New Copper wide range nanosensor electrode prepared by physical vapor deposition at oblique angles for the non-enzimatic determination of glucose

2015 ◽  
Vol 169 ◽  
pp. 195-201 ◽  
Author(s):  
Pedro Salazar ◽  
Victor Rico ◽  
Rafael Rodríguez-Amaro ◽  
Juan P. Espinós ◽  
Agustín R. González-Elipe
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Wide Range

Optical Thin Films of Metal Oxides Produced by the Sol-Gel Method for Photovoltaic Applications

2019 ◽  
Vol 293 ◽  
pp. 83-95
Author(s):  
Marek Szindler
Keyword(s):  
Thin Films ◽  
Optical Properties ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Light Transmission ◽  
Sol Gel ◽  
Thin Layers ◽  
Gel Method ◽  
Sol Gel Method ◽  
Wide Range

The use of thin films in optoelectronic and photovoltaic devices is aimed at improving the physical properties of the substrate material. The modification of the surface of the silicon substrate is thus one of the greatest challenges in research on photovoltaic materials, in order to achieve even greater efficiency or better adapt their properties depending on the application. The technologies of applying layers vary depending on the effect to be obtained and the material from which the layer is formed. In practice, the most common method is chemical vapor deposition and physical vapor deposition, and the most commonly applied optical materials are SiO2, TiO2 and Si3N4.This paper presents the results of investigations on morphology and optical properties of the prepared aluminium oxide thin films. Thin films were prepared with use of sol-gel spin coating method. Surface morphology studies were carried out using an atomic force microscope. To characterize the surface of the thin films, 3D images and histograms of the frequency of individual inequalities were made. In order to characterize the optical properties of Al2O3 thin films, the reflectance and light transmission tests were performed using a spectrophotometer. Optical constants were determined using a spectroscopic ellipsometer. Results and their analysis show that the sol-gel method allows the deposition of homogenous thin films of Al2O3 with the desired geometric characteristics and good optical properties. Uniform, continuous thin layers with a roughness not exceeding a few nanometres were deposited. Their deposition enabled to reduce the reflection of light from the polished substrate below 15% in a wide range (425-800nm) while maintaining high transparencies (over 90%). The obtained results causes that mentioned thin films are good potential material for optics, optoelectronics and photovoltaics.

Combinatorial Studies for High Density Si and Ge Nanoparticle Arrays

2006 ◽  
Vol 933 ◽  
Author(s):  
Scott K. Stanley ◽  
John G. Ekerdt
Keyword(s):  
Vapor Deposition ◽  
Entire Range ◽  
Physical Vapor Deposition ◽  
Large Temperature ◽  
Nanoparticle Arrays ◽  
Nanoparticle Growth ◽  
Wide Range ◽  
Time Required ◽  
Nanoparticle Sizes ◽  
Deposition Conditions

ABSTRACTA simple combinatorial approach for studying chemical and physical vapor deposition (CVD and PVD) nanoparticle growth is presented utilizing temperature and precursor flux gradients across sample surfaces. Large temperature gradients (450-700 °C) are induced covering the entire range of interest for most CVD and PVD processes. Precursor flux gradients may also be introduced simultaneously or separately using a tungsten cracking filament mounted on a translation arm. Theory and calibration experiments are explained and results from a study on Ge nanoparticle growth on HfO2 surfaces are presented and analyzed. This method drastically decreases experimental time required to investigate nanoparticle growth and identify optimum deposition conditions. Furthermore, this approach greatly facilitates preparation of library samples containing a wide range (several orders of magnitude) in variation of nanoparticle sizes, density, and composition for subsequent studies.

Ionic Distribution in Plasma for the Process of Electron-Beam Physical Vapor Deposition

2014 ◽  
Vol 597 ◽  
pp. 153-156
Author(s):  
Ching Yen Ho ◽  
Wen Chieh Wu
Keyword(s):  
Electron Beam ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Radial Direction ◽  
State Equations ◽  
Ion Density ◽  
Ionic Distribution ◽  
Coating Efficiency ◽  
Wide Range ◽  
Coating Method

This paper investigates ionic distribution generated by electron beam (EB) during Physical Vapor Deposition (PVD). EB-PVD has a wide range of applications in thermal barrier coatings (TBCs) due to favorable characteristics compared with other coating processes. EB-PVD is an important material coating method that utilizes electron beams as heat sources to evaporate materials, which are then deposited on a substrate. Therefore EB-induced ionic distribution dominates the quality and thickness of the final coating on the substrate. Assuming the EB-generated plasma to be only a function of radial direction, the steady-state equations of continuity and motion combined with Posson’s equation were utilized to analyze the plasma distributions along the radial direction. The available experimental data are also used to validate the model. The results show that the coating efficiency can be improved by decreasing the ratio of the electron thermal energy to the initial ion energy and increasing the ratio of the initial ion density to the initial electron density. The uniformity of coating can be achieved by reducing the initial ion density.

