High Density Interposer – Challenges and Opportunities

2015 ◽  
Vol 2015 (1) ◽  
pp. 000046-000049 ◽  
Author(s):  
Mathias Boettcher ◽  
Frank Windrich ◽  
M-J. Wolf
Keyword(s):  
System Integration ◽  
Functional System ◽  
High Density ◽  
Wafer Level ◽  
Active Components ◽  
Wide Range ◽  
Challenges And Opportunities ◽  
High Level ◽  
Silicon Vias ◽  
System Miniaturization

Within “More than Moore” concepts interposer based packaging technologies, known as 2.5D/3D wafer level system integration, open up a wide range of miniaturized multi-functional system solutions. Pending of the final application dedicated interposer concepts have been developed for grabbing multiple active components, fabricated by different suppliers, using different technologies and materials, e.g. sensors, logic, radio frequency (RF) and memory-ICs, as well as passive devices, including antennas. In many cases the application of high density wiring, micro pillar (μ-pillar) interconnects as well as through silicon vias (TSVs) are required. Finally the interposer needs to provide the mechanical basement for system packages. In order to support system miniaturization and extension of system performance on one hand and to meet costs and time to market challenges on the other hand the development of modular interposer concepts as well as the application of dedicated basic interposer technologies is of high interest for R&D, prototyping and small volume applications. A short outline of high density interposer technologies developed and available at Fraunhofer IZM on 300mm substrates will be presented. Starting with a brief discussion of basic elements of interposers, several technology concepts developed and validated for high density interposer applications will be described. Challenges related to μ-pillar applications and high density wiring will be addressed and generic results will be presented. A high level comparison of challenges and opportunities will be shown and discussed. A brief outlook of future development work for system applications will be given.

Advanced Silicon Interposer for High density and High Integration Electronic Packages

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 000865-000905
Author(s):  
SATORU KUMOCHI ◽  
Sumio Koiwa ◽  
Kosuke Suzuki ◽  
Yoshitaka Fukuoka
Keyword(s):  
System Integration ◽  
High Density ◽  
High Resistivity ◽  
Through Silicon Vias ◽  
Passive Device ◽  
Fine Pitch ◽  
Mems Technology ◽  
Cte Mismatch ◽  
Silicon Vias ◽  
Electrical Loss

As electronic product becomes smaller and lighter with an increasing number of function← the demand for high density and high integration becomes stronger. Interposers for system in package will became more and more important for advanced electronic systems. Interposers will be needed more complicated structure for 2.5D , 3D package and MEMS, OEMEMS new heterogeneous package structure Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wirring offer compelling benefits for 2.5D and 3D system integration; however, they are limited by high cost and high electrical loss. [1] This paper presents the demonstration of Silicon Interposers with fine pitch through Silicon vias(TSV),with embedded passive device. We have developed the TSV interposer with redistribution layers on both sides using MEMS technology, high aspect ratio deep etching technology and filled Cu plating with deep through holes for cost reduction and low electrical loss. The TSV interposer with 400μm thick high resistivity Si, obtained without backside processing use of carriers. Excellent through via reliability was demonstrated, due to double side thick polymer insulator that buffers the stress created by CTE mismatch between glass, copper vias and copper traces, and TSV at 200μm pitch passed 1000 thermal cycles from −55°C to 125°C. We have evaluated high frequency transmission characteristic of Si through hole by the measurement S21 parameter. Highly insulating TSV resulted in insertion loss of less than 1dB at 20GHz. Thin film SiN capacitor as embedded passive device was built in surface of TSV interposer by via first and via last method. The capacitance and leakage current of capacitor was measured and compared with two types of fabrication method.

scholarly journals C, N, P, S content of the Chlorophyta Chaetomorpha linum (Müller) Kützing in a vast high density mat of a Mediterranean non-tidal lagoon

2020 ◽  
pp. 38
Author(s):  
Mauro Lenzi ◽  
Marco Leporatti-Persiano ◽  
Paola Gennaro
Keyword(s):  
Low Frequency ◽  
Atomic Ratio ◽  
High Density ◽  
Labile Organic Matter ◽  
Data Set ◽  
Growth And Survival ◽  
P Limitation ◽  
Wide Range ◽  
Chaetomorpha Linum ◽  
High Level

