Comparative analysis between resinoid and vitrified bond grinding wheel under interrupted cutting

Manufacturing of vitrified bond CBN wheels for internal precision grinding of the air-conditioner compressor piston hole is still big challenge to all of the domestic manufacturers. Recently, by choosing pre-melting mixed CBN abrasives and a proper sintering process, a cost-effective method was conceived to produce grinding wheels of comparative quality. The grinding performance of wheels was evaluated with a series of internal precision grinding of compressor piston hole. Experimental results show that the vitrified bond CBN grinding wheel produced by this method has better grinding performance, and can be substitute to the same type of grinding wheels imported. But the manufacturing cost is only 60% of the wheel imported according to estimation.

Download Full-text

Study on the grindability of nano-vitrified bond CBN grinding wheel for nickel-based alloy

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-018-2807-y ◽

2018 ◽

Vol 100 (5-8) ◽

pp. 1913-1921 ◽

Cited By ~ 2

Author(s):

Ying Shi ◽

Zhihui Wang ◽

Shengzhi Xu ◽

Tianbiao Yu ◽

Zhili Sun

Keyword(s):

Grinding Wheel ◽

Nickel Based Alloy ◽

Vitrified Bond ◽

Cbn Grinding Wheel

Download Full-text

Backside Exposure of Small-Sized TSVs Using Si/Cu Grinding, CMP, Cap Layer Deposition, and Alkaline Etching

International Symposium on Microelectronics ◽

10.4071/isom-ta14 ◽

2014 ◽

Vol 2014 (1) ◽

pp. 000019-000023 ◽

Cited By ~ 2

Author(s):

Naoya Watanabe ◽

Masahiro Aoyagi ◽

Daisuke Katagawa ◽

Tsubasa Bandoh ◽

Eiichi Yamamoto

Keyword(s):

Chemical Mechanical Polishing ◽

Grinding Wheel ◽

Alkaline Etching ◽

Layer Deposition ◽

New Process ◽

Cu Contamination ◽

Cap Layer ◽

Vitrified Bond ◽

Silicon Vias

For backside exposure of through-silicon vias (TSVs), we developed a new process using Si/Cu grinding, chemical mechanical polishing (CMP), cap layer deposition, and alkaline etching of Si. In this process, Si/Cu grinding without Cu burning or smearing was performed by using a novel grinding wheel (vitrified-bond type), with in situ cleaning of the grinding wheel by a high-pressure micro jet. CMP was then performed to remove grinding scratches generated by Si/Cu grinding. Next, slight Cu contamination in the Si region between TSVs was decreased by cap layer deposition and alkaline etching of Si. The cap layer was Ni-B film formed by electroless plating. We also applied the developed process to backside exposure of 4-μm-diameter TSVs. As a result, TSVs were exposed uniformly without grinding scratches and Cu contamination in Si region between TSVs was suppressed to < 2.7×1010 atoms/cm2.

Download Full-text

Research on Grinding Temperature of Nano ZrO2 Ceramics Using Diamond Grinding Wheel Dressed by Elliptic Ultrasonic Vibration

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.42.313 ◽

2010 ◽

Vol 42 ◽

pp. 313-316 ◽

Cited By ~ 4

Author(s):

Jin Xue Xue ◽

Bo Zhao

Keyword(s):

Comparative Analysis ◽

Ceramic Material ◽

Ultrasonic Vibration ◽

Grinding Wheel ◽

Grinding Temperature ◽

Grinding Wheels ◽

Vibration Method ◽

Diamond Grinding Wheel ◽

Diamond Grinding

In order to investigate the influence of dressing methods on grinding temperature, two kinds of diamond grinding wheels dressed by traditional dressing(TD) and elliptic ultrasonic vibration dressing(ED) respectively were used to grind the same nano-ceramic material. Through grinding experiments, the comparative analysis of the grinding temperature was conducted. The results show that diamond grinding wheel dressed by elliptical ultrasonic vibration method can decrease the grinding temperature.

Download Full-text

Investigation on the grinding properties of high thermal conductivity vitrified bond CBN grinding wheel for titanium alloy

The International Journal of Advanced Manufacturing Technology ◽

10.1007/s00170-020-05134-y ◽

2020 ◽

Vol 107 (3-4) ◽

pp. 1539-1549

Author(s):

Ying Shi ◽

Liaoyuan Chen ◽

Hongsheng Xin ◽

Tianbiao Yu ◽

Zhili Sun

Keyword(s):

Thermal Conductivity ◽

Titanium Alloy ◽

High Thermal Conductivity ◽

Grinding Wheel ◽

Vitrified Bond ◽

Cbn Grinding Wheel

Download Full-text

The Research on Deep and Narrow Groove Grinded by Diamond Wheel

Applied Mechanics and Materials ◽

10.4028/www.scientific.net/amm.389.281 ◽

2013 ◽

Vol 389 ◽

pp. 281-283 ◽

Cited By ~ 1

Author(s):

Chun Yang Tang ◽

Long Wu ◽

Zhi Long Li ◽

Hua Feng Lu ◽

Hua Yang ◽

...

Keyword(s):

Surface Roughness ◽

Diamond Wheel ◽

Grinding Wheel ◽

Particle Sizes ◽

Deep Trench ◽

Fine Particle Size ◽

Vitrified Bond ◽

Flatness Error ◽

Deep Narrow Groove ◽

Selection Of

The deep narrow groove of the coupling plate and side with WC-CO coating was grinded by diamond wheel with metal bond and vitrified bond. The side of the deep trench flatness error was less than 0.02 mm, the bottom of the tank around the corner radius was less than 0.3mm. The type of porosity, particle sizes, surface roughness were measured by experiments, the data for the selection of the grinding wheel bond varieties. The experimental results show that grinding wheel with vitrified bond was suitable for parts of small coating porosity, fine particle size, surface roughness, and others were suitable for the grinding wheel with metal binder.

Download Full-text