Dissimilar Metal Welding of Steel to Al-Mg Alloy by Spot Resistance Welding

2006 ◽  
Vol 15-17 ◽  
pp. 381-386 ◽  
Author(s):  
I.H. Hwang ◽  
Takehiko Watanabe ◽  
Y. Doi

We tried to join steel to Al-Mg alloy using a resistance spot welding method. The effect of Mg in Al-Mg alloy on the strength and the interfacial microstructure of the joint was investigated. Additionally, the effect of insert metal of commercially pure aluminum, which was put into the bonding interface, on the joint strength was examined. The obtained results were as follows. The cross-tensile strength of a joint between SS400 steel and commercially pure aluminum (SS400/Al) was high and fracture occurred in the aluminum base metal. However, the strength of a joint between SS400 and Al-Mg alloy was remarkably low and less than 30% of that of the SS400/Al joint. An intermetallic compound layer developed so thickly at the bonded interface of the SS400/Al-Mg alloy joint that the joint strength decreased. The intermetallic compound layer developed more thickly as Mg content in the Al-Mg alloy increased. Using insert metal of commercially pure aluminum containing little Mg successfully improved the strength of the SS400/Al-Mg alloy joint and the strength was equivalent to that of the base metal.

2009 ◽  
Vol 53 (5-6) ◽  
pp. R135-R139 ◽  
Author(s):  
Kenji Ikeuchi ◽  
Makoto Takahashi ◽  
Hiroyuki Watanabe ◽  
Masatoshi Aritoshi

2014 ◽  
Vol 783-786 ◽  
pp. 2747-2752 ◽  
Author(s):  
Hiromichi T. Fujii ◽  
Yuta Goto ◽  
Yutaka S. Sato ◽  
Hiroyuki Kokawa

Dissimilar joints between 1050 Al alloy and Cu were prepared by ultrasonic spot welding technique to understand the joint characteristics. The joint strength was evaluated by tensile shear strength test. The joint strength increased with increasing joining energy and the joint produced with sufficiently high energy was fractured at the base metal region of Al alloy. The interface microstructure in Al alloy consists of severely deformed region due to ultrasonic vibration. In addition, the fine and equiaxed grains were observed near the joint interface in the specimens fractured at the base metal. These characteristics were significantly different from the microstructure in the bulk region of Al alloy. In contrast, the microstructure in Cu was hardly changed around the interface after ultrasonic welding. Additionally, thin intermetallic compound layer with the thickness of 40 nm was found to be formed at the joint interface in the specimens fractured at the base metal. Peak temperature during ultrasonic welding was found to be approximately 480 K at the interface, which was measured using embedded thermocouple.


2012 ◽  
Vol 504-506 ◽  
pp. 405-410 ◽  
Author(s):  
Takashi Iizuka ◽  
Ryo Itani

Welding properties and formabilies of a tailored blank which consists of dissimilar metals are interesting because of the possible benefits for lightening of materials. Especially, the combination of mild steel and aluminum or aluminum alloy is expected as a representative of such a light hybrid material. Until now, some successful examples about welding of steel and aluminum using friction stir welding and laser roll welding have been reported. Recently, our research team has developed a butt laser welding method using CO2 laser. It was already confirmed that, by using this method, it was possible to obtain SPCC/A1100 O-tailored blanks with almost equal joint strength to the tensile strength of base aluminum. However, it has not been reported what was made in welded interfaces of the hybrid sheets. In this study, the welded interface of SPCC/A1100-O tailored blank obtained by butt laser welding was observed and analyzed using FE-SEM and EDS. Furthermore, fractured site in some formability tests were also observed, and it was identified where fracture occurred. In the experiments, the welded interface of steel/aluminum tailored blank, which has joint strength of 80MPa-90MPa, was observed. In the observation of low magnification, no clear intermetallic compound layers were seen. In the observation of higher magnification, it was confirmed that some intermetallic layers existed. From results of EDS analysis, it was indicated that this intermetallic compound layer consisted of FeAl3, Fe2Al5, FeAl, Fe2Al and Fe3Al. Thin Fe2Al5 layers of about 3 micro meters mainly existed between steel side and aluminum side. From this layer, some dendritic FeAl3 layers appeared into the aluminum side. In the steel side, relatively wide FeAl layers and Fe3Al layers were seen in turn. According to references, because welded sheet of steel and aluminum with good mechanical properties has intermetallic layers less than 4 micro meters, it was confirmed that butt laser welding method developed by our team had possibility to provide good steel/aluminum tailored blanks. In the fractured site by Erichsen test, Fe2Al5 layered were left in both steel side and aluminum side. Thus, it was indicated that a crack spread along the Fe2Al5 layer. From results of these experiments, it was confirmed that butt laser welding method developed by our team provided steel/aluminum tailored blanks with thin Fe2Al5 layers of about 3micro meters. And, it was indicated that this Fe2Al5 layer brought about early fracture.


Micron ◽  
2013 ◽  
Vol 45 ◽  
pp. 150-154 ◽  
Author(s):  
Q.W. Wang ◽  
G.H. Fan ◽  
L. Geng ◽  
J. Zhang ◽  
Y.Z. Zhang ◽  
...  

2015 ◽  
Vol 754-755 ◽  
pp. 546-550 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  

The effects of SiC on wettability and intermetallic compound (IMC) formation of Sn-Cu-Ni solder paste composite were systematically investigated. Lead-free solder paste composite was produced by mixing silicon carbide (SiC) particle with Sn-Cu-Ni (SN100C) solder paste. The wettability of composite solder was studied by observing the contact angle between solder and copper substrate. The IMC phase formation on copper substrate interface was identified using X-ray diffraction (XRD). The phase as detected in the composite solder is Cu6Sn5.The wettability of composite solder was observed through contact angle between solder and copper substrate and Sn-Cu-Ni + 1.0 wt.% SiC shows improvements in wetting angle and suppresses the IMCs formation.


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