scholarly journals A New Material for High‐Temperature Lead‐Free Actuators

2013 ◽  
Vol 23 (47) ◽  
pp. 5881-5886 ◽  
Author(s):  
Ahmed Kursumovic ◽  
Emmanuel Defay ◽  
Oon Jew Lee ◽  
Chen‐Fong Tsai ◽  
Zhenxing Bi ◽  
...  
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
New Material

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

Rutting Treatment Technology of Asphalt Pavement of Abrupt Slope Section in Heavy Load and High Temperature Zone

2011 ◽  
Vol 287-290 ◽  
pp. 858-861
Author(s):  
Hui Wang ◽  
Zhou Qing Zhao ◽  
Jian Zeng
Keyword(s):  
High Temperature ◽  
High Performance ◽  
Polyester Fibre ◽  
Asphalt Mixture ◽  
Good Control ◽  
Treatment Technology ◽  
Heavy Load ◽  
Test Road ◽  
Overlay Design ◽  
New Material

Aiming at the characteristics of pavement rutting damage of test road under the condition of heavy load and abrupt slope, an overlay design scheme and a new overlay material with high performance was proposed. The new material is PG82 modified asphalt SMA-13 added polyester fibre which can significantly improve the high temperature performance of asphalt mixture under severe environment, and its strength and crack resistance are superior to normal SMA-13. Tracking survey of test road shows that the pavement performances keeps good and rutting is under good control. Therefore those measurements are successful and can be a reference to similar projects.

scholarly journals Reliability of High Temperature and Vibration in Sn3.5Ag and Sn0.7Cu Lead-free Solders

2012 ◽  
Vol 19 (3) ◽  
pp. 31-36 ◽  
Author(s):  
Yong-Ho Ko ◽  
Taek-Soo Kim ◽  
Young-Kyu Lee ◽  
Sehoo Yoo ◽  
Chang-Woo Lee
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solders

Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

2012 ◽  
Vol 21 (5) ◽  
pp. 629-637 ◽  
Author(s):  
Ales Kroupa ◽  
Dag Andersson ◽  
Nick Hoo ◽  
Jeremy Pearce ◽  
Andrew Watson ◽  
...  
Keyword(s):  
High Temperature ◽  
Lead Free

A high temperature stable piezoelectric strain of KNN-based ceramics

2018 ◽  
Vol 6 (41) ◽  
pp. 19967-19973 ◽  
Author(s):  
Zhenyong Cen ◽  
Yu Huan ◽  
Wei Feng ◽  
Yan Yu ◽  
Peiyao Zhao ◽  
...  
Keyword(s):  
High Temperature ◽  
Solid State ◽  
Solid State Reaction ◽  
Piezoelectric Ceramics ◽  
Solid State Reaction Method ◽  
Lead Free ◽  
Conventional Solid State Reaction ◽  
Reaction Method ◽  
Piezoelectric Strain

Lead-free (1 − x)(0.96K0.46Na0.54Nb0.98Ta0.02O3–0.04Bi0.5(Na0.82K0.18)0.5ZrO3)–xCaZrO3 ((1 − x)(0.96KNNT–0.04BNKZ)–xCZ) piezoelectric ceramics were prepared by the conventional solid-state reaction method.

Modeling and Design of High Temperature Silicon Carbide DMOSFET Based Medium Power DC-DC Converter

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000144-000151
Author(s):  
Siddharth Potbhare ◽  
Akin Akturk ◽  
Neil Goldsman ◽  
James M. McGarrity ◽  
Anant Agarwal
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
High Efficiency ◽  
Schottky Diodes ◽  
Power Converter ◽  
Electronic Systems ◽  
High Temperature Electronics ◽  
New Material ◽  
Silicon Power Devices ◽  
Relationship Of

Silicon Carbide (SiC) is a promising new material for high power high temperature electronics applications. SiC Schottky diodes are already finding wide acceptance in designing high efficiency power electronic systems. We present TCAD and Verilog-A based modeling of SiC DMOSFET, and the design and analysis of a medium power DC-DC converter designed using SiC power DMOSFETs and SiC Schottky diodes. The system is designed as a 300W boost converter with a 12V input and 24V/36V outputs. The SiC power converter is compared to another designed with commercially available Silicon power devices to evaluate power dissipation in the DMOSFETs, transient response of the system and its conversion efficiency. SiC DMOSFETs are characterized at high temperature by developing temperature dependent TCAD and Verilog-A models for the device. Detailed TCAD modeling allows probing inside the device for understanding the physical processes of transport, whereas Verilog-A modeling allows us to define the complex relationship of interface traps and surface physics that is typical to SiC DMOSFETs in a compact analytical format that is suitable for inclusion in commercially available circuit simulators.

“Turning ceramic on its head” – a polymer based packaging system for operation over 175°C

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000111-000115
Author(s):  
Piers R. Tremlett
Keyword(s):  
High Temperature ◽  
Electronic Packaging ◽  
Lead Free ◽  
Harsh Environment ◽  
Sensor Systems ◽  
Packaging System

A polymer based electronic packaging system has been developed that is capable of operating at temperatures over 175°C and up to 225°C. This system is being developed to be a lead free, non-hermetic and able to deliver miniature or functionally dense circuits. It will be suitable for sensor systems where amplification, signal digitisation and autonomy are important whilst operating in a harsh environment such as high temperature.

Examination of Microstructure of Cement Composite Material for Renovation of Horizontal Structures

2019 ◽  
Vol 808 ◽  
pp. 103-108
Author(s):  
Lenka Mészárosová ◽  
Vít Černý ◽  
Rostislav Drochytka ◽  
Winfried Malorny
Keyword(s):  
Thermal Conductivity ◽  
Composite Material ◽  
High Temperature ◽  
Surface Temperature ◽  
Cement Composite ◽  
Volume Weight ◽  
Coefficient Of Thermal Conductivity ◽  
New Material ◽  
Properties Of Materials ◽  
Low Volume

Development of new material is focused on modification of properties of materials with silicate binder so that these could be used for renovation of horizontal structures of high-temperature devices and at the same time contribute to reduction of heat transportation of constructions with higher surface temperature (in this case 200 and 500 °C). Main requirements for this material is low volume weight and low coefficient of thermal conductivity. This paper assesses influence of exposition to higher temperatures on microstructure.

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