Cyclic etching of silicon oxide using NF 3 /H 2 remote plasma and NH 3 gas flow

Author(s):  
You Jung Gill ◽  
Doo San Kim ◽  
Hong Seong Gil ◽  
Ki Hyun Kim ◽  
Yun Jong Jang ◽  
...  
Keyword(s):  
Gas Flow ◽  
1999 ◽  
Vol 565 ◽  
Author(s):  
Y. Shimogaki ◽  
S. W. Lim ◽  
E. G. Loh ◽  
Y. Nakano ◽  
K. Tada ◽  
...  

AbstractLow dielectric constant F-doped silicon oxide films (SiO:F) can be prepared by adding fluorine source, like as CF4 to the conventional PECVD processes. We could obtain SiO:F films with dielectric constant as low as 2.6 from the reaction mixture of SiH4/N2 O/CF4. The structural changes of the oxides were sensitively detected by Raman spectroscopy. The three-fold ring and network structure of the silicon oxides were selectively decreased by adding fluorine into the film. These structural changes contribute to the decrease ionic polarization of the film, but it was not the major factor for the low dielectric constant. The addition of fluorine was very effective to eliminate the Si-OH in the film and the disappearance of the Si-OH was the key factor to obtain low dielectric constant. A kinetic analysis of the process was also performed to investigate the reaction mechanism. We focused on the effect of gas flow rate, i.e. the residence time of the precursors in the reactor, on growth rate and step coverage of SiO:F films. It revealed that there exists two species to form SiO:F films. One is the reactive species which contributes to increase the growth rate and the other one is the less reactive species which contributes to have uniform step coverage. The same approach was made on the PECVD process to produce low-k C:F films from C2F4, and we found ionic species is the main precursor to form C:F films.


2012 ◽  
Vol 206 (23) ◽  
pp. 4814-4821 ◽  
Author(s):  
H. Caquineau ◽  
L. Aiche ◽  
H. Vergnes ◽  
B. Despax ◽  
B. Caussat

2007 ◽  
Vol 35 (3) ◽  
pp. 527-533 ◽  
Author(s):  
Cristian Paduraru ◽  
Kurt H. Becker ◽  
Abe Belkind ◽  
Jose L. Lopez ◽  
Y. Aranda Gonzalvo

1997 ◽  
Vol 485 ◽  
Author(s):  
G. Beaucarne ◽  
J. Poortmans ◽  
M. Caymax ◽  
J. Nijs ◽  
R. Mertens

AbstractIn this paper, a method to obtain by CVD Si layers on silicon oxide with the desired grain size is described, involving nucleation control through the growth parameters. Nucleation experiments are carried out with a hydrogen - dichlorosilane - HCl ambient at high temperature. The nucleus density is observed to drop to low values at a threshold HCl-flow. A qualitative explanation using concepts from atomistic nucleation theory is proposed. The effect of addition of diborane to the gas flow is investigated and appears to be small or non-existent . Finally, preliminary results of a thin-film crystalline silicon solar cell process applied on such layers are given to illustrate the potential of such layers.


2019 ◽  
Vol 21 (6) ◽  
pp. 064007
Author(s):  
H J YEOM ◽  
D H CHOI ◽  
Y S LEE ◽  
J H KIM ◽  
D J SEONG ◽  
...  

2009 ◽  
Vol 1181 ◽  
Author(s):  
Jason L. Johnson ◽  
Yongho Choi ◽  
Ant Ural

AbstractWe experimentally demonstrate a simple and efficient approach for silicon oxide nanowire growth by implanting Fe+ ions into thermally grown SiO2 layers on Si wafers and subsequently annealing in argon and hydrogen to nucleate silicon oxide nanowires. We study the effect of implantation dose and energy, growth temperature, and H2 gas flow on the SiOx nanowire growth. We find that sufficiently high implant dose, high growth temperature, and the presence of H2 gas flow are crucial parameters for silicon oxide nanowire growth. We also demonstrate the patterned growth of silicon oxide nanowires in localized areas by lithographic patterning and etching of the implanted SiO2 substrates before growth. This works opens up the possibility of growing silicon oxide nanowires directly from solid substrates, controlling the location of nanowires at the submicron scale, and integrating them into nonplanar three-dimensional nanoscale device structures.


2005 ◽  
Vol 23 (4) ◽  
pp. 911-916 ◽  
Author(s):  
S. C. Kang ◽  
J. Y. Hwang ◽  
N.-E. Lee ◽  
K. S. Joo ◽  
G. H. Bae

1999 ◽  
Vol 567 ◽  
Author(s):  
D. Wolfe ◽  
K. Flock ◽  
R. Therrien ◽  
R. Johnson ◽  
B. Rayner ◽  
...  

ABSTRACTA remote plasma enhanced-metal organic chemical vapor deposition (RPE-MOCVD) process was developed for the preparation of non-crystalline (ZrO2)x-(SiO2)1−x (x ≤ 0.5) alloys, targeting the compound composition ZrSiO4with k ∼ 12.5. Shifts in Si LVV and Zr LMM AES energies with respect to elemental values showed that the deposited film was a fully-oxidized zirconium/silicon alloy. FTIR results were consistent with AES, and a Zr-O-Si bonding mode was identified in the spectra. The films were amorphous before and after RTA at 900°C for 30 sec, as monitored via RHEED. Optical absorption measurements indicated the onset of band-to-band transitions at an energy of approximately 6 eV. Finally, C-V testing showed that the films were insulating.


1983 ◽  
Vol 29 ◽  
Author(s):  
Gary A. West ◽  
Arunava Gupta

ABSTRACTFilms of silicon nitride have been deposited using a continuous wave CO2 laser to excite gaseous mixtures of silane and ammonia. A typical deposition rate is 150Å/min. The hydrogen film content and its dependence on the substrate deposition temperature are similar to that observed for plasma CVD silicon nitride. The CO2 laser CVD films are silicon rich with a Si/N ratio = 1.2 at a NH3/SiH4 gas flow ratio of 1000. Conformal step coverage is observed on patterned silicon oxide features.


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