In-orbit demonstration of an iodine electric propulsion system

Propulsion is a critical subsystem of many spacecraft1–4. For efficient propellant usage, electric propulsion systems based on the electrostatic acceleration of ions formed during electron impact ionization of a gas are particularly attractive5,6. At present, xenon is used almost exclusively as an ionizable propellant for space propulsion2–5. However, xenon is rare, it must be stored under high pressure and commercial production is expensive7–9. Here we demonstrate a propulsion system that uses iodine propellant and we present in-orbit results of this new technology. Diatomic iodine is stored as a solid and sublimated at low temperatures. A plasma is then produced with a radio-frequency inductive antenna, and we show that the ionization efficiency is enhanced compared with xenon. Both atomic and molecular iodine ions are accelerated by high-voltage grids to generate thrust, and a highly collimated beam can be produced with substantial iodine dissociation. The propulsion system has been successfully operated in space onboard a small satellite with manoeuvres confirmed using satellite tracking data. We anticipate that these results will accelerate the adoption of alternative propellants within the space industry and demonstrate the potential of iodine for a wide range of space missions. For example, iodine enables substantial system miniaturization and simplification, which provides small satellites and satellite constellations with new capabilities for deployment, collision avoidance, end-of-life disposal and space exploration10–14.

Simple and rapid gas sensing using a single-walled carbon nanotube field-effect transistor-based logic inverter

We design a gas sensor by combining two SWCNT-FET devices in an inverter configuration enabling a better system miniaturization together with a reduction of power consumption and ease of data processing.

Biosensors Technologies for Point-of-Care Testing – A Review

Chronic illnesses require continuous monitoring and medical intervention for efficient treatment to be achieved. Therefore, designing a responsive system that will reciprocate to the physicochemical changes may offer superior therapeutic activity In this respect, biosensors development, which offers constant, fast, selective and sensitive in situ monitoring is extremely important. The ability of biosensors miniaturization opens new technological pathways for the development of innovative approaches, which will be able to detect a wide range of compounds in the "multi-mode" system. Miniaturization and integration of important components result in many advantages: reducing the time of analysis and laboratory processes, automatization of measurements, compactness, and portability. Biosensing instruments also represent a very promising scientific way for construction new generation of wearable, portable and implantable bioelectronic devices for Point-Of-Care (POC) testing application. Biosensors also offer a powerful opportunity in early diagnosis and treatment of illness, which is an essential value in the case of POC testing. POC is mostly focused on the patient with chronic illness, where the continuous monitoring of analytes, is required to allow changing of the dosage and treatment period. In this review, we present the application of biosensing platforms in one chip, which can be used in wireless, wearable and swallowable sensors for POC diagnostic.

Application of Microfluidics in Process Intensification

Is it possible to miniaturize a chemical plant? Some strategies, such as the process intensification, sustain that the advancements in equipment and production techniques could substantially decrease the equipment size/production capacity ratio, energy consumption and waste generation, resulting in more economic and sustainable operations and consequently reducing the chemical plant size. However, large reductions of equipment volume represent a major challenge for the conventional technologies. In this context, Microfluidics represents a promising technology in the field of system miniaturization. Accordingly, the present research evaluated the concept of process intensification and its relationship with Microfluidics. Initially, the definition and the classification of process intensification were described, following by the explanation of the Microfluidics, highlighting scale-up strategies and examples using miniaturized systems. Afterward, a methodology for miniaturized devices development for process intensification using numerical simulations was shown. Finally, the conclusions are exposed.

The Package Becomes the System

The benefits of system miniaturization lower-cost, higher electrical performance and better thermal mechanical reliability, than the current approach of discrete component packaging have been discussed at length. Several technologies have been used to address these benefits. SOC, SiP, Fan-In and Fan Out and wafer level packages. Recently there has been much discussion about Fan Out Wafer Level packaging (FOWLP) to integrate the entire system in package. However, actual implementations fall short of a complete system in a package in that only few of the chips and some passives are currently integrated into the FOWLP. But what about the rest of the system? A true system also requires additional components not traditionally considered integrate-able into a package. These include antennas, batteries, thermal structures, RF, Optical, micro-electromechanical systems (MEMs), and micro sensor functions. The current FOWLP package technology as discussed by the media falls short of this type of system integration due to limitations in the number of chips that can be integrated and the lack of sufficient interconnect layers to support these functions in a system. 3D stacking has also been employed to improve the SiP by adding memory components. These implementations are limited to stacking of identical chips with through hole silicon vias (TSV) located remotely from any circuitry. Aurora Semiconductor will introduce a packaging technology where the package becomes the system. We call this technology 4DHSiP™ or 4D Heterogeneous System in package. 4DHSiP™ is a system miniaturization technology in contrast to system on chip (SOC) at the integrated circuit level and system in package stacked ICs and packages (SIP) at the module level. 4DHSiP™ is considered an inclusive system technology in which, SIP, thermal structures and batteries are considered as substantive technologies. 3D stacking is no longer limited by the location of the TSV within the stacked components. Heterogeneous multi-chip sub module layers can be stacked to accommodate additional system components. These layers, when interconnected, form the entire system. By stacking sub module layers, specific component types can be located on the top most layer as needed by specific function (e.g. Bio functions, Optical functions, Antennas). An example of this type of module stacking used to create an optical based system will be shown.4DHSiP™ is a new, emerging system concept where the device, package, and system board are miniaturized into a single system package including all the needed system functions. Such a single system package with multiple heterogeneous ICs provides all the system functions by co-design and fabrication of digital, radiofrequency (RF), optical, micro-electromechanical systems (MEMS) in either the IC or the system package. 4DHSiP™ combines the best on chip and off chip integration technologies to develop ultra-miniaturized, high-performance, multifunctional products. A significant benefit of this miniaturization is the elimination of multiple sockets and connectors currently used to connect sub-systems together. This ultra-miniaturization of multiple to mega functions, ultrahigh performance, low cost and high reliability will be the way systems are designed in the future to achieve More than Moore.

High Density Interposer – Challenges and Opportunities

Within “More than Moore” concepts interposer based packaging technologies, known as 2.5D/3D wafer level system integration, open up a wide range of miniaturized multi-functional system solutions. Pending of the final application dedicated interposer concepts have been developed for grabbing multiple active components, fabricated by different suppliers, using different technologies and materials, e.g. sensors, logic, radio frequency (RF) and memory-ICs, as well as passive devices, including antennas. In many cases the application of high density wiring, micro pillar (μ-pillar) interconnects as well as through silicon vias (TSVs) are required. Finally the interposer needs to provide the mechanical basement for system packages. In order to support system miniaturization and extension of system performance on one hand and to meet costs and time to market challenges on the other hand the development of modular interposer concepts as well as the application of dedicated basic interposer technologies is of high interest for R&D, prototyping and small volume applications. A short outline of high density interposer technologies developed and available at Fraunhofer IZM on 300mm substrates will be presented. Starting with a brief discussion of basic elements of interposers, several technology concepts developed and validated for high density interposer applications will be described. Challenges related to μ-pillar applications and high density wiring will be addressed and generic results will be presented. A high level comparison of challenges and opportunities will be shown and discussed. A brief outlook of future development work for system applications will be given.