Residual stress and mechanical properties of polyimide thin films

2009 ◽  
Vol 113 (2) ◽  
pp. 976-983 ◽  
Author(s):  
Wonbong Jang ◽  
Jongchul Seo ◽  
Choonkeun Lee ◽  
Sang-Hyon Paek ◽  
Haksoo Han
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress

Research on some Key Mechanical Properties of Silicon Nitride Thin Films Deposited by PECVD

2015 ◽  
Vol 742 ◽  
pp. 773-777
Author(s):  
Qun Feng Yang ◽  
Jian Yi Zheng ◽  
Jun Qing Wang ◽  
Jun Hui Lin ◽  
Xue Nan Zhao ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Silicon Nitride ◽  
Mechanical Characteristics ◽  
Dielectric Films ◽  
Rotating Beam ◽  
Atomic Force ◽  
Scanning Electron

The purpose of this work is to study the mechanical characteristics of the silicon nitride(SiNx) thin films prepared by PECVD technique, some researches as follows were carried out. First, the SiNx thin films were deposited on the two different substrates. Then, the atomic force microscope (AFM) was adopted to test the surface quality of the SiNxfilms, and the scanning electron microscope (SEM) was used to test the section morphology of the SiNxthin films. Finally, the rotating beam structures was applied to measure the residual stress in the SiNx films. The SiNxthin films with low stress can be fabricated through PECVD, in which the surface roughness values(Ra) are 1.261 nm and 2.383nm, and the residual stress is 43.5 kPa. Therefore, the SiNxthin films deposited by PECVD are suitable for the preparation of device dielectric films in MEMS.

Influence of residual stress on mechanical properties of TiAlN thin films

2013 ◽  
Vol 228 ◽  
pp. S328-S330 ◽  
Author(s):  
Guo-an Cheng ◽  
Dong-yan Han ◽  
Chang-lin Liang ◽  
Xiao-ling Wu ◽  
Rui-ting Zheng
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress

Measuring the elastic modulus and residual stress of freestanding thin films using nanoindentation techniques

2009 ◽  
Vol 24 (9) ◽  
pp. 2974-2985 ◽  
Author(s):  
Erik G. Herbert ◽  
Warren C. Oliver ◽  
Maarten P. de Boer ◽  
George M. Pharr
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Thermal Expansion ◽  
Elastic Modulus ◽  
Dimensional Analysis ◽  
Experimental Verification ◽  
Cu Films ◽  
Proposed Model ◽  
The Difference

A new method is proposed to determine the elastic modulus and residual stress of freestanding thin films based on nanoindentation techniques. The experimentally measured stiffness-displacement response is applied to a simple membrane model that assumes the film deformation is dominated by stretching as opposed to bending. Dimensional analysis is used to identify appropriate limitations of the proposed model. Experimental verification of the method is demonstrated for Al/0.5 wt% Cu films nominally 22 µm wide, 0.55 µm thick, and 150, 300, and 500 µm long. The estimated modulus for the four freestanding films match the value measured by electrostatic techniques to within 2%, and the residual stress to within 19.1%. The difference in residual stress can be completely accounted for by thermal expansion and a modest change in temperature of 3 °C. Numerous experimental pitfalls are identified and discussed. Collectively, these data and the technique used to generate them should help future investigators make more accurate and precise measurements of the mechanical properties of freestanding thin films using nanoindentation.

Influence of Support Compliance and Residual Stress on the Shape of Doubly-Supported Surface-Micromachined Beams

1999 ◽  
Author(s):  
Mauro J. Kobrinsky ◽  
Erik R. Deutsch ◽  
Stephen D. Senturia
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Finite Element Method ◽  
Residual Stress ◽  
Gradual Increase ◽  
The Other ◽  
Elastic Model ◽  
Dimensional Model ◽  
Stable States ◽  
One Dimensional

Abstract Doubly-supported surface-micromachined beams are increasingly used to study the mechanical properties of thin films. Residual stresses in the beams cause significant vertical deflections, which affect the performance of these devices. We present here both experimental results for doubly-supported polysilicon surface-micromachined beams, and an elastic model of the devices that takes into account the compliance of the supports and the geometrical non-linear dependence of the vertical deflections on the stress in the beam. An elastic one-dimensional model was used for the beams, and the response of the supports to forces and moments was obtained using Finite Element Method simulations. The model explains a previously observed gradual increase of the maximum vertical deflections of the beams with increasing length at a given constant residual stress, and, in agreement with experimental observations, predicts two stable states for compressively stressed beams: one with the beam bent up, the other down.

scholarly journals Effects of mechanical properties, residual stress and indenter tip geometry on instrumented indentation data in thin films

