Upconversion nanoparticle–Ag@C@Ag composite films for rapid temperature sensing

CrystEngComm ◽  
2021 ◽  
Author(s):  
Hu Huang ◽  
Lingqiong Wu ◽  
Shengbin Cheng ◽  
Xiaofeng Wu ◽  
Shiping Zhan ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Ag Nanoparticles ◽  
Response Rate ◽  
Composite Films ◽  
Temperature Sensing ◽  
Upconversion Nanoparticles ◽  
Rapid Temperature

The response rate of optical temperature sensing of upconversion nanoparticles is significantly improved by coupling with Ag@C@Ag nanoparticles which have excellent thermal conductivity.

Optical temperature sensing based on upconversion nanoparticles with enhanced sensitivity via dielectric superlensing modulation

2021 ◽  
Vol 56 (17) ◽  
pp. 10438-10448
Author(s):  
Mei Lin ◽  
Shengbin Cheng ◽  
Xiaofeng Wu ◽  
Shiping Zhan ◽  
Yunxin Liu
Keyword(s):  
Temperature Sensing ◽  
Upconversion Nanoparticles ◽  
Enhanced Sensitivity

Enhanced thermal conductivity of polyimide composite film filled with hybrid fillers

2021 ◽  
pp. 095400832110003
Author(s):  
Ruiyi Li ◽  
Chengcheng Ding ◽  
Juan Yu ◽  
Xiaodong Wang ◽  
Pei Huang
Keyword(s):  
Thermal Conductivity ◽  
Composite Film ◽  
Hexagonal Boron Nitride ◽  
Composite Films ◽  
Resistance Index ◽  
Reference Value ◽  
Residual Rate ◽  
Practical Applications ◽  
Hybrid Fillers ◽  
The Matrix

In this article, the polyimide (PI) composite films with synergistically improving thermal conductivity were prepared by adding a few graphene nanoplatelets (GNP) and various hexagonal boron nitride (h-BN) contents into the PI matrix. The thermal conductivity of PI composite film with 1 wt% GNP and 30 wt% h-BN content was 1.21 W(m·k)− 1, which was higher than that of the PI composite film with 30 wt% h-BN content (0.45 W(m·k)− 1), the synergistic efficiency of GNP under various h-BN content (10 wt%, 20 wt%, and 30 wt%) were 1.70, 2.71, and 3.09, respectively. And it was found that the increased h-BN content can suppress the dielectric properties caused by GNP in the matrix. The dielectric permittivity and dielectric loss tangent of 1 wt% GNP/PI composite film were 10.69, 0.661 at 103 Hz, respectively, and that of the 30 wt% h-BN + GNP/PI composite film were 4.29 and 0.1367, respectively. Moreover, the mechanical properties of the PI composite film were suitable for practical applications. And the heat resistance index and the residual rate at 700°C of PI composite film increased to 326.8°C, 74.43%, respectively, and these of PI film were 292.6°C and 59.26%. Thus, it may provide a reference value for applying the filler hybridization/PI film in the electronic packaging materials.

Optical Temperature Sensing of Core-Shell Structured NaYF4:Yb3+, Er3+@NaYF4 Nanocrystals with Different Shell Thickness

2015 ◽  
Vol 738-739 ◽  
pp. 27-30
Author(s):  
Dong Dong Li ◽  
Qi Yue Shao ◽  
Yan Dong ◽  
Jian Qing Jiang
Keyword(s):  
Shell Thickness ◽  
Thermal Sensitivity ◽  
Upconversion Luminescence ◽  
Temperature Sensing ◽  
Upconversion Nanoparticles ◽  
Core Shell ◽  
Sensing Properties ◽  
The Core ◽  
Β Phase ◽  
Biomedical Fields

Hexagonal (β)-phase NaYF4:Yb3+, Er3+ upconversion nanoparticles (UCNPs) with and without an inert (undoped NaYF4) shell have been successfully synthesized and the effects of shell thickness on the upconversion luminescence (UCL) and temperature sensing properties were systematically investigated. It was found that the NaYF4 shell and its thickness do not affect the RHS values and thermal sensitivity, but can obviously improve the UCL intensity of NaYF4:Yb3+, Er3+ UCNPs. It implies that the core-shell structured NaYF4:Yb3+, Er3+@NaYF4 UCNPs with excellent UCL properties have great potential to be used as temperature sensing probes in biomedical fields, without considering the influences of the shell thickness on their temperature sensing properties.

