The Research on Deep and Narrow Groove Grinded by Diamond Wheel

2013 ◽  
Vol 389 ◽  
pp. 281-283 ◽  
Author(s):  
Chun Yang Tang ◽  
Long Wu ◽  
Zhi Long Li ◽  
Hua Feng Lu ◽  
Hua Yang ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Diamond Wheel ◽  
Grinding Wheel ◽  
Particle Sizes ◽  
Deep Trench ◽  
Fine Particle Size ◽  
Vitrified Bond ◽  
Flatness Error ◽  
Deep Narrow Groove ◽  
Selection Of

The deep narrow groove of the coupling plate and side with WC-CO coating was grinded by diamond wheel with metal bond and vitrified bond. The side of the deep trench flatness error was less than 0.02 mm, the bottom of the tank around the corner radius was less than 0.3mm. The type of porosity, particle sizes, surface roughness were measured by experiments, the data for the selection of the grinding wheel bond varieties. The experimental results show that grinding wheel with vitrified bond was suitable for parts of small coating porosity, fine particle size, surface roughness, and others were suitable for the grinding wheel with metal binder.

The Inner Hole Grinding Surface Roughness Analysis of Zirconia Ceramics Electric Spindle

2011 ◽  
Vol 487 ◽  
pp. 99-103
Author(s):  
Feng Lu ◽  
Shi Chao Chen ◽  
Song Hua Li ◽  
Ke Zhang ◽  
Yu Hou Wu
Keyword(s):  
Surface Roughness ◽  
High Speed ◽  
Work Performance ◽  
Diamond Wheel ◽  
Grinding Wheel ◽  
Accuracy Requirement ◽  
Key Factor ◽  
Roughness Analysis ◽  
Nc Machine ◽  
Processing Accuracy

The high-speed ceramic electric spindle is applied in high-speed NC machine tools. Each surface processing accuracy requirement of high-speed ceramic electric spindle is high. The inner hole surface roughness is the key factor which affects its high-speed stability and moving accuracy. This paper focuses on the research of the relationship between inner hole and grinding wheel granularity and grinding wheel linear velocity and transverse feeding and grinding camber ratio through the experiment of diamond wheel grinding the inner hole of ceramic spindle. The optimal grinding parameter combination of ceramic spindle inner hole grinding is obtained. The surface roughness of ceramic spindle inner hole reaches 0.21μm, through the analysis of orthogonal test. The results can completely satisfy the ceramic spindle high-speed operation requirements and enhance the ability of corrosion resistance and fatigue damage resistance. It then improves the whole work performance, reliability and life of ceramic spindle.

Optimizing the Dry Grinding Process on the Basis of Bond Materials

2014 ◽  
Vol 1017 ◽  
pp. 237-242
Author(s):  
Heike Kitzig ◽  
Nima Jandaghi ◽  
Bahman Azarhoushang ◽  
Alireza Vesali
Keyword(s):  
Surface Roughness ◽  
Process Efficiency ◽  
Grinding Wheel ◽  
Formation Mechanisms ◽  
Grinding Process ◽  
Grinding Wheels ◽  
Wet Grinding ◽  
Dry Grinding ◽  
Conventional Grinding ◽  
Selection Of

In order to decrease the negative environmental impacts of the cutting fluids (for example, disposal of grinding sludge) and also to reduce the manufacturing costs and the required space for the machines the dry grinding can be a conceivable alternative for the conventional grinding processes. Nevertheless, dry grinding has not been widely introduced into industry because of the high temperature generated in the grinding zone and difficulties of heat transfer without coolants. Selection of the proper grinding wheel bonds, grit sizes and concentration has significant effect on the grinding performance and the generated heat in the contact zone. This paper addresses the effects of the grinding wheel bond and the concentration on the dry grinding process efficiency through comparing the results of the carried out experiments with three resin bonded cBN-cup-wheels, each consisting different bond components. For this purpose, surface roughness and thermal damages during dry and wet grinding (utilizing grinding oil) by three different resin bonds were measured. The results show almost identical surface roughness values for dry and wet grinding. Furthermore, using the resin-kryolith-graphite bonded wheel leads to a reduction in thermal damages on the workpiece. Through different experiments, it was shown that the different bonds, used in this study, have significant influence on the chip loading of the grinding wheels. This is contributed to the different chip formation mechanisms and induced grinding temperatures when grinding by the different wheel bonds.

