A new approach to low-temperature bonding for fine pitch chip-on-flex technology

Author(s):  
Su-Tsai Lu
Author(s):  
Steffen Bickel ◽  
Iuliana Panchenko ◽  
Wieland Wahrmund ◽  
Volker Neumann ◽  
Jorg Meyer ◽  
...  

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 335
Author(s):  
Gyuwon Jeong ◽  
Dong-Yurl Yu ◽  
Seongju Baek ◽  
Junghwan Bang ◽  
Tae-Ik Lee ◽  
...  

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.


2020 ◽  
Vol 10 (1) ◽  
Author(s):  
Chongshan Yin ◽  
Qicheng Liu ◽  
Qing Liu

Abstract How to convert heat energy into other forms of usable energy more efficiently is always crucial for our human society. In traditional heat engines, such as the steam engine and the internal combustion engine, high-grade heat energy can be easily converted into mechanical energy, while a large amount of low-grade heat energy is usually wasted owing to its disadvantage in the temperature level. In this work, for the first time, the generation of mechanical energy from both high- and low-temperature steam is implemented by a hydrophilic polymer membrane. When exposed to water vapor with a temperature ranging from 50 to 100 °C, the membrane repeats rolling from one side to another. In nature, this continuously rolling of membrane is powered by the steam, like a miniaturized “steam engine”. The differential concentration of water vapor (steam) on the two sides of the membrane generates the asymmetric swelling, the curve, and the rolling of the membrane. In particular, results suggest that this membrane based “steam engine” can be powered by the steam with a relatively very low temperature of 50 °C, which indicates a new approach to make use of both the high- and low-temperature heat energy.


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