Electrical characteristics of coplanar waveguide devices incorporating nonlinear dielectric thin films of SrTiO3 and Sr0.5Ba0.5TiO3

1995 ◽  
Vol 9 (6) ◽  
pp. 306-310 ◽  
Author(s):  
A. T. Findikoglu ◽  
Q. X. Jia ◽  
D. W. Reagor ◽  
X. D. Wu
1995 ◽  
Vol 31 (21) ◽  
pp. 1814-1815 ◽  
Author(s):  
A.T. Findikoglu ◽  
D.W. Reagor ◽  
Q.X. Jia ◽  
X.D. Wu

1995 ◽  
Vol 401 ◽  
Author(s):  
A. T. Findikoglu ◽  
Q. X. Jia ◽  
D. W. Reagor ◽  
X. D. Wu

AbstractWe have prepared electrically tunable and active microwave devices incorporating (superconducting YBa2Cu3O7-x)/(nonlinear dielectric SrTiO3) or (normal metal Au)/(nonlinear dielectric Sr0.5Ba0.5TiO3) bilayers. The dielectric layer thickness for these samples varied between 0.5 μm and 2 μm. The top electrode layer for each sample was patterned into a coplanar waveguide device structure. We have configured these devices as voltage-tunable resonators, voltage-tunable phase shifters, voltage-tunable mixers, and voltage-tunable filters. Under dc voltage bias, these prototype devices have exhibited up to 30% resonant frequency modulation, about 1°/mm-GHz phase shift, more than 40 dB change in mixed microwave power, and finetunable symmetric filter profile with less than 2% bandwidth and more than 15% adaptive range.


2016 ◽  
Vol 498 (1) ◽  
pp. 47-51 ◽  
Author(s):  
Hiroyuki Odagawa ◽  
Koshiro Terada ◽  
Hiroaki Nishikawa ◽  
Takahiko Yanagitani ◽  
Yasuo Cho

2018 ◽  
Author(s):  
K. A. Rubin ◽  
W. Jolley ◽  
Y. Yang

Abstract Scanning Microwave Impedance Microscopy (sMIM) can be used to characterize dielectric thin films and to quantitatively discern film thickness differences. FEM modeling of the sMIM response provides understanding of how to connect the measured sMIM signals to the underlying properties of the dielectric film and its substrate. Modeling shows that sMIM can be used to characterize a range of dielectric film thicknesses spanning both low-k and medium-k dielectric constants. A model system consisting of SiO2 thin films of various thickness on silicon substrates is used to illustrate the technique experimentally.


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