Pre-bond Scan Test Through TSV Probing

Author(s):  
Brandon Noia ◽  
Krishnendu Chakrabarty
Keyword(s):  
Author(s):  
Magdalena Sienkiewicz ◽  
Philippe Rousseille

Abstract This paper presents a case study on scan test reject in a mixed mode IC. It focuses on the smart use of combined mature FA techniques, such as Soft Defect Localization (SDL) and emission microscopy (EMMI), to localize a random scan test anomaly at the silicon bulk level.


Integration ◽  
2017 ◽  
Vol 57 ◽  
pp. 108-124 ◽  
Author(s):  
Mahshid Mojtabavi Naeini ◽  
Sreedharan Baskara Dass ◽  
Chia Yee Ooi ◽  
Tomokazu Yoneda ◽  
Michiko Inoue

2008 ◽  
Vol 24 (1-3) ◽  
pp. 235-246 ◽  
Author(s):  
Sverre Wichlund ◽  
Frank Berntsen ◽  
Einar Johan Aas

Author(s):  
Harry Bleeker ◽  
Peter van den Eijnden ◽  
Frans de Jong

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