Densities and Thermal Expansion Coefficients of Pure Methylcyclohexane, 1-Methylcyclohexene, 4-Methylcyclohexene, 1-Methyl-1,4-cyclohexadiene, and Toluene and Binary Mixtures of Methylcyclohexane and Toluene at 283.15 K to 358.15 K and 1 atm

2020 ◽  
Vol 41 (4) ◽  
Author(s):  
Muhammad R. Usman ◽  
Zubair Shahid ◽  
Muhammad S. Akram ◽  
Rabya Aslam
Keyword(s):  
Thermal Expansion ◽  
Binary Mixtures ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

Temperature and pressure dependence of the volumetric properties of binary mixtures containing polyhaloalkanes

1999 ◽  
Vol 77 (12) ◽  
pp. 2046-2052 ◽  
Author(s):  
Carmen Jarne ◽  
Manuela Artal ◽  
José Muñoz Embid ◽  
Inmaculada Velasco ◽  
Santos Otín
Keyword(s):  
Thermal Expansion ◽  
Binary Mixtures ◽  
Isothermal Compressibility ◽  
Excess Volume ◽  
Excess Molar Volumes ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients ◽  
Temperature And Pressure ◽  
Density Excess ◽  
Volume Thermal Expansion Coefficient

Densities of binary mixtures of 1,1,2-trichlorotrifluoroethane + dibromomethane, + bromochloromethane, or + bromotrichloromethane were measured over their entire composition ranges at 288.15 and 308.15 K. Thermal expansion coefficients (α) and excess molar volumes (VEm) were calculated. Moreover, densities at 298.15 K and pressures up to 80 bar (1 bar = 100 kPa) were determined for these same mixtures. Isothermal compressibilities (KT) of the pure liquids and their mixtures were obtained.Key words: density, excess volume, thermal expansion coefficient, isothermal compressibility.

scholarly journals Densities, Apparent Molar Volume, Expansivities, Hepler’s Constant, and Isobaric Thermal Expansion Coefficients of the Binary Mixtures of Piperazine with Water, Methanol, and Acetone at T = 293.15 to 328.15 K

2018 ◽  
Vol 2018 ◽  
pp. 1-10 ◽  
Author(s):  
Qazi Mohammed Omar ◽  
Jean-Noël Jaubert ◽  
Javeed A. Awan
Keyword(s):  
Thermal Expansion ◽  
Molar Volume ◽  
Binary Mixtures ◽  
Apparent Molar Volume ◽  
Apparent Molar Volumes ◽  
Molar Volumes ◽  
Temperature Range ◽  
Thermal Expansion Coefficients ◽  
Isobaric Thermal Expansion ◽  
Expansion Coefficients

The properties of 3 binary mixtures containing piperazine were investigated in this work. In a first step, the densities for the two binary mixtures (piperazine + methanol) and (piperazine + acetone) were measured in the temperature range of 293.15 to 328.15 K and 293.15 to 323.15 K, respectively, at atmospheric pressure by using a Rudolph research analytical density meter (DDM 2911). The concentration of piperazine in the (piperazine + methanol) mixture was varied from 0.6978 to 14.007 mol/kg, and the concentration of piperazine in the (piperazine + acetone) mixture was varied from 0.3478 to 1.8834 mol/kg. On the other hand, the density data for the (piperazine + water) mixture were taken from the literature in the temperature range of 298.15 to 328.15 K. In a second step, for the 3 investigated systems, the apparent molar volume (Vϕ) and the limiting apparent molar volume (Vϕ0) at infinite dilution were calculated using the Redlich–Mayer equation. The limiting apparent molar volumes (Vϕ0) were used to study the influence of the solute-solvent and solute-solute interactions. The temperature dependency of the apparent molar volumes was used to estimate the apparent molar expansibility, Hepler’s constant ∂2Vϕ0/∂T2P, and isobaric thermal expansion coefficients αP.

