-Hoon Ahn
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Three Dimensional ◽  
Research Area ◽  
Manufacturing Processes ◽  
Alignment Error ◽  
Alignment Method ◽  
Major Research ◽  
Hybrid Processes

AbstractIn micro-/nano-scale, multi-material three-dimensional (3D), structuring has been a major research area for making various applications. To overcome dimensional and material limitations, several hybrid processes have been proposed. The hybrid processes were performed in the same or different numerically controlled stages. If the stages differed, the substrate was moved and locked to the stage before fabrication. During the locking, alignment error occurred. This error became problematic because this significantly compromised the quality of final structures. Here, an alignment method for a hybrid process consisted of a focused ion beam milling, aerodynamically focused nanoparticle printing, and micro-machining was developed. Two sets of collinear marks were placed at the edges of the substrate. Rotational and translational errors were calculated and compensated using the marks. Processes having different scales were bridged through this alignment method. Various materials were utilized, and accuracy was less than 50 nm when the length of the substrate was less than 13 mm. The alignment method was employed to fabricate a V-shaped structure and step-shaped structure using polymer, ceramic, and metal.

scholarly journals A Prospective Study to Investigate the Placement of Setup Skin Markings for Larger Breasted Women Undergoing External Beam Radiotherapy (RT) for Breast Cancer

2019 ◽  
pp. 99-122
Author(s):  
Chris Osam Doudoo ◽  
Neill Roberts ◽  
Emmanuel Amankwaa Frempong ◽  
Clement Edusa ◽  
Kwamena Beecham ◽  
...  
Keyword(s):  
Breast Cancer ◽  
External Beam Radiotherapy ◽  
Systematic Errors ◽  
Patient Treatment ◽  
P Value ◽  
Alignment Error ◽  
External Beam ◽  
Significant Difference ◽  
Portal Images ◽  
Alignment Errors

Background: The technique of placing all three skin marks (reference skin marks) on a single position during CT simulation for setup of patients undergoing conventional breast radiotherapy becomes a challenge when presented with larger breasted women (bra cup size ≥ D). A new way of using skin marks in setting these patients up has been developed where three skin marks are made on the patient (one on the sternum and two lateral skin marks more inferiorly beneath the breasts) for setup as against the departmental standard of using only a single skin mark on the sternum, and employing an SSD (Source to Skin Distance) technique. This study therefore reviewed the placement of the skin markings for larger breasted women undergoing external beam radiotherapy for breast cancer by quantifying treatment field alignment errors and setup errors between the two different setup techniques. Method: 36 patients were used in this study. Out of this number, 18 were setup using three reference skin marks and the remaining 18 were setup using one reference anterior skin mark. With an acceptable patient treatment field alignment error of 2 degrees, portal images (AP and lateral) of the different skin mark techniques were analysed for field alignment errors using an Iview GT system. More so, portal images (AP and lateral) of setup for both techniques were analysed for systematic (Σ) and random (σ) errors. Results:The AP images of the single skin mark setup and the three skin mark setup yielded no significant difference as they recorded a p- value (p<0.05) of 0.089 and 0.110 respectively when compared to the treatment field alignment threshold error of 2 degrees. The lateral images of the three skin mark also yielded no significant difference as a p- value (p<0.05) of 0.091 was recorded. The lateral images of the single skin mark yielded a significant difference with a p- value (p<0.05) of 0.026. Secondly, mean comparisons of the field alignment errors between the two setup techniques yielded no significant difference in the AP images as a p- value (p<0.05) of 0.089 was detected. On the contrary, a p- value (p<0.05) of 0.026 was recorded in the field alignment errors of the lateral images. This difference is significant. Lastly, random errors were reduced in all directions (AP- anterior-posterior, SI- superior-inferior and LR- Left-right) in the three skin mark setup (4.5mm AP, 4.9mm SI and 2.4mm LR) as compared to the single skin mark setup (4.7mm AP, 5.2mm SI and 2.6mm LR). Systematic errors were also reduced in the three skin mark setup (1.7mm AP and 1.8mm SI) compared to the single skin mark setup (2.0mm AP, 2.1mm SI). Systematic errors in the LR direction on the other hand increased from 2.0mm in the single skin mark to 2.2mm in the three skin marks. Conclusion For setup of larger breasted women undergoing external beam radiotherapy for breast cancer, the three skin mark setup technique is superior to the single skin mark setup technique.

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