Nano and Micro Indentation and Scratch Tests of Mechanical Properties of Thin Films

2009 ◽  
pp. 489-490
Author(s):  
Norm V. Gitis ◽  
Suresh Kuiry ◽  
Ilja Hermann ◽  
Jun Xiao
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Scratch Tests ◽  
Micro Indentation

Nano and Micro Indentation and Scratch Tests of Mechanical Properties of Metals

2007 ◽  
Author(s):  
Norm Gitis ◽  
Ilja Hermann ◽  
Suresh Kuiry ◽  
Vishal Khosla
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Experimental Comparison ◽  
Instrumented Indentation ◽  
Scratch Tests ◽  
Micro Indentation

Experimental comparison of common nano and micro scales for hardness evaluation has been performed on metal samples and discussed in details. Instrumented indentation was found advantageous in both repeatability and a number of measured parameters over classical hardness methods for metals, while sclerometry was advantageous for ultra-thin films.

Size Scale Dependence of Deformation in NiTi

2000 ◽  
Author(s):  
Ken Gall ◽  
Martin L. Dunn ◽  
Yiping Liu ◽  
Paul Labossiere ◽  
Huseyin Sehitoglu ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Shape Memory ◽  
Quantitative Information ◽  
Scale Dependence ◽  
Micro Electro Mechanical Systems ◽  
Testing Techniques ◽  
Shape Memory Materials ◽  
Mems Testing ◽  
Micro Indentation

Abstract Recent work [1-5] has suggested that a lucrative future for shape memory materials such as NiTi is in the area of micro-electro-mechanical systems (MEMS). To design MEMS and predict their behavior during service, we must have quantitative information on the mechanical properties of scaled down NiTi materials. One way of obtaining the mechanical properties of scaled down materials is with unique MEMS testing fixtures. Although this approach is favorably analogous to macroscopic testing techniques it is not always feasible owing to the difficulty of handling the microscopic samples. Many smart material actuators are deposited thin films [1-5] and separating the films from their substrate and subsequently testing them is beyond our current MEMS processing and handling tools. An alternative method to quantify the properties of microscale materials is through micro-indentation, which has been previously applied to NiTi polycrystals [6]. Although micro-indentation is simple to accomplish, interpretation and quantification of the results is not as straightforward, as will be demonstrated in this work.

Correlation of The Mechanical Properties of Silicon Oxynitride Films to Processing Parameters, Film Stoichiometry, and Hydride Bond Concentration

1995 ◽  
Vol 391 ◽  
Author(s):  
Mansour Moinpour ◽  
Farhad Moghadam ◽  
Byron Williams
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Elastic Modulus ◽  
Linear Correlation ◽  
Processing Parameters ◽  
Silicon Oxynitride ◽  
Nitrogen Hydride ◽  
Micro Indentation ◽  
Hardness Values ◽  
Measured Hardness

AbstractA selective range of hydrated silicon oxynitride thin films (SixOyNz:H) have been characterized in terms of their stress, hardness, and modulus in order to mechanically qualify them for use as an encapsulation layer for memory devices (e.g., Flash and EPROM memories). These films are analyzed by RBS and HFS for stoichiometry. The films exhibited stress values between 1.86 x 109 to -3.54 x 109 dyne/cm2 and showed a linear correlation with the hydride ratio (N-H/Si-H). An Ultra Micro-Indentation System (UMIS) measured hardness values between 10.5 GPa to 16.2 GPa while the elastic modulus varied between 119.1 to 141.2 GPa. The monatomic increase of modulus with hardness is attributed to increased amounts of nitrogen and nitrogen hydride bonding in the silicon oxynitride samples.

Nanoindentation Induced Fracture in Hard Multilayer Thin Films

2001 ◽  
Vol 695 ◽  
Author(s):  
A. Karimi ◽  
D. Bethmont ◽  
Y. Wang
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Failure Modes ◽  
Single Layer ◽  
High Hardness ◽  
Depth Sensing ◽  
Normal Loading ◽  
Force Microscopy ◽  
Atomic Force ◽  
Scratch Tests

ABSTRACTDepth sensing nanoindentation and nanoscratch testing were combined with atomic force microscopy (AFM) and electron microscopy observations to study mechanical properties and fracture behavior of a number of TixAl1-xNyC1-y hard thin films. Various failure modes were activated either by normal loading-unloading or by microscratching of the samples to provide an estimation of the fracture toughness and interfacial fracture energies. By changing chemical composition and deposition conditions various nanostructured thin films including monolitically grown single layer, nanocomposite, and multilayers were coated onto the tungsten carbide-cobalt substrates. All tested films exhibit elevated mechanical properties with high hardness (38 – 45 GPa) and modulus (500 – 570 GPa). Under sufficiently high load indentation the formation of corner Palmqvist type radial cracks were usually observed because of small modulus mismatch between coating and substrate, good adhesion, and in particular high toughness of both substrate and films in spite of great difference in their respective hardness. Various failure modes were activated and the sequences of fracture events were determined using stepwise or continuously increasing load scratch tests. Some other films were found to be more sensitive to tensile stress behind the indenter which generates regularly repeated microcracks on the scratch track. Other films in particular multilayers were appeared more susceptible to compressive stress ahead of the indenter leading to local delamination at the interface between layers and the formation of irregular microcracks under the contact zone.

Mechanical properties of PVD Al1−xCrxN thin films

2011 ◽  
Vol 99 (2) ◽  
pp. 239-244 ◽  
Author(s):  
T.T.H. Pham ◽  
E. Le Bourhis ◽  
P. Goudeau ◽  
P. Guérin
Keyword(s):  
Thin Films ◽  
Mechanical Properties

Residual stress and mechanical properties of polyimide thin films

2009 ◽  
Vol 113 (2) ◽  
pp. 976-983 ◽  
Author(s):  
Wonbong Jang ◽  
Jongchul Seo ◽  
Choonkeun Lee ◽  
Sang-Hyon Paek ◽  
Haksoo Han
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress

Nanoconfinement Controls Mechanical Properties of Elastomeric Thin Films

2021 ◽  
pp. 8072-8079
Author(s):  
Pei Bai ◽  
Mingchao Ma ◽  
Li Sui ◽  
Yunlong Guo
Keyword(s):  
Thin Films ◽  
Mechanical Properties
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