Influence of Cr deficiency on sintering, thermal expansion and electrical properties of La0.75Sr0.25Cr1−xO3−δ as a SOFC interconnect material

2016 ◽  
Vol 30 (11) ◽  
pp. 1650127 ◽  
Author(s):  
Yi Ren ◽  
Wen Ma ◽  
Xiaoying Li ◽  
Jun Wang ◽  
Yu Bai ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Electrical Properties ◽  
Perovskite Phase ◽  
Ignition Process ◽  
Thermal Expansion Coefficients ◽  
Auto Ignition ◽  
Pure Perovskite Phase ◽  
Maximum Conductivity ◽  
Expansion Coefficients ◽  
Interconnect Material

The SOFC interconnect materials La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] [Formula: see text]–[Formula: see text] were prepared using an auto-ignition process. The influences of Cr deficiency on their sintering, thermal expansion and electrical properties were investigated. All the samples were pure perovskite phase after sintering at 1400[Formula: see text]C for 4 h. The cell volume of La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] decreased with increasing Cr deficient content. The relative density of the sintered bulk samples increased from 93.2% [Formula: see text] to a maximum value of 94.7% [Formula: see text] and then decreased to 87.7% [Formula: see text]. The thermal expansion coefficients of the sintered bulk samples were in the range of [Formula: see text]–[Formula: see text] (30–1000[Formula: see text]C), which are compatible with that of YSZ. Among the investigated samples, the sample with 0.02 Cr deficiency had a maximum conductivity of 40.4 Scm[Formula: see text] and the lowest Seebeck coefficient of 154.8 [Formula: see text]VK[Formula: see text] at 850[Formula: see text]C in pure He. The experimental results indicate that La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] has the best properties and is much suitable for SOFC interconnect material application.

Novel Silicon-Elastomers for Advanced Soft Lithography

2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi
Keyword(s):  
Thermal Expansion ◽  
High Resolution ◽  
Soft Lithography ◽  
Materials Properties ◽  
Nano Scale ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.

Thermal expansion coefficients of NH4ReO4and NH4IO4down to 58 K

1985 ◽  
Vol 82 (3) ◽  
pp. 1611-1612 ◽  
Author(s):  
Stanley L. Segel ◽  
H. Karlsson ◽  
T. Gustavson ◽  
K. Edstrom
Keyword(s):  
Thermal Expansion ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

scholarly journals Organizing Cells Within Non-Periodic Microarchitectured Materials That Achieve Graded Thermal Expansions

2015 ◽  
Author(s):  
Jonathan B. Hopkins ◽  
Lucas A. Shaw ◽  
Todd H. Weisgraber ◽  
George R. Farquar ◽  
Christopher D. Harvey ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Element Analysis ◽  
Thermal Expansion Coefficients ◽  
Large Lattice ◽  
Unit Cells ◽  
Expansion Coefficients ◽  
Bulk Behavior

The aim of this paper is to introduce an approach for optimally organizing a variety of different unit cell designs within a large lattice such that the bulk behavior of the lattice exhibits a desired Young’s modulus with a graded change in thermal expansion over its geometry. This lattice, called a graded microarchitectured material, can be sandwiched between two other materials with different thermal expansion coefficients to accommodate their different expansions or contractions caused by changing temperature while achieving a desired uniform stiffness. First, this paper provides the theory necessary to calculate the thermal expansion and Young’s modulus of large multi-material lattices that consist of periodic (i.e., repeating) unit cells of the same design. Then it introduces the theory for calculating the graded thermal expansions of a large multimaterial lattice that consists of non-periodic unit cells of different designs. An approach is then provided for optimally designing and organizing different unit cells within a lattice such that both of its ends achieve the same thermal expansion as the two materials between which the lattice is sandwiched. A MATLAB tool is used to generate images of the undeformed and deformed lattices to verify their behavior and various examples are provided as case studies. The theory provided is also verified and validated using finite element analysis and experimentation.

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