Alignment of Boron Nitride Nanotubes in Polymeric Composite Films for Thermal Conductivity Improvement

2010 ◽  
Vol 114 (10) ◽  
pp. 4340-4344 ◽  
Author(s):  
Takeshi Terao ◽  
Chunyi Zhi ◽  
Yoshio Bando ◽  
Masanori Mitome ◽  
Chengchun Tang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Composite Films ◽  
Polymeric Composite ◽  
Boron Nitride Nanotubes

scholarly journals Fabrication of Lignin-Based Nano Carbon Film-Copper Foil Composite with Enhanced Thermal Conductivity

Nanomaterials ◽  
2019 ◽  
Vol 9 (12) ◽  
pp. 1681 ◽  
Author(s):  
Bin Luo ◽  
Mingchao Chi ◽  
Qingtong Zhang ◽  
Mingfu Li ◽  
Changzhou Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Copper Foil ◽  
Infrared Imaging ◽  
Carbon Film ◽  
Composite Films ◽  
Annealing Treatment ◽  
Thermal Infrared Imaging ◽  
Nano Carbon ◽  
Enhanced Thermal Conductivity

Technical lignin from pulping, an aromatic polymer with ~59% carbon content, was employed to develop novel lignin-based nano carbon thin film (LCF)-copper foil composite films for thermal management applications. A highly graphitized, nanoscale LCF (~80–100 nm in thickness) was successfully deposited on both sides of copper foil by spin coating followed by annealing treatment at 1000 °C in an argon atmosphere. The conditions of annealing significantly impacted the morphology and graphitization of LCF and the thermal conductivity of LCF-copper foil composite films. The LCF-modified copper foil exhibited an enhanced thermal conductivity of 478 W m−1 K−1 at 333 K, which was 43% higher than the copper foil counterpart. The enhanced thermal conductivity of the composite films compared with that of the copper foil was characterized by thermal infrared imaging. The thermal properties of the copper foil enhanced by LCF reveals its potential applications in the thermal management of advanced electronic products and highlights the potential high-value utility of lignin, the waste of pulping.

scholarly journals Polyarylene ether nitrile and boron nitride composites: coating with sulfonated polyarylene ether nitrile

e-Polymers ◽  
2019 ◽  
Vol 19 (1) ◽  
pp. 70-78 ◽  
Author(s):  
Renbo Wei ◽  
Qian Xiao ◽  
Chenhao Zhan ◽  
Yong You ◽  
Xuefei Zhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Composite Films ◽  
Solution Casting ◽  
Casting Method ◽  
Polyarylene Ether Nitrile ◽  
Arylene Ether ◽  
Ultrasonic Technology ◽  
Solution Casting Method ◽  
Sulfonated Poly

AbstractBoron nitride (BN) coated with sulfonated poly-arylene ether nitrile (SPEN) (BN@SPEN) was used as additive to enhance the thermal conductivity of polyarylene ether nitrile. BN@SPEN was prepared by coating BN micro-platelets with SPEN through ultrasonic technology combined with the post-treatment bonding process. The prepared BN@SPEN was characterized by FTIR, TGA, SEM and TEM, which confirmed the successful coating of BN micro-platelets. The obtained BN@SPEN was introduced into the PEN matrix to prepare composite films by a solution casting method. The compatibility between BN and PEN matrix was studied by using SEM observation and rheology measurement. Furthermore, thermal conductivity of BN@SPEN/PEN films were carefully characterized. Thermal conductivity of BN@SPEN/PEN films was increased to 0.69 W/(m⋅K) at 20 wt% content of BN@SPEN, having 138% increment comparing with pure PEN.

scholarly journals Silver Nanoparticle-Deposited Aluminum Oxide Nanoparticle as Fillers for Epoxy Composites with High Thermal Conductivity

2018 ◽  
Vol 27 (6) ◽  
pp. 096369351802700
Author(s):  
Tao Huang ◽  
Yimin Yao ◽  
Gang Zhang ◽  
Fanling Meng
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Silver Nanoparticle ◽  
Ag Nanoparticles ◽  
Thermal Contact Resistance ◽  
Epoxy Composite ◽  
Thermal Contact ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Oxide Nanoparticle

With the development of polymer-filled composites, the demand of high thermal conductivity materials is much attractive than ever. However, the process of a common method to improve thermal conductivity of composites is considerably complicated. The aim of this study is to investigate thermal conductivity of epoxy filled silver nanoparticle deposited aluminum nitride nanoparticles with relatively convenient process. We found that the thermal conductivities of composites filled with AlN/Ag nanoparticles are effectively enhanced, which is enormously increased from 0.48 Wm-1K-1(1.88 vol%) to 3.66 Wm-1K-1 (19.54 vol%). This can be ascribed to the bridging connections of silver nanoparticle among aluminum nitride nanoparticles. In addition, the thermal contact resistance of the epoxy composites filler with AlN/Ag nanoparticles is decreased, which is proved by the fitting measured thermal conductivity of epoxy composite with one physical model. We believe the finding has great potential for any microelectronic application.

Modified graphene/polyimide composite films with strongly enhanced thermal conductivity

Nanoscale ◽  
2019 ◽  
Vol 11 (17) ◽  
pp. 8219-8225 ◽  
Author(s):  
Xian Wu ◽  
Haoliang Li ◽  
Kui Cheng ◽  
Hanxun Qiu ◽  
Junhe Yang
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Composite Films ◽  
Highly Efficient ◽  
Graphene Films ◽  
Modified Graphene ◽  
Enhanced Thermal Conductivity

An effective “modified-welding” approach to prepare graphene films with excellent thermal conductivity and flexibility for highly efficient thermal management.

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