Research on the influence of machining introduced sub-surface defects and residue stress upon the mechanical properties of single crystal copper

2010 ◽  
Vol 53 (12) ◽  
pp. 3161-3167 ◽  
Author(s):  
MingJun Chen ◽  
GaoBo Xiao ◽  
JiaXuan Chen ◽  
ChunYa Wu
Keyword(s):  
Mechanical Properties ◽  
Single Crystal ◽  
Surface Defects ◽  
Single Crystal Copper

Quasicontinuum Simulation of Uniaxial Tension of Single Crystal Copper Nanowire

2011 ◽  
Vol 694 ◽  
pp. 200-204
Author(s):  
Xing Lei Hu ◽  
Ying Chun Liang ◽  
Jia Xuan Chen ◽  
Hong Min Pen
Keyword(s):  
Mechanical Properties ◽  
Finite Element Method ◽  
Molecular Dynamics ◽  
Finite Element ◽  
Single Crystal ◽  
Size Effects ◽  
Tension Test ◽  
Quasicontinuum Method ◽  
Single Crystal Copper ◽  
Copper Nanowire

Quasicontinuum simulations of tension test of single crystal copper nanowire are performed to analyze deformation mechanism of tension process and size effects of mechanical properties. New tension models of nanowire are constructed by using quasicontinuum method, which has combined molecular dynamics and finite element method. Tension processes of three different length nanowires without notches and those with notches are simulated. Yield strength and elastic modulus are calculated according to the obtained load-displacement curves. Finally, the results show that the mechanical properties of copper nanowire have obvious size effect and the notches have obvious influence on the mechanical properties.

Mechanical properties of self-irradiated single-crystal copper

2014 ◽  
Vol 23 (3) ◽  
pp. 036101 ◽  
Author(s):  
Wei-Na Li ◽  
Jian-Ming Xue ◽  
Jian-Xiang Wang ◽  
Hui-Ling Duan
Keyword(s):  
Mechanical Properties ◽  
Single Crystal ◽  
Single Crystal Copper

Mechanical properties of single crystal copper ellipsoidal nanoshells by molecular dynamics

2018 ◽  
Vol 32 (16) ◽  
pp. 1850196 ◽  
Author(s):  
Qinyou Yang ◽  
Zailin Yang ◽  
Yong Yang ◽  
Guowei Zhang ◽  
Yu Zhang
Keyword(s):  
Mechanical Properties ◽  
Molecular Dynamics ◽  
Single Crystal ◽  
Normal Stress ◽  
Variable Thickness ◽  
Normal Stresses ◽  
Uniform Thickness ◽  
Single Crystal Copper ◽  
Dynamics Method ◽  
Elastic Stage

Single crystal copper ellipsoidal nanoshells under outer normal tensile loadings are investigated by the molecular dynamics method. Normal stress and Mises stress are introduced to describe the mechanical properties. The uniform thickness nanoshells, the variable thickness nanoshells and the variable radius nanoshells are simulated to elucidate the effect of thickness on yielding behaviors and other mechanical properties. Potential energies, stresses and dislocations of nanoshells are discussed in the paper. The dislocations of these nanoshells form an octagon or that with an external quadrangle. The variable thickness nanoshells break this shape slightly. The potential energies of nanoshells have stable stages and then increase. The outer normal stresses and Mises stresses of different models differ from eath other. The thickness of nanoshells affects the elastic stage and the variable thickness nanoshell has different mechanical properties with others. When the radiuses of nanoshells with the same thickness are different, their dislocation shapes are the pressed octagon. Thier normal yield stresses are different, but their Mises yield stress are same. Also, the outer shape determines the trend of curves. The structure of a sphere is steadier than that of an ellipsoid.

Molecular dynamics simulation of deformation accumulation in repeated nanometric cutting on single-crystal copper

RSC Advances ◽  
2015 ◽  
Vol 5 (17) ◽  
pp. 12678-12685 ◽  
Author(s):  
Lin Zhang ◽  
Hongwei Zhao ◽  
Lu Dai ◽  
Yihan Yang ◽  
Xiancheng Du ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Molecular Dynamics ◽  
Molecular Dynamics Simulation ◽  
Single Crystal ◽  
Dynamics Simulation ◽  
Bulk Materials ◽  
Nanometric Cutting ◽  
Single Crystal Copper

The machining-induced residual defects and stress in subsurfaces determine the mechanical properties of the finished surfaces of bulk materials.

