Meso ‐Substituted Boron‐dipyrromethene Compounds: Synthesis, Tunable Solid‐state Emission, and Application in Blue‐Driven LEDs

Cadmium telluride has become increasingly important in a number of technological applications, particularly in the area of laser-optical components and solid state devices, Microstructural characterizations of the material have in the past been somewhat limited because of the lack of suitable sample preparation and thinning techniques. Utilizing a modified jet thinning apparatus and a potassium dichromate-sulfuric acid thinning solution, a procedure has now been developed for obtaining thin contamination-free samples for TEM examination.

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The Collagenic Molecular Structural Unit of Solid State Complexes

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100066449 ◽

1971 ◽

Vol 29 ◽

pp. 478-479

Author(s):

Kenneth M. Richter ◽

John A. Schilling

Keyword(s):

Molecular Weight ◽

Solid State ◽

Structural Unit ◽

X Ray Diffraction ◽

X Ray ◽

Naoh Treatment

The structural unit of solid state collagen complexes has been reported by Porter and Vanamee via EM and by Cowan, North and Randall via x-ray diffraction to be an ellipsoidal unit of 210-270 A. length by 50-100 A. diameter. It subsequently was independently demonstrated by us in dog tendon, dermis, and induced complexes. Its detailed morphologic, dimensional and molecular weight (MW) aspects have now been determined. It is pear-shaped in long profile with m diameters of 57 and 108 A. and m length of 263 A. (Fig. 1, tendon, KMnO4 fixation, Na-tungstate; Fig. 2a, schematic of unit in long, C, and x-sectional profiles of its thin, xB, and bulbous, xA portions; Fig. 2b, tendon essentially unmodified by ether and 0.4 N NaOH treatment, Na-tungstate). The unit consists of a uniquely coild cable, c, of ṁ 22.9 A. diameter and length of 2580-3316 A. The cable consists of three 2nd-strands, s, each of m 10.6 A.

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Structure-property relations of liquid crystalline polymers

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100127013 ◽

1987 ◽

Vol 45 ◽

pp. 460-463

Author(s):

Linda C. Sawyer

Keyword(s):

Solid State ◽

Liquid Crystalline ◽

Structural Model ◽

Crystalline Polymer ◽

Liquid Crystalline Polymers ◽

Mechanical Anisotropy ◽

Structure Property ◽

Preparation Methods ◽

Crystalline Polymers ◽

Extended Chain

Recent liquid crystalline polymer (LCP) research has sought to define structure-property relationships of these complex new materials. The two major types of LCPs, thermotropic and lyotropic LCPs, both exhibit effects of process history on the microstructure frozen into the solid state. The high mechanical anisotropy of the molecules favors formation of complex structures. Microscopy has been used to develop an understanding of these microstructures and to describe them in a fundamental structural model. Preparation methods used include microtomy, etching, fracture and sonication for study by optical and electron microscopy techniques, which have been described for polymers. The model accounts for the macrostructures and microstructures observed in highly oriented fibers and films.Rod-like liquid crystalline polymers produce oriented materials because they have extended chain structures in the solid state. These polymers have found application as high modulus fibers and films with unique properties due to the formation of ordered solutions (lyotropic) or melts (thermotropic) which transform easily into highly oriented, extended chain structures in the solid state.

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Microstructural Variations in Melt-Spun Rapidly Solidified Ribbons

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100117340 ◽

1985 ◽

Vol 43 ◽

pp. 54-55

Author(s):

L. A. Bendersky ◽

W. J. Boettinger

Keyword(s):

Solid State ◽

Processing Parameters ◽

Heat Extraction ◽

Solid State Reactions ◽

Careful Examination ◽

Ion Milling ◽

Melt Spun ◽

Wheel Side ◽

Rapidly Solidified ◽

Heat Extraction Rate

Rapid solidification produces a wide variety of sub-micron scale microstructure. Generally, the microstructure depends on the imposed melt undercooling and heat extraction rate. The microstructure can vary strongly not only due to processing parameters changes but also during the process itself, as a result of recalescence. Hence, careful examination of different locations in rapidly solidified products should be performed. Additionally, post-solidification solid-state reactions can alter the microstructure.The objective of the present work is to demonstrate the strong microstructural changes in different regions of melt-spun ribbon for three different alloys. The locations of the analyzed structures were near the wheel side (W) and near the center (C) of the ribbons. The TEM specimens were prepared by selective electropolishing or ion milling.