Study on the Effect of Coarse Grinding Area Slope Angle on Surface Quality in Point Grinding

2013 ◽  
Vol 797 ◽  
pp. 118-122 ◽  
Author(s):  
Ya Dong Gong ◽  
Guo Qiang Yin ◽  
Chao Wang ◽  
Xue Long Wen ◽  
Jun Cheng
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Deflection Angle ◽  
Slope Angle ◽  
Grinding Wheel ◽  
Machining Accuracy ◽  
Stepped Shaft ◽  
Vitrified Bond ◽  
Design And Manufacture

There is a vitrified bond CBN point grinding wheel with coarse grinding area slope angle θ. This new grinding wheel has higher removing rate and better machining accuracy than conventional wheels. The design and manufacture principle of the new grinding wheels are studied in this paper. These wheels with different coarse grinding area slope angle θ are used to grind the stepped shaft of QT700 with a series of grinding parameters.VHX-1000E microscopic system and Micromeasure system are used to measure the surface quality of workpiece. In the same group of grinding parameters, compare the effect of these different wheels on surface roughness. The effect of deflection angle α on surface roughness is generalized.

scholarly journals Diamond Grinding Wheel Condition Monitoring Based on Acoustic Emission Signals

Sensors ◽  
2021 ◽  
Vol 21 (4) ◽  
pp. 1054
Author(s):  
Guo Bi ◽  
Shan Liu ◽  
Shibo Su ◽  
Zhongxue Wang
Keyword(s):  
Neural Network ◽  
Acoustic Emission ◽  
Condition Monitoring ◽  
Time Domain ◽  
Diamond Wheel ◽  
Feature Representation ◽  
Grinding Wheel ◽  
Time Waveform ◽  
Original Time ◽  
Whole Life Cycle

Acoustic emission (AE) phenomenon has a direct relationship with the interaction of tool and material which makes AE the most sensitive one among various process variables. However, its prominent sensitivity also means the characteristics of random and board band. Feature representation is a difficult problem for AE-based monitoring and determines the accuracy of monitoring system. It is knottier for the situation of using diamond wheel grinding optical components, not only because of the complexity of grinding process but also the high requirement on surface and subsurface quality. This paper is dedicated to AE-based condition monitoring of diamond wheel during grinding brittle materials and feature representation is paid more attention. AE signal of brittle-regime grinding is modeled as a superposition of a series of burst-type AE events. Theory analysis manifested that original time waveform and frequency spectrum are all suitable for feature representation. Considering the convolution form of b-AE in time domain, a convolutional neural network with original time waveform of AE signals as the input is built for multi-class classification of wheel state. Detailed state division in a wheel’s whole life cycle is realized and the accuracy is over 90%. Different from the overlapping in time domain, AE components of different crack mechanisms are probably separated in frequency domain. From this point of view, AE spectrums are more suitable for feature extraction than the original time waveform. In addition, the time sequence of AE samples is essential for the evaluation of wheel’s life elapse and making use of sequential information is just the idea behind recurrent neural network (RNN). Therefore, long short-term memory (LSTM), a special kind of RNN, is used to build a regression prediction model of wheel state with AE spectrums as the model input and satisfactory prediction accuracy is acquired on the test set.

scholarly journals Study on the Effect of Grinding Pressure on Material Removal Behavior Performed on a Self-Designed Passive Grinding Simulator

