Junction temperature measurement of alternating current light-emitting-diode by threshold voltage method

2016 ◽  
Vol 9 (4) ◽  
pp. 555-559 ◽  
Author(s):  
Ran Yao ◽  
Dawei Zhang ◽  
Bing Zou ◽  
Jian Xu
2011 ◽  
Vol 82 (12) ◽  
pp. 123101 ◽  
Author(s):  
S. M. He ◽  
X. D. Luo ◽  
B. Zhang ◽  
L. Fu ◽  
L. W. Cheng ◽  
...  

Electronics ◽  
2021 ◽  
Vol 10 (11) ◽  
pp. 1291
Author(s):  
Giuseppe Schirripa Schirripa Spagnolo ◽  
Fabio Leccese

Nowadays, signal lights are made using light-emitting diode arrays (LEDs). These devices are extremely energy efficient and have a very long lifetime. Unfortunately, especially for yellow/amber LEDs, the intensity of the light is closely related to the junction temperature. This makes it difficult to design signal lights to be used in naval, road, railway, and aeronautical sectors, capable of fully respecting national and international regulations. Furthermore, the limitations prescribed by the standards must be respected in a wide range of temperature variations. In other words, in the signaling apparatuses, a system that varies the light intensity emitted according to the operating temperature is useful/necessary. In this paper, we propose a simple and effective solution. In order to adjust the intensity of the light emitted by the LEDs, we use an LED identical to those used to emit light as a temperature sensor. The proposed system was created and tested in the laboratory. As the same device as the ones to be controlled is used as the temperature sensor, the system is very stable and easy to set up.


2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  

With increasing of the input power of the chips in light emitting diode (LED), the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.


2008 ◽  
Vol 47 (12) ◽  
pp. 8808-8810 ◽  
Author(s):  
Hsi-Hsuan Yen ◽  
Hao-Chung Kuo ◽  
Wen-Yung Yeh

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