In a Chaetomorpha linum high density mat extending over 300 hectares, between 2017 and 2019 samples were collected for C, N, P, S tissue content determination, biomass (b) was estimated, sediment samples collected for labile organic matter (LOM) determination, and water chemical-physical variables measured. The latter showed extreme conditions with a wide range of values ​​and with zero oxygen for long periods. N-NO3:SRP atomic ratio showed extreme P-limitation. Tissue macronutrients showed very variable values, highlighting a strong P-limitation and relatively high level of S. With exception of nitrogen, no significant differences were detected for each macronutrient between the months and between the stations, neither was any correlation found between macronutrients and LOM and b data-set. The growth and survival of the mat occurred despite the scarcity of P, which probably reached with very low frequency the surface layer of the mat, the one capable of performing photosynthesis, where it was quickly re-assimilated and utilised.

scholarly journals MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

2021 ◽  
Vol 7 (1) ◽  
Author(s):  
Hoa Thanh Le ◽  
Rubaiyet I. Haque ◽  
Ziwei Ouyang ◽  
Seung Woo Lee ◽  
Shelley I. Fried ◽  
...  
Keyword(s):  
Power Electronics ◽  
System Integration ◽  
Rf Mems ◽  
Mechanical Performance ◽  
Thermal Dissipation ◽  
Comprehensive Overview ◽  
Monolithically Integrated ◽  
Mems Fabrication ◽  
Wide Range ◽  
Challenges And Opportunities

AbstractMEMS inductors are used in a wide range of applications in micro- and nanotechnology, including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies set the boundary conditions for inductor design and their electrical and mechanical performance. This review provides a comprehensive overview of state-of-the-art MEMS technologies for inductor fabrication, presents recent advances in 3D additive fabrication technologies, and discusses the challenges and opportunities of MEMS inductors for two emerging applications, namely, integrated power electronics and neurotechnologies. Among the four top-down MEMS fabrication approaches, 3D surface micromachining and through-substrate-via (TSV) fabrication technology have been intensively studied to fabricate 3D inductors such as solenoid and toroid in-substrate TSV inductors. While 3D inductors are preferred for their high-quality factor, high power density, and low parasitic capacitance, in-substrate TSV inductors offer an additional unique advantage for 3D system integration and efficient thermal dissipation. These features make in-substrate TSV inductors promising to achieve the ultimate goal of monolithically integrated power converters. From another perspective, 3D bottom-up additive techniques such as ice lithography have great potential for fabricating inductors with geometries and specifications that are very challenging to achieve with established MEMS technologies. Finally, we discuss inspiring and emerging research opportunities for MEMS inductors.

The way of value of Correlation of genomic DNA microsatellite loci and live weight of Chukchi reindeer

2020 ◽  
pp. 27-32
Author(s):  
V. Dodokhov ◽  
N. Pavlova ◽  
T. Rumyantseva ◽  
L. Kalashnikova
Keyword(s):  
Microsatellite Markers ◽  
Agricultural Production ◽  
Live Weight ◽  
Biodiversity Loss ◽  
Tribal Community ◽  
High Germination ◽  
Wide Range ◽  
The Mean ◽  
High Level ◽  
Dna Microsatellite

The article presents the genetic characteristic of the Chukchi reindeer breed. The object of the study was of the Chukchi reindeer. In recent years, the number of reindeer of the Chukchi breed has declined sharply. Reduced reindeer numbers could lead to biodiversity loss. The Chukchi breed of deer has good meat qualities, has high germination viability and is adapted in adverse tundra conditions of Yakutia. Herding of the Chukchi breed of deer in Yakutia are engaged only in the Nizhnekolymsky district. There are four generic communities and the largest of which is the agricultural production cooperative of nomadic tribal community «Turvaurgin», which was chosen to assess the genetic processes of breed using microsatellite markers: Rt6, BMS1788, Rt 30, Rt1, Rt9, FCB193, Rt7, BMS745, C 143, Rt24, OheQ, C217, C32, NVHRT16, T40, C276. It was found that microsatellite markers have a wide range of alleles and generally have a high informative value for identifying of genetic differences between animals and groups of animal. The number of identified alleles is one of the indicators of the genetic diversity of the population. The total number of detected alleles was 127. The Chukchi breed of deer is characterized by a high level of heterozygosity, and the random crossing system prevails over inbreeding in the population. On average, there were 7.9 alleles (Na) per locus, and the mean number of effective alleles (Ne) was 4.1. The index of fixation averaged 0.001. The polymorphism index (PIC) ranged from 0.217 to 0.946, with an average of 0.695.