2021 ◽  
Vol 11 (9) ◽  
pp. 4128
Author(s):  
Peng-Zhan Liu ◽  
Wen-Jun Zou ◽  
Jin Peng ◽  
Xu-Dong Song ◽  
Fu-Ren Xiao
Keyword(s):  
Residual Stress ◽  
Surface Roughness ◽  
Service Life ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Force ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Grinding Temperature ◽  
Grinding Efficiency

Passive grinding is a new rail grinding strategy. In this work, the influence of grinding pressure on the removal behaviors of rail material in passive grinding was investigated by using a self-designed passive grinding simulator. Meanwhile, the surface morphology of the rail and grinding wheel were observed, and the grinding force and temperature were measured during the experiment. Results show that the increase of grinding pressure leads to the rise of rail removal rate, i.e., grinding efficiency, surface roughness, residual stress, grinding force and grinding temperature. Inversely, the enhancement of grinding pressure and grinding force will reduce the grinding ratio, which indicates that service life of grinding wheel decreases. The debris presents dissimilar morphology under different grinding pressure, which reflects the distinction in grinding process. Therefore, for rail passive grinding, the appropriate grinding pressure should be selected to balance the grinding quality and the use of grinding wheel.

Surface integrity of quenched steel 1045 machined by CBN grinding wheel and SiC grinding wheel

2017 ◽  
Vol 8 (2) ◽  
pp. 179-187 ◽  
Author(s):  
Kankan Ji ◽  
Xingquan Zhang ◽  
Shubao Yang ◽  
Liping Shi ◽  
Shiyi Wang ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Morphology ◽  
Compressive Stress ◽  
Surface Integrity ◽  
Grinding Wheel ◽  
Micro Hardness ◽  
Content Type ◽  
Quenched Steel ◽  
Cut Depth ◽  
Cbn Grinding Wheel

Purpose The purpose of this paper is to evaluate surface integrity of quenched steel 1045 ground drily by the brazed cubic boron nitride (CBN) grinding wheel and the black SiC wheel, respectively. Surface integrity, including surface roughness, sub-surface hardness, residual stresses and surface morphology, was investigated in detail, and the surface quality of samples ground by two grinding wheels was compared. Design/methodology/approach In the present work, surface integrity of quenched steel 1045 machined by the CBN grinding wheel and the SiC wheel was investigated systematically. All the specimens were machined with a single pass in the down-cutting mode of dry condition. Surface morphology of the ground specimen was observed by using OLYMPUS BX51M optical microscopy. Surface roughness of seven points was measured by using a surface roughness tester at a cut-off length of 1.8 mm and the measurement traces were perpendicular to the grinding direction. Sub-surface micro-hardness was measured by using HVS-1000 digital micro-hardness tester after the cross-section surface was polished. The residual stress was tested by using X-350A X-ray stress analyzer. Findings When the cut depth is increased from 0.01 to 0.07 mm, the steel surface machined by the CBN wheel remains clear grinding mark, lower roughness, higher micro-hardness and higher magnitude of compressive stress and fine microstructure, while the surface machined by the SiC grinding wheel becomes worse with increasing of cut depth. The value of micro-hardness decreases, and the surface roughness increases, and the surface compressive stress turns into tensile stress. Some micro-cracks and voids occur when the sample is processed by the SiC grinding wheel with cut depth 0.07 mm. Originality/value In this paper, the specimens of quenched steel 1045 were machined by the CBN grinding wheel and the SiC wheel with various cutting depths. The processing quality resulted from the CBN grinding wheel is better than that resulted from the SiC grinding wheel.

scholarly journals Performance of Norton Quantum Grinding Wheels

2016 ◽  
Vol 686 ◽  
pp. 125-130 ◽  
Author(s):  
Miroslav Neslušan ◽  
Jitka Baďurová ◽  
Anna Mičietová ◽  
Maria Čiliková
Keyword(s):  
Surface Roughness ◽  
Ground Surface ◽  
Bearing Steel ◽  
Grinding Wheel ◽  
Grinding Wheels ◽  
Grinding Forces ◽  
Removal Rates ◽  
Surface Burn ◽  
Conventional Grinding

