Thermal Conductivity of Copper-Graphene Composite Films Synthesized by Electrochemical Deposition with Exfoliated Graphene Platelets

Composite films of graphene platelets (GPs) in titanium matrix were prepared on silicon (001) substrates by physical vapor deposition of titanium using magnetron sputtering and dispersion of graphene platelets. The graphene platelets were dispersed six times after each deposition of titanium film to form the composite film. Samples of titanium film and titanium film with a single layer of dispersed graphene platelets were also prepared by the same procedure. The distribution of the graphene platelets in the film was analyzed by scanning electron microscopy. Energy dispersive spectrometry was used to infer the absence of interstitial elements. The thermal conductivity of the composite and the interface thermal conductance between titanium and silicon or titanium and graphene platelets was determined by three-omega and transient thermo reflectance (TTR) techniques, respectively. The results indicate that the thermal conductivity of the composite is isotropic and improved to 40 Wm−1K−1 from 21 Wm−1 K−1 for Ti. The interface thermal conductance between titanium and silicon is found to be 200 MWm−2K−1 and that between titanium and graphene platelets in the C-direction to be 22 MWm−2K−1. Modeling using acoustic and diffuse mismatch models was carried out to infer the magnitude of interface thermal conductance. The results indicate that the higher value of interface thermal conductance between graphene platelets in the ab plane and titanium matrix is responsible for the isotropic and improved thermal conductivity of the composite. Effective mean field analysis showed that the interface thermal conductance in the ab plane is high at 440 MWm−2K−1 when GPs consist of 8 atomic layers of graphene so that it is not a limitation to improve the thermal conductivity of the composites.

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Upconversion nanoparticle–Ag@C@Ag composite films for rapid temperature sensing

CrystEngComm ◽

10.1039/d0ce01873b ◽

2021 ◽

Author(s):

Hu Huang ◽

Lingqiong Wu ◽

Shengbin Cheng ◽

Xiaofeng Wu ◽

Shiping Zhan ◽

...

Keyword(s):

Thermal Conductivity ◽

Ag Nanoparticles ◽

Response Rate ◽

Composite Films ◽

Temperature Sensing ◽

Upconversion Nanoparticles ◽

Rapid Temperature

The response rate of optical temperature sensing of upconversion nanoparticles is significantly improved by coupling with Ag@C@Ag nanoparticles which have excellent thermal conductivity.

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Corrosion Resistance and Forming Mechanism of the Lauric Acid/Graphene Composite Films on Aluminum Alloy by Electrodeposition

Advanced Engineering Materials ◽

10.1002/adem.202001540 ◽

2021 ◽

pp. 2001540

Author(s):

Jiaping Li ◽

Jiaojiao Li ◽

Yanhong Liu ◽

Yuqing Wen ◽

Jiqiong Jiang ◽

...

Keyword(s):

Corrosion Resistance ◽

Aluminum Alloy ◽

Lauric Acid ◽

Composite Films ◽

Forming Mechanism ◽

Graphene Composite

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Enhanced thermal conductivity of polyimide composite film filled with hybrid fillers

High Performance Polymers ◽

10.1177/09540083211000393 ◽

2021 ◽

pp. 095400832110003

Author(s):

Ruiyi Li ◽

Chengcheng Ding ◽

Juan Yu ◽

Xiaodong Wang ◽

Pei Huang

Keyword(s):

Thermal Conductivity ◽

Composite Film ◽

Hexagonal Boron Nitride ◽

Composite Films ◽

Resistance Index ◽

Reference Value ◽

Residual Rate ◽

Practical Applications ◽

Hybrid Fillers ◽

The Matrix

In this article, the polyimide (PI) composite films with synergistically improving thermal conductivity were prepared by adding a few graphene nanoplatelets (GNP) and various hexagonal boron nitride (h-BN) contents into the PI matrix. The thermal conductivity of PI composite film with 1 wt% GNP and 30 wt% h-BN content was 1.21 W(m·k)− 1, which was higher than that of the PI composite film with 30 wt% h-BN content (0.45 W(m·k)− 1), the synergistic efficiency of GNP under various h-BN content (10 wt%, 20 wt%, and 30 wt%) were 1.70, 2.71, and 3.09, respectively. And it was found that the increased h-BN content can suppress the dielectric properties caused by GNP in the matrix. The dielectric permittivity and dielectric loss tangent of 1 wt% GNP/PI composite film were 10.69, 0.661 at 103 Hz, respectively, and that of the 30 wt% h-BN + GNP/PI composite film were 4.29 and 0.1367, respectively. Moreover, the mechanical properties of the PI composite film were suitable for practical applications. And the heat resistance index and the residual rate at 700°C of PI composite film increased to 326.8°C, 74.43%, respectively, and these of PI film were 292.6°C and 59.26%. Thus, it may provide a reference value for applying the filler hybridization/PI film in the electronic packaging materials.

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Alignment of Boron Nitride Nanotubes in Polymeric Composite Films for Thermal Conductivity Improvement

The Journal of Physical Chemistry C ◽

10.1021/jp911431f ◽

2010 ◽

Vol 114 (10) ◽

pp. 4340-4344 ◽

Cited By ~ 142

Author(s):

Takeshi Terao ◽

Chunyi Zhi ◽

Yoshio Bando ◽

Masanori Mitome ◽

Chengchun Tang ◽

...

Keyword(s):

Thermal Conductivity ◽

Boron Nitride ◽

Composite Films ◽

Polymeric Composite ◽

Boron Nitride Nanotubes

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Fabrication of Lignin-Based Nano Carbon Film-Copper Foil Composite with Enhanced Thermal Conductivity

Nanomaterials ◽

10.3390/nano9121681 ◽

2019 ◽

Vol 9 (12) ◽

pp. 1681 ◽

Cited By ~ 1

Author(s):

Bin Luo ◽

Mingchao Chi ◽

Qingtong Zhang ◽

Mingfu Li ◽

Changzhou Chen ◽

...

Keyword(s):

Thermal Conductivity ◽

Thermal Management ◽

Copper Foil ◽

Infrared Imaging ◽

Carbon Film ◽

Composite Films ◽

Annealing Treatment ◽

Thermal Infrared Imaging ◽

Nano Carbon ◽

Enhanced Thermal Conductivity

Technical lignin from pulping, an aromatic polymer with ~59% carbon content, was employed to develop novel lignin-based nano carbon thin film (LCF)-copper foil composite films for thermal management applications. A highly graphitized, nanoscale LCF (~80–100 nm in thickness) was successfully deposited on both sides of copper foil by spin coating followed by annealing treatment at 1000 °C in an argon atmosphere. The conditions of annealing significantly impacted the morphology and graphitization of LCF and the thermal conductivity of LCF-copper foil composite films. The LCF-modified copper foil exhibited an enhanced thermal conductivity of 478 W m−1 K−1 at 333 K, which was 43% higher than the copper foil counterpart. The enhanced thermal conductivity of the composite films compared with that of the copper foil was characterized by thermal infrared imaging. The thermal properties of the copper foil enhanced by LCF reveals its potential applications in the thermal management of advanced electronic products and highlights the potential high-value utility of lignin, the waste of pulping.

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