Possibilities of Integrating Surface Treatment of Bonding Parts in the Adhesive Bonding Process

1984 ◽  
pp. 257-266 ◽  
Author(s):  
Klaus Ruhsland
Keyword(s):  
Surface Treatment ◽  
Adhesive Bonding ◽  
Bonding Process

scholarly journals Silicon-Quartz Microcapillary Opto-Fluidic Platform Obtained by CMOS-Compatible Die to Wafer 200 mm Dual Bonding Process

Proceedings ◽  
2018 ◽  
Vol 2 (13) ◽  
pp. 1018
Author(s):  
Giuseppe Fiorentino ◽  
Ben Jones ◽  
Sophie Roth ◽  
Edith Grac ◽  
Murali Jayapala ◽  
...  
Keyword(s):  
Adhesive Bonding ◽  
System Analysis ◽  
Quartz Substrate ◽  
Microfluidic System ◽  
Bonding Process ◽  
Microfluidic Channels ◽  
Fully Integrated ◽  
Lab On Chip ◽  
Human Blood Cells ◽  
On Chip

A composite, capillary-driven microfluidic system suitable for transmitted light microscopy of cells (e.g., red and white human blood cells) is fabricated and demonstrated. The microfluidic system consists of a microchannels network fabricated in a photo-patternable adhesive polymer on a quartz substrate, which, by means of adhesive bonding, is then connected to a silicon microfluidic die (for processing of the biological sample) and quartz die (to form the imaging chamber). The entire bonding process makes use of a very low temperature budget (200 °C). In this demonstrator, the silicon die consists of microfluidic channels with transition structures to allow conveyance of fluid utilizing capillary forces from the polymer channels to the silicon channels and back to the polymer channels. Compared to existing devices, this fully integrated platform combines on the same substrate silicon microfluidic capabilities with optical system analysis, representing a portable and versatile lab-on-chip device.

Surface treatment for adhesive bonding of carbon fibre-poly(etherether ketone) composites

1991 ◽  
Vol 10 (6) ◽  
pp. 335-338 ◽  
Author(s):  
P. Davies ◽  
C. Courty ◽  
N. Xanthopoulos ◽  
H. -J. Mathieu
Keyword(s):  
Carbon Fibre ◽  
Surface Treatment ◽  
Adhesive Bonding

Vacuum Adhesive Bonding and Stress Isolation for MEMS Resonant Pressure Sensor Package

2011 ◽  
Vol 694 ◽  
pp. 896-900 ◽  
Author(s):  
Yu Xin Li ◽  
De Yong Chen ◽  
Jun Bo Wang
Keyword(s):  
Pressure Sensor ◽  
Bonding Strength ◽  
Adhesive Bonding ◽  
Thermal Stresses ◽  
Time Pressure ◽  
Bonding Temperature ◽  
Bonding Process ◽  
Temperature Drift ◽  
Stress Isolation ◽  
Sensor Package

This paper presents a method of low temperature adhesive bonding and stress isolation for MEMS resonant pressure sensor hermetic packaging using non-photosensitive benzo-cyclo-butene (BCB) from Dow Co. According to the bonding process, pre-bake time, pumping time, pressure placed on the sensor and the thickness of crosslink layer are the most important factors. Stress isolation is designed to minimize thermal stresses to the resonant pressure sensor package. Experimental results show that this bonding process is a viable for MEMS resonant pressure sensor with the bonding temperature below 250°C, measured bonding strength more than 30MPa, the temperature drift less than 0.05%/°C in the range of -40°C to 70°C(10% of that without stress isolation), and the bonding strength maintains well after thermal treatments, handling, bench testing and implantations.

scholarly journals Surface activation of High Impact Polystyrene substrate using dynamic atmospheric pressure plasma

2019 ◽  
Vol 4 (1) ◽  
pp. 80-87
Author(s):  
Gergely Juhász ◽  
Miklós Berczeli ◽  
Zoltán Weltsch
Keyword(s):  
Surface Treatment ◽  
Atmospheric Pressure ◽  
Adhesive Bonding ◽  
Atmospheric Pressure Plasma ◽  
Theoretical Background ◽  
Surface Treatments ◽  
Surface Adhesion ◽  
Adhesion Properties ◽  
Pressure Plasma ◽  
Plasma Surface Treatment

Over the last decade, the number of researches has increased in the field of bonding technologies. Researchers attempt to improve surface adhesion properties by surface treatments. Adhesive bonding is one of these bonding techniques, where it is important to see what surfaces will be bonded. One such surface property is wetting, which can be improved by several types of surface treatment. In recent years, atmospheric pressure plasmas have appeared, with which research is ongoing on surface treatments. In our research, we will deal with the effects of plasma surface treatment at atmospheric pressure and its measurement. In addition, we summarize the theoretical background of adhesion, surface tension and surface treatment with atmospheric pressure plasma. Our goal is to improve adhesion properties and thus the adhesion quality.

Characterization of Wafer Level Metal Thermo-Compression Bonding

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 002326-002360
Author(s):  
Erkan Cakmak ◽  
Bioh Kim ◽  
Viorel Dragoi
Keyword(s):  
Surface Treatment ◽  
Metal Surface ◽  
Bonding Temperature ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Bending Test ◽  
Strength Analysis ◽  
Mems Devices ◽  
Wafer Level ◽  
Bond Quality

The process of wafer-level bonding is being successfully used to form MEMS devices. Wafer level bonding may be realized by different methods such as thermo compression, transient liquid phase, anodic, glass frit, or polymer bonding. These methods have different requirements and the choice of wafer level bonding method is defined by the application type. Metal TCB has a wide variety of applications with materials of choice including Au, Cu and Al. 3D electrical connections are created by the use of Cu-Cu TCB; while CMOS MEMS devices may be realized by Al-Al TCB. In this study the wafer level bonding process of Cu-Cu and Al-Al TCB are characterized. The effects and significance of various bonding process parameters and surface treatment methods are reported on the final bond interfaces integrity and strength. Analysis methods include SAM, SEM, AFM, and four point bending test. Al-Al TCB samples were investigated on the interfacial adhesion energy and bond quality. IAE and bond quality were found to be positively correlated with bonding temperature. A bonding temperature of 500 °C or greater is necessary to obtain bond strengths of 8–10 J/m2. A positive relation between IAE and bonding temperature was observed for Cu-Cu TCB. IAE's of greater then 10 J/m2 were obtained on bonded samples that do not show a post bond residual seam on the bonding interface. An acid based pre treatment was shown to impact the surface properties of the initial metal surface hence affecting the IAE. Post bond annealing processes showed the most significant impact on the IAE of the Cu-Cu TCB system. To obtain comparable IAE values the Al-Al TCB method requires a higher bonding temperature. However the Cu-Cu TCB is sensitive to the initial metal surface condition and requires surface treatment processes prior to bonding to obtain high quality bonding results.

Surface Treatment of Polypropylene for Adhesive Bonding

1970 ◽  
Vol 2 (2) ◽  
pp. 93-99 ◽  
Author(s):  
Harold Schonhorn ◽  
F. W. Ryan ◽  
R. H. Hansen
Keyword(s):  
Surface Treatment ◽  
Adhesive Bonding
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