2010 ◽  
Vol 205 (5) ◽  
pp. 1393-1397 ◽  
Author(s):  
Carlos E.K. Mady ◽  
Sara A. Rodriguez ◽  
Adriana G. Gómez ◽  
Roberto M. Souza
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Instrumented Indentation

scholarly journals Evolution of Principle and Practice of Electrodeposited Thin Film: A Review on Effect of Temperature and Sonication

2011 ◽  
Vol 2011 ◽  
pp. 1-16 ◽  
Author(s):  
A. Mallik ◽  
B. C. Ray
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Electrochemical Deposition ◽  
Surface Engineering ◽  
Effect Of Temperature ◽  
Structure And Morphology ◽  
Nucleation Mechanisms ◽  
Effects Of Temperature

This review discusses briefly the important aspects of thin films. The introduction of the article is a summary of evolution of thin films from surface engineering, their deposition methods, and important issues. The fundamental aspects of electrochemical deposition with special emphasis on the effect of temperature on the phase formation have been reviewed briefly. The field of sonoelectrochemistry has been discussed in the paper. The literature regarding the effects of temperature and sonication on the structure and morphology of the deposits and nucleation mechanisms, residual stress, and mechanical properties has also been covered briefly.

scholarly journals Effect of Annealing on Microstructure and Mechanical Properties of Magnetron Sputtered Cu Thin Films

2015 ◽  
Vol 2015 ◽  
pp. 1-8 ◽  
Author(s):  
Shiwen Du ◽  
Yongtang Li
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Grain Size ◽  
Strain Energy ◽  
Texture Coefficient ◽  
Elastic Strain Energy ◽  
Interface Energy ◽  
Cu Films ◽  
Si Substrates

Cu thin films were deposited on Si substrates using direct current (DC) magnetron sputtering. Microstructure evolution and mechanical properties of Cu thin films with different annealing temperatures were investigated by atomic force microscopy (AFM), X-ray diffraction (XRD), and nanoindentation. The surface morphology, roughness, and grain size of the Cu films were characterized by AFM. The minimization of energy including surface energy, interface energy, and strain energy (elastic strain energy and plastic strain energy) controlled the microstructural evolution. A classical Hall-Petch relationship was exhibited between the yield stress and grain size. The residual stress depended on crystal orientation. The residual stress as-deposited was of tension and decreased with decreasing of (111) orientation. The ratio of texture coefficient of (111)/(220) can be used as a merit for the state of residual stress.

Mechanical Properties of AlN Thin Films Prepared by Ion Beam Assisted Deposition

2000 ◽  
Vol 647 ◽  
Author(s):  
Shuichi Miyabe ◽  
Toshiyuki Okawa ◽  
Nobuaki Kitazawa ◽  
Yoshihisa Watanabe ◽  
Yoshikazu Nakamura
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Beam Energy ◽  
Ion Beam ◽  
High Energy ◽  
Columnar Structure ◽  
Ion Beam Assisted Deposition ◽  
Film Hardness ◽  
Nitrogen Ion

AbstractAluminum nitride (AlN) thin films were prepared by ion-beam assisted deposition method, and the influence of the nitrogen ion beam energy on their microstructure and mechanical properties was studied by changing the ion beam energy from 0.1 to 1.5 keV. Films prepared with a low-energy ion beam show a columnar structure, while films prepared with a high-energy ion beam show a granular structure. The film hardness is found to decrease with increasing nitrogen ion beam energy. It is also found that the film hardness does not change drastically after annealing in nitrogen atmosphere at 500 °C, yielding the residual stress relaxation. It is proposed that the film hardness is dependent on the film microstructure, which can be controlled with the nitrogen ion beam energy, rather than the residual stress in the films.

Enchancement of Mechanical Properties in BaTiO3 Ferroelectric Thin Films

2010 ◽  
Vol 150-151 ◽  
pp. 599-602 ◽  
Author(s):  
Cheng Lu ◽  
Xiang Yun Deng ◽  
Xiao Fen Guan ◽  
Zhong Wen Tan ◽  
Yan Jie Zhang ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Elastic Modulus ◽  
Sintering Temperature ◽  
Sol Gel ◽  
Ferroelectric Thin Films ◽  
Fabrication Method ◽  
Maximum Hardness ◽  
Sol Gel Process

Surface structure and mechanical properties of BaTiO3 thin films prepared by sol-gel process were investigated by XP-2 profiler and nano-indention. The results indicated that the thickness of thin films got thicker with sintering temperature and the thickness-increasing rate differ from different solvent. The hardness and elastic modulus were enhanced due to the presence of residual stress which was compression and probably induced by fabrication method. The maximum hardness is 9.98GPa when the Young’s modulus is 127.41GPa with ethanol as solvent sintered at 1000oC.

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