An investigation of nanoindentation tests on the single crystal copper thin film via an atomic force microscope and molecular dynamics simulation

2007 ◽  
Vol 221 (2) ◽  
pp. 259-266 ◽  
Author(s):  
D Huo ◽  
Y Liang ◽  
K Cheng
Keyword(s):  
Thin Films ◽  
Mechanical Properties ◽  
Molecular Dynamics ◽  
Plastic Deformation ◽  
Size Effect ◽  
Single Crystal ◽  
Atomic Force Microscope ◽  
Md Simulations ◽  
Single Crystal Copper ◽  
Atomic Force

Nanoindentation tests performed in an atomic force microscope have been utilized to directly measure the mechanical properties of single crystal metal thin films fabricated by the vacuum vapour deposition technique. Nanoindentation tests were conducted at various indentation depths to study the effect of indentation depths on the mechanical properties of thin films. The results were interpreted by using the Oliver-Pharr method with which direct observation and measurement of the contact area are not required. The elastic modulus of the single crystal copper film at various indentation depths was determined as 67.0 > 6.9 GPa on average, which is in reasonable agreement with the results reported by others. The indentation hardness constantly increases with decreasing indentation depth, indicating a strong size effect. In addition to the experimental work, a three-dimensional nanoindentation model of molecular dynamics (MD) simulations with embedded atom method (EAM) potential is proposed to elucidate the mechanics and mechanisms of nanoindentation of thin films from the atomistic point of view. MD simulations results show that due to the size effect no distinct dislocations were observed in the plastic deformation processes of the single crystal copper thin films, which is significantly different from the plastic deformation mechanism in bulk materials.

scholarly journals SIMULATION OF SCALE DEPENDENCY ON TENSILE MECHANICAL PROPERTIES OF SINGLE CRYSTAL COPPER NANO--ROD

2011 ◽  
Vol 46 (10) ◽  
pp. 1173-1180 ◽  
Author(s):  
Qingshun BAI ◽  
Zhen TONG ◽  
Yingchun LIANG ◽  
Jiaxuan CHEN ◽  
Zhiguo WANG
Keyword(s):  
Mechanical Properties ◽  
Single Crystal ◽  
Scale Dependency ◽  
Single Crystal Copper

Predictions of Mechanical Properties of Single Crystal Copper Nanorod with Multiscale Simulation Method

2010 ◽  
Vol 44-47 ◽  
pp. 2712-2716
Author(s):  
Ying Chun Liang ◽  
Xing Lei Hu ◽  
Jia Xuan Chen ◽  
Hong Min Pen
Keyword(s):  
Mechanical Properties ◽  
Elastic Modulus ◽  
Yield Strength ◽  
Single Crystal ◽  
Deformation Mechanism ◽  
Simulation Method ◽  
Multiscale Simulation ◽  
Single Crystal Copper ◽  
Tension Tests ◽  
Section Area

Nanometric uniaxial tension tests of single crystal copper nanorod are simulated using multiscale simulation method, which has combined molecular dynamics (MD) and finite element method (FEM). New tension models of nanorod are constructed. Tension processes of ideal nanorod without notches and that with notches are performed to analyze their mechanical properties. Deformation mechanism of tension process is discussed in detail. Yield strength and elastic modulus are calculated according to the obtained stress-strain curves. Finally, the results show that the notches have obvious influence on the mechanical properties of copper nanorod. Due to the existence of notches, the section area of single crystal nanorod decreases by 40%; however, the yield strength and elastic modulus decreases by 39.0% and 10.2% respectively in our simulations. This research is helpful for identifying the mechanical properties of single crystal copper nanorod, and for understanding the deformation mechanism of tension process of nanorod.

Mechanical Properties and Dislocation Structure of Single Crystal Cdte Deformed in Compression at 300°C

1976 ◽  
Vol 34 ◽  
pp. 592-593
Author(s):  
Ernest L. Hall ◽  
J. B. Vander Sande
Keyword(s):  
Mechanical Properties ◽  
Single Crystal ◽  
Dislocation Structure ◽  
Room Temperature ◽  
Elevated Temperatures ◽  
Strain Curve ◽  
Optical Devices ◽  
Semiconductor Compound ◽  
Wide Range ◽  
Sample Orientation

The present paper describes research on the mechanical properties and related dislocation structure of CdTe, a II-VI semiconductor compound with a wide range of uses in electrical and optical devices. At room temperature CdTe exhibits little plasticity and at the same time relatively low strength and hardness. The mechanical behavior of CdTe was examined at elevated temperatures with the goal of understanding plastic flow in this material and eventually improving the room temperature properties. Several samples of single crystal CdTe of identical size and crystallographic orientation were deformed in compression at 300°C to various levels of total strain. A resolved shear stress vs. compressive glide strain curve (Figure la) was derived from the results of the tests and the knowledge of the sample orientation.

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