Silicon nitride and oxide film formation by the simultaneous use of a microwave ion source and an ICB system

Author(s):  
Gikan H. Takaoka ◽  
Kazuoki Matsugatani ◽  
Junzo Ishikawa ◽  
Toshinori Takagi
1989 ◽  
Vol 157 ◽  
Author(s):  
Gikan H. Takaoka ◽  
Hiroshi Tsuji ◽  
Junzo Ishikawa

ABSTRACTSiO2 films were prepared at a substrate temperature of 100°C by the simultaneous use of a microwave ion source and an ICB system. Transparent and good insulating SiO2 films could be obtained by using 02 gas ions, and they were thermally and chemically stable. Furthermore, both the ionization energy and the incident energy of the 02 gas ions were found to enhance the chemical reaction between SiO and 02 molecules, resulting in the Si02 film formation at a low substrate temperature.


Shinku ◽  
1991 ◽  
Vol 34 (3) ◽  
pp. 384-386
Author(s):  
Hiroshi MURAKAMI ◽  
Kazumi WATAHIKI ◽  
Akira IWASAKI ◽  
Isao KUDO

Shinku ◽  
1993 ◽  
Vol 36 (3) ◽  
pp. 271-274
Author(s):  
Hiroshi MURAKAMI ◽  
Kazumi WATAHIKI ◽  
Akira IWASAKI ◽  
Isao KUDO

1987 ◽  
Vol 101 ◽  
Author(s):  
Toshinori Takagi ◽  
Gikan H. Takaoka ◽  
Junzo Ishikawa

ABSTRACTAluminum oxide (A12O3), nitride(A1N) and silicon nitride(SiN) films were prepared at a low substrate temperature of 100°C. Film resistivity was higher than 5x1013 Ω-cm and the breakdown voltage was greater than 3x10° V/cm. The films deposited on sapphire and silicon substrates were very flat, and were chemically and thermally stable. The A1-O, A1-N and Si-N bonds could be formed effectively by using both ionized clusters and reactive gas ions, and transparent and good quality films were obtained. Through these results, the simultaneous use of an ionized cluster beam (ICB) system and a microwave ion source was found to have a high potential for preparing oxide and nitride films at a low substrate temperature.


2018 ◽  
Vol 280 ◽  
pp. 221-225
Author(s):  
C.D. Zuraidawani ◽  
F.W. Norhadira ◽  
Mochd Nazree B. Derman

The Mg-1wt.%Ca alloy was fabricated using powder metallurgy method. The anodizing process were done by using different voltage (5V, 15V, 25V) and concentration of KOH (0.1M, 0.5M, 1.0M). The surface changes on PM Mg/1wt.%Ca resulted by anodizing was analyzed using SEM-EDX and XRD pattern. Meanwhile, surface hardness was measured by micro-Vickers hardness machine. The experiment found different XRD pattern between all non-anodized and anodized samples. The study found that increasing the voltage will increase the hardness while increasing KOH concentration reduced the hardness. The relation of the hardness and oxide film formation can be analyzed using SEM-EDX and XRD pattern. The optimum value for voltage, KOH concentration and hardness are 25V, 0.1M and 27.2 HV. The XRD detect the changes in PM Mg/1wt.% Ca indicates the oxide film formation.


2014 ◽  
Vol 85 (2) ◽  
pp. 02C306 ◽  
Author(s):  
N. Takahashi ◽  
H. Murata ◽  
H. Mitsubori ◽  
J. Sakuraba ◽  
T. Soga ◽  
...  

1997 ◽  
Vol 144 (4) ◽  
pp. 1353-1361 ◽  
Author(s):  
S. C. Thomas ◽  
V. I. Birss

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