3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging

2014 ◽  
Author(s):  
A. Orozco ◽  
N.E. Gagliolo ◽  
C. Rowlett ◽  
E. Wong ◽  
A. Moghe ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Fault Isolation ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Current Location ◽  
Geometrical Information ◽  
Magnetic Field Imaging ◽  
Silicon Vias ◽  
Non Destructive ◽  
Field Imaging

Abstract The need to increase transistor packing density beyond Moore's Law and the need for expanding functionality, realestate management and faster connections has pushed the industry to develop complex 3D package technology which includes System-in-Package (SiP), wafer-level packaging, through-silicon-vias (TSV), stacked-die and flex packages. These stacks of microchips, metal layers and transistors have caused major challenges for existing Fault Isolation (FI) techniques and require novel non-destructive, true 3D Failure Localization techniques. We describe in this paper innovations in Magnetic Field Imaging for FI that allow current 3D mapping and extraction of geometrical information about current location for non-destructive fault isolation at every chip level in a 3D stack.

COVID-19 Outbreak Prediction with Machine Learning

2020 ◽  
Author(s):  
Sina Faizollahzadeh Ardabili ◽  
Amir Mosavi ◽  
Pedram Ghamisi ◽  
Filip Ferdinand ◽  
Annamaria R. Varkonyi-Koczy ◽  
...  
Keyword(s):  
Machine Learning ◽  
Prediction Models ◽  
Fuzzy Inference ◽  
Control Measures ◽  
Future Research ◽  
Complex Nature ◽  
Inference System ◽  
Wide Range ◽  
Standard Models ◽  
High Level

Several outbreak prediction models for COVID-19 are being used by officials around the world to make informed-decisions and enforce relevant control measures. Among the standard models for COVID-19 global pandemic prediction, simple epidemiological and statistical models have received more attention by authorities, and they are popular in the media. Due to a high level of uncertainty and lack of essential data, standard models have shown low accuracy for long-term prediction. Although the literature includes several attempts to address this issue, the essential generalization and robustness abilities of existing models needs to be improved. This paper presents a comparative analysis of machine learning and soft computing models to predict the COVID-19 outbreak as an alternative to SIR and SEIR models. Among a wide range of machine learning models investigated, two models showed promising results (i.e., multi-layered perceptron, MLP, and adaptive network-based fuzzy inference system, ANFIS). Based on the results reported here, and due to the highly complex nature of the COVID-19 outbreak and variation in its behavior from nation-to-nation, this study suggests machine learning as an effective tool to model the outbreak. This paper provides an initial benchmarking to demonstrate the potential of machine learning for future research. Paper further suggests that real novelty in outbreak prediction can be realized through integrating machine learning and SEIR models.

CRIMINOLOGICAL FEATURES OF CORRUPTION-RELATED CRIMES IN THE FUEL AND ENERGY COMPLEX

2020 ◽  
pp. 23-27
Author(s):  
Сергей Иванович Вележев ◽  
Антон Михайлович Седогин
Keyword(s):  
Legal Protection ◽  
Criminal Activity ◽  
Criminal Cases ◽  
Law Enforcement Agencies ◽  
Energy Complex ◽  
Significant Damage ◽  
Study Results ◽  
Wide Range ◽  
Illegal Activities ◽  
High Level

В представленной статье авторами рассматриваются вопросы уголовно-правовой охраны топливно-энергетического комплекса Российской Федерации от преступных проявлений, в том числе от коррупционной противоправной деятельности должностных лиц. Такие действия причиняют значительный ущерб нормальному функционированию предприятий топливно-энергетического комплекса. Авторами приводятся результаты исследования некоторых криминологических характеристик должностных лиц, совершивших преступления коррупционного характера. Дан анализ причин и условий, способствующих совершению вышеуказанных противоправных действий. Определена типовая модель преступника для данной категории преступлений и его характеристики: в первую очередь, это высокий уровень компетентности, специальное образование и т. д. Авторами отмечается высокий уровень латентной преступности в данной отрасли. Предложены некоторые пути профилактики данной категории правонарушений. Исследование проводилось на основе анализа конкретных уголовных дел, возбужденных следственными органами по результатам оперативно-розыскной деятельности правоохранительных органов. In the article the authors consider the issues of criminal and legal protection of the fuel and energy complex of the Russian Federation from criminal activity including corrupt illegal practices of officials. The authors cite the results of some criminological characteristics study of the fuel and energy complex staff committed corruption crimes. As a result of these illegal actions significant damage is caused to the normal functioning of the fuel and energy enterprises. Such officials` actions determine not only a wide range of other illegal activities, but also lead to public outcry and discredit the industry as a whole. The analysis of the reasons and conditions contributing to the above illegal actions commission is given. A typical model of a criminal for a given crime category and its characteristics are determined. First of all it is a high level competence, special education, etc. A high level of latent crime in this industry is shown. The study results are presented on the example of specific criminal cases initiated by the investigating authorities based on the results of the operation detection activities of law enforcement agencies. Some ways of preventing this category of offenses are proposed.

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