Fast focus and astigmatism correction algorithm for critical dimension measurement using electron microscopy

2015 ◽  
Vol 16 (9) ◽  
pp. 1941-1947 ◽  
Author(s):  
Jae Hyung Ahn ◽  
Tai-Wook Kim ◽  
Heui Jae Pahk
Author(s):  
Shailesh R. Sheth ◽  
Jayesh R. Bellare

Specimen support and astigmatism correction in Electron Microscopy are at least two areas in which lacey polymer films find extensive applications. Although their preparation has been studied for a very long time, present techniques still suffer from incomplete release of the film from its substrate and presence of a large number of pseudo holes in the film. Our method ensures complete removal of the entire lacey film from the substrate and fewer pseudo holes by pre-treating the substrate with Gum Arabic, which acts as a film release agent.The method is based on the classical condensation technique for preparing lacey films which is essentially deposition of minute water or ice droplets on the substrate and laying the polymer film over it, so that micro holes are formed corresponding to the droplets. A microscope glass slide (the substrate) is immersed in 2.0% (w/v) aq. CTAB (cetyl trimethyl ammonium bromide)-0.22% (w/v) aq.


2014 ◽  
Vol 22 (14) ◽  
pp. 17370 ◽  
Author(s):  
Soonyang Kwon ◽  
Namyoon Kim ◽  
Taeyong Jo ◽  
Heui Jae Pahk

2006 ◽  
Vol 45 (7) ◽  
pp. 5928-5932 ◽  
Author(s):  
Ken Murayama ◽  
Satoshi Gonda ◽  
Hajime Koyanagi ◽  
Tsuneo Terasawa ◽  
Sumio Hosaka

2008 ◽  
Vol 16 (1) ◽  
pp. 24-27 ◽  
Author(s):  
Haifeng Wang ◽  
Jason Fang ◽  
Jason Arjavac ◽  
Rudy Kellner

Automated scanning transmission electron microscopy (STEM) metrology provides critical dimension (CD) measurements an order of magnitude more precise than comparable scanning electron microscopy (SEM) measurements. New developments in automation now also provide throughput and response time sufficient to support high volume microelectronic manufacturing processes. The newly developed methodology includes automated, focused ion beam (FIB) based sample preparation; innovative, ex-situ sample extraction; and automated metrology. Although originally developed to control the production of thin film magnetic heads for data storage, the technique is fully applicable to any wafer-based manufacturing process.


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