This paper deals with cutting ability of progressive Norton Quantum grinding wheel during grinding roll bearing steel 100Cr6 of hardness 61 HRC. Cutting ability of this wheel is compared with conventional grinding wheel and based on measurement of grinding forces as well as surface roughness. Results of experiments show that Norton Quantum grinding wheels are capable of long term grinding cycles at high removal rates without unacceptable occurrence of grinding chatter and surface burn whereas application of conventional wheel can produce excessive vibration and remarkable temper colouring of ground surface. Moreover, while Norton Quantum grinding wheel gives nearly constant grinding forces and surface roughness within ground length at higher removal rates, conventional grinding wheel (as that reported in this study) does not.

Development of a New Plate Polishing Technique with an Instantaneous Tiny-Grinding Wheel Cluster Based on Magnetorheological Effect

2008 ◽  
Vol 53-54 ◽  
pp. 155-160 ◽  
Author(s):  
Qiu Sheng Yan ◽  
Ai Jun Tang ◽  
Jia Bin Lu ◽  
Wei Qiang Gao
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Grinding Wheel ◽  
Abrasive Particles ◽  
Magnetorheological Effect ◽  
Material Removal Model ◽  
Mr Effect ◽  
Removal Model

A new plate polishing technique with an instantaneous tiny-grinding wheel cluster based on the magnetorheological (MR) effect is presented in this paper, and some experiments were conducted to prove its effectiveness and applicability. Under certain experimental condition, the material removal rate was improved by a factor of 20.84% as compared with the conventional polishing methods with dissociative abrasive particles, while the surface roughness of the workpiece was not obviously increased. Furthermore, the composite of the MR fluid was optimized to obtain the best polishing performance. On the basis of the experimental results, the material removal model of the new plate polishing technique was presented.

Ultra-precision grinding of 4H-SiC wafer by PAV/PF composite sol-gel diamond wheel

2021 ◽  
Vol 13 (9) ◽  
pp. 168781402110449
Author(s):  
Kaiping Feng ◽  
Tianchen Zhao ◽  
Binghai Lyu ◽  
Zhaozhong Zhou
Keyword(s):  
Surface Roughness ◽  
Low Temperature ◽  
Polyvinyl Alcohol ◽  
Feed Rate ◽  
Hot Pressing ◽  
Phenolic Resin ◽  
Sol Gel ◽  
Diamond Wheel ◽  
Sic Wafer ◽  
Better Than

To eliminate the deep scratches on the 4H-SiC wafer surface in the grinding process, a PVA/PF composite sol-gel diamond wheel was proposed. Diamond and fillers are sheared and dispersed in the polyvinyl alcohol-phenolic resin composite sol glue, repeatedly frozen at a low temperature of −20°C to gel, then 180°C sintering to obtain the diamond wheel. Study shows that the molecular chain of polyvinyl alcohol-phenolic resin is physically cross-linked to form gel under low-temperature conditions. Tested by mechanical property testing machines, microhardness tester, and SEM. The results show that micromorphology is more uniform, the strength of the sol-gel diamond wheel is higher, the hardness uniformity is better than that of the hot pressing diamond wheel. Grinding experiments of 4H-SiC wafer were carried out with the prepared sol-gel diamond wheel. The influence of grinding speed, feed rate, and grinding depth on the surface roughness was investigated. The results showed that by using the sol-gel diamond wheel, the surface quality of 4H-SiC wafer with an average surface roughness Ra 6.42 nm was obtained under grinding wheel speed 7000 r/min, grinding feed rate 6 µm/min, and grinding depth 15 µm, the surface quality was better than that of using hot pressing diamond wheel.

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