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Si(Li) detector for microanalysis cooled by thermoelectric device

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s042482010013331x ◽

1992 ◽

Vol 50 (2) ◽

pp. 1736-1737

Author(s):

Shaul Barkan

Keyword(s):

Solid State ◽

Liquid Nitrogen ◽

Thermoelectric Device ◽

Peltier Cooler ◽

Complicated Process ◽

The Common

Cooling down solid state detecors, with other different way then liquid Nitrogen, is a goal of many vendors and customers since the invention of these detectors. THe disadvantage of the common way of liquid Nitrogen is first the inavailibility of the LN in many uses (like space military and any other applications that are not done inside a well organize Laboratory). The use of LN also considers as a Labor consumer in addition to the big dewar that has to be added to any detector for storing the LN, the boiling of the LN, may cause microphonics problesm and the refiling of the dewar in many Labs is a complicated process due to inconvenience location of the microscope.In this paper I will show a spectra result of 10mm2 SiLi detector for microanalysis use, cooled by peltier cooler. The peltier cooler has the advantage of non-microphonics and non-labor needed (like adding LN to the dewar).

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Current Status of Solid-State X-Ray Systems

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100117789 ◽

1985 ◽

Vol 43 ◽

pp. 158-161

Author(s):

Martin Peckerar ◽

Anastasios Tousimis

Keyword(s):

Solid State ◽

Electric Fields ◽

Spectral Lines ◽

Current Status ◽

Mobile Charge ◽

Electron Hole ◽

X Ray ◽

Sensing Systems ◽

Transmission Electron ◽

Electron Microscopes

Solid state x-ray sensing systems have been used for many years in conjunction with scanning and transmission electron microscopes. Such systems conveniently provide users with elemental area maps and quantitative chemical analyses of samples. Improvements on these tools are currently sought in the following areas: sensitivity at longer and shorter x-ray wavelengths and minimization of noise-broadening of spectral lines. In this paper, we review basic limitations and recent advances in each of these areas. Throughout the review, we emphasize the systems nature of the problem. That is. limitations exist not only in the sensor elements but also in the preamplifier/amplifier chain and in the interfaces between these components.Solid state x-ray sensors usually function by way of incident photons creating electron-hole pairs in semiconductor material. This radiation-produced mobile charge is swept into external circuitry by electric fields in the semiconductor bulk.

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Transmission Electron Microscopy of an Aluminum-Silver-Stainless Steel Solid State Bond

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100117832 ◽

1985 ◽

Vol 43 ◽

pp. 172-173

Author(s):

M. J. Carr ◽

J. F. Shewbridge ◽

T. O. Wilford

Keyword(s):

Electron Microscopy ◽

Transmission Electron Microscopy ◽

Solid State ◽

Specimen Preparation ◽

Dimensional Control ◽

Tem Analysis ◽

Metal Parts ◽

Dissimilar Metal ◽

Transmission Electron ◽

Short Time

Strong solid state bonds are routinely produced between physical vapor deposited (PVD) silver coatings deposited on sputter cleaned surfaces of two dissimilar metal parts. The low temperature (200°C) and short time (10 min) used in the bonding cycle are advantageous from the standpoint of productivity and dimensional control. These conditions unfortunately produce no microstructural changes at or near the interface that are detectable by optical, SEM, or microprobe examination. Microstructural problems arising at these interfaces could therefore easily go undetected by these techniques. TEM analysis has not been previously applied to this problem because of the difficulty in specimen preparation. The purpose of this paper is to describe our technique for preparing specimens from solid state bonds and to present our initial observations of the microstructural details of such bonds.

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