scholarly journals The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint

2020 ◽  
Vol 10 (24) ◽  
pp. 8935
Author(s):  
Peng Xue ◽  
Jianzhi Tao ◽  
Peng He ◽  
Weimin Long ◽  
Sujuan Zhong
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Aging Treatment ◽  
Interfacial Microstructure ◽  
Growth Constant ◽  
Nd Addition ◽  
Excellent Mechanical Property ◽  
Surface Active ◽  
Cu3sn Imcs ◽  
Effect Of Surface

In this study, the effect of appropriate Nd addition on improving the high-temperature reliability of Sn-3.8Ag-0.7Cu (SAC387)/Cu solder joint after aging treatment was investigated. The interfacial microstructure of solder joint was refined with proper addition of Nd. This phenomenon could be explained as the adsorbing-hindering effect of surface-active Nd atoms which blocked the growth of brittle intermetallic compounds (IMCs) in the solder joint. Theoretical analysis indicated that 0.05 wt. % addition of Nd could distinctly decrease the growth constant of Cu6Sn5 IMCs and slightly decrease the growth constant of Cu3Sn IMCs respectively. The shear force of SAC387-0.05Nd/Cu solder joint was evidently improved compared with the origin solder joint. In addition, SAC387-0.05Nd/Cu solder joint maintained excellent mechanical property compared with SAC387/Cu solder joint even after 1440 h aging treatment.

Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition

2011 ◽  
Vol 509 (25) ◽  
pp. 7152-7161 ◽  
Author(s):  
Guang Zeng ◽  
Songbai Xue ◽  
Lili Gao ◽  
Liang Zhang ◽  
Yuhua Hu ◽  
...  
Keyword(s):  
Rare Earth ◽  
Solder Joint ◽  
Interfacial Microstructure ◽  
Microstructure And Properties ◽  
Nd Addition

Interfacial Microstructure and Joint Strength of Sn-Ag and Sn-Ag-Cu Lead Free Solders Reflowed on Cu/Ni-P/Au Metallization

2006 ◽  
Vol 512 ◽  
pp. 355-360
Author(s):  
Akio Hirose ◽  
Tomoyuki Hiramori ◽  
Mototaka Ito ◽  
Yoshiharu Tanii ◽  
Kojiro F. Kobayashi
Keyword(s):  
Solder Joint ◽  
Interfacial Reaction ◽  
Reaction Layer ◽  
Joint Strength ◽  
Aging Treatment ◽  
Interfacial Microstructure ◽  
Interfacial Reaction Layer ◽  
Solder Balls ◽  
Lead Free Solders ◽  
Electroless Ni

Sn-3.5Ag (Sn-Ag) and Sn-3.5Ag-0.75Cu (Sn-Ag-Cu) solder balls were reflowed on electroless Ni-P/Au plated Cu pad with varying thickness of Au layer (0 to 500nm). In the Sn-Ag solder joint, a P-rich layer including voids, which resulted from Ni diffusion from the Ni-P plating to form Ni3Sn4 interfacial reaction layer, formed at the interface regardless of Au plating thickness. This caused the degradation of the joint strength. On the contrary, the Sn-Ag-Cu solder joint had no continuous P-rich layer formed and showed a higher joint strength than the Sn-Ag solder joint in the case of Au plating of 50nm or less. Cu alloying to the solder promote the formation of (Cu, Ni)6Sn5 instead to Ni3Sn4 as the interfacial reaction layer. The (Cu, Ni)6Sn5 reaction layer can suppress the diffusion of Ni from the N-P plating and thereby inhibit the formation of the P-rich layer. However, in the case of thick Au plating of 250nm or more, a thin P-rich layer formed at the interface even in the Sn-Ag-Cu solder joint and the joint strength was degraded. Au dissolving into the solder from the Au plating during the reflow process may encourage the diffusion of Ni from the Ni-P plating into the solder. As a result, the Sn-Ag-Cu solder joints with 50nm Au coating provided the best joint strength, although its joint strength considerably degraded after the aging treatment at 423K.

Creep Properties and Interfacial Microstructure of SiC Whisker Reinforced Si3N4

1989 ◽  
Vol 170 ◽  
Author(s):  
Håkan A. Swan ◽  
Colette O'meara
Keyword(s):  
High Temperature ◽  
Creep Resistance ◽  
Interfacial Microstructure ◽  
Deformation Mechanisms ◽  
Amorphous Films ◽  
Creep Tests ◽  
Creep Properties ◽  
High Temperature Exposure ◽  
Temperature Exposure

AbstractPreliminary creep tests were performed on SiC whisker reinforced and matrix Si3N4 material fabricated by the NPS technique. The material was extensively crystallised in the as received material, leaving only thin amorphous films surrounding the grains. No improvement in the creep resistance could be detected for the whisker reinforced material. The deformation mechanisms were found to be that of cavitation in the form of microcracks, predominantly at the whisker/matrix interfaces, and the formation of larger cracks. Extensive oxidation of the samples, as a result of high temperature exposure to air, was observed for the materials tested at 1375°C.

Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Jianing Wang ◽  
Jieshi Chen ◽  
Zhiyuan Zhang ◽  
Peilei Zhang ◽  
Zhishui Yu ◽  
...  
Keyword(s):  
Solder Joint ◽  
Single Crystal ◽  
Microstructure Evolution ◽  
Thermal Aging ◽  
Interfacial Layer ◽  
Aging Treatment ◽  
Growth Behavior ◽  
Reflow Process ◽  
Content Type ◽  
Ni Substrate

Purpose The purpose of this article is the effect of doping minor Ni on the microstructure evolution of a Sn-xNi (x = 0, 0.05 and 0.1 wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment. Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of interfacial layer was different due to the different mechanism of element diffusion of the two substrates. The PC Ni substrate mainly provided Ni atoms through grain boundary diffusion. The Ni3Sn4 phase of the Sn0.05Ni/PC Ni joint was finer, and the diffusion flux of Sn and Ni elements increased, so the Ni3Sn4 layer of this joint was the thickest. The SC Ni substrate mainly provided Ni atoms through the lattice diffusion. The Sn0.1Ni/SC Ni joint increases the number of Ni atoms at the interface due to the doping of 0.1Ni (wt.%) elements, so the joint had the thickest NiSn4 layer. Design/methodology/approach The effects of doping minor Ni on the microstructure evolution of an Sn-xNi (x = 0, 0.05 and 0.1 Wt.%)/Ni (Poly-crystal/Single-crystal abbreviated as PC Ni/SC Ni) solder joint during reflow and aging treatment was investigated in this study. Findings Results showed that the intermetallic compounds (IMCs) of the interfacial layer of Sn-xNi/PC Ni joints were Ni3Sn4 phase, while the IMCs of Sn-xNi/SC Ni joints were NiSn4 phase. After the reflow process and thermal aging of different joints, the growth behavior of the interfacial layer was different due to the different mechanisms of element diffusion of the two substrates. Originality/value In this study, the effect of doping Ni on the growth and formation mechanism of IMCs of the Sn-xNi/Ni (single-crystal) solder joints (x = 0, 0.05 and 0.1 Wt.%) was investigated.

Influence of High Temperature Annealing on Microstructure Evolution of Ni-24Fe-14Cr-8Mo Superalloy

2021 ◽  
Vol 904 ◽  
pp. 117-123
Author(s):  
Yi Cui ◽  
Yun Fei Zhang ◽  
Yan Guang Han ◽  
Da Lv
Keyword(s):  
High Temperature ◽  
Microstructure Evolution ◽  
Testing Machine ◽  
Aging Treatment ◽  
Growth Patterns ◽  
High Temperature Annealing ◽  
Rockwell Hardness ◽  
Hardness Testing ◽  
X Ray Diffraction ◽  
X Ray

The effect of high temperature annealing on microstructure evolution of Ni-24Fe-14Cr-8Mo alloy was investigated through Optical Microscopy (OM), Scanning Electron Microscopy (SEM), X-Ray Diffraction (XRD) and Rockwell Hardness Testing Machine. Three kinds of grain growth patterns were found at different annealing temperatures due to carbides precipitation and dissolution. After a combination of high temperature annealing and aging treatment, the hardness versus time curves performed a parabolic pattern. The highest hardness was achieved under 1070°C/60 minutes treatment, and the desirable annealing time should be 60 minutes to 90 minutes.

Martensite decomposition during post-heat treatments and the aging response of near-α Ti–6Al–2Sn–4Zr–2Mo (Ti-6242) titanium alloy processed by selective laser melting (SLM)

2021 ◽  
pp. 2050018
Author(s):  
Haiyang Fan ◽  
Yahui Liu ◽  
Shoufeng Yang
Keyword(s):  
Titanium Alloy ◽  
High Temperature ◽  
Titanium Alloys ◽  
Selective Laser Melting ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Aging Treatment ◽  
Water Quenching ◽  
Laser Melting ◽  
Aging Response

Ti–6Al–2Sn–4Zr–2Mo (Ti-6242), a near-[Formula: see text] titanium alloy explicitly designed for high-temperature applications, consists of a martensitic structure after selective laser melting (SLM). However, martensite is thermally unstable and thus adverse to the long-term service at high temperatures. Hence, understanding martensite decomposition is a high priority for seeking post-heat treatment for SLMed Ti-6242. Besides, compared to the room-temperature titanium alloys like Ti–6Al–4V, aging treatment is indispensable to high-temperature near-[Formula: see text] titanium alloys so that their microstructures and mechanical properties are pre-stabilized before working at elevated temperatures. Therefore, the aging response of the material is another concern of this study. To elaborate the two concerns, SLMed Ti-6242 was first isothermally annealed at 650[Formula: see text]C and then water-quenched to room temperature, followed by standard aging at 595[Formula: see text]C. The microstructure analysis revealed a temperature-dependent martensite decomposition, which proceeded sluggishly at [Formula: see text]C despite a long duration but rapidly transformed into lamellar [Formula: see text] above the martensite transition zone (770[Formula: see text]C). As heating to [Formula: see text]C), it produced a coarse microstructure containing new martensites formed in water quenching. The subsequent mechanical testing indicated that SLM-built Ti-6242 is excellent in terms of both room- and high-temperature tensile properties, with around 1400 MPa (UTS)[Formula: see text]5% elongation and 1150 MPa (UTS)[Formula: see text]10% elongation, respectively. However, the combination of water quenching and aging embrittled the as-built material severely.

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