Tensile Behavior and Fractography of Ti-TiAl Multi-Layered Foil Prepared by Electron Beam Physical Vapor Deposition Technology

2011 ◽  
Vol 55-57 ◽  
pp. 183-187 ◽  
Author(s):  
Zhao Hui Hu ◽  
Yi Li ◽  
Li Ma ◽  
Hong Jun Liu
Keyword(s):  
Electron Beam ◽  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Tensile Behavior ◽  
Breaking Strain ◽  
Delayed Fracture ◽  
Plastic Deformation Process ◽  
Wide Range ◽  
Vapor Deposition Technique ◽  
Physical Vapor Deposition Technique

Ti-TiAl multi-layered materials have been prepared by electron beam physical vapor deposition technique. The tensile behavior of samples at room temperature and high temperature was tested, and then the deformation mechanism at different temperature was analyzed according to the fracture surface. The results show that the tensile curves hot-pressed samples have a broad step during the plastic deformation process, and the breaking strain of the sample has been increased for a wide-range. The presence of Ti layers have led to the cracks stagger along the inter-laminar interface or the layer due to which micro laminate expresses a good characteristic of delayed fracture. With the increase of temperature, the bulk modulus and yield strength of multi-layered Ti-TiAl have been increased abnormally due to the anomalous yield strengthening behavior of TiAl intermetallic.

Robust Direct-Write Dispensing Tool and Solutions for Micro/Meso-Scale Manufacturing and Packaging

2007 ◽  
Author(s):  
B. Li ◽  
P. A. Clark ◽  
K. H. Church
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Time Pressure ◽  
Three Dimensional ◽  
Chemical Vapor ◽  
Volume Control ◽  
Layer By Layer ◽  
Micro Fabrication ◽  
Wide Range ◽  
Meso Scale

The development of functional and reliable miniaturized devices including Micro Electro Mechanical Systems (MEMS) has stressed the manufacturing and packaging processes. The traditional micro fabrication techniques, such as lithography, physical vapor deposition (PVD), chemical vapor deposition (CVD) and etching, are layer-by-layer processes and mostly suitable for thin-filmed devices. LIGA (an acronym from German words for lithography, electroplating, and molding) is a newly developed process for thick metallic devices; however, it involves electroplating process and high quality molds, which are hard to move after electroforming. In all the processes mentioned above, masks and photoresist processing are inevitable, which complicates the whole process and increases the processing time and the total cost. It is also well known that packaging is another barrier for the advancement of MEMS. MEMS packaging, which is required to provide mechanical support, environmental protection and electrical connection to other system components, is much more complicated as compared to electronic components due to the moving structures, fluids or chemicals involved. It is the most expensive process in micromachining. Therefore, enabling tools and technologies are greatly needed for the fabrication and packaging of complicated devices and highly integrated micro assemblies. In this paper, we will present novel direct-print dispensing techniques and robust tools for 21st century manufacturing and packaging. Comparing to other dispensing technologies such as time-pressure needle dispensing, screen printing, pin transfer and jetting, nScrypt’s pumping techniques can dispense materials with precise volume control for 10’s of Pico liter resolution, accurate placement or alignment within a few microns, conformably print on exaggerated surfaces of 10’s of centimeters, and are extremely flexible with materials and patterns. The dispensing tip (nozzle) is optimized to reduce the pressure drop as compared to the traditional tubing needles. Comparing to traditional micro fabrication technologies, our direct-print dispensing technology is maskless and thus a cost effective process. While micro-dispensing is a solution based approach, it has the advantage of not being a wet process such as wet etching or electroplating. Direct-print dispensing of micro lines, micro dots, and three-dimensional structures will be presented. The technology has a wide range of applications in the manufacturing and packaging of micro/meso-scale devices and bio structures.

scholarly journals What Is Driving the Growth of Inorganic Glass in Smart Materials and Opto-Electronic Devices?

Materials ◽  
2021 ◽  
Vol 14 (11) ◽  
pp. 2926
Author(s):  
Daniel Alves Barcelos ◽  
Diana C. Leitao ◽  
Laura C. J. Pereira ◽  
M. Clara Gonçalves
Keyword(s):  
Solar Cells ◽  
Vapor Deposition ◽  
Smart Materials ◽  
Physical Vapor Deposition ◽  
Electronic Devices ◽  
Added Value ◽  
Inorganic Glass ◽  
Photovoltaic Devices ◽  
Potential Growth ◽  
Wide Range

Inorganic glass is a transparent functional material and one of the few materials that keeps leading innovation. In the last decades, inorganic glass was integrated into opto-electronic devices such as optical fibers, semiconductors, solar cells, transparent photovoltaic devices, or photonic crystals and in smart materials applications such as environmental, pharmaceutical, and medical sensors, reinforcing its influence as an essential material and providing potential growth opportunities for the market. Moreover, inorganic glass is the only material that is 100% recyclable and can incorporate other industrial offscourings and/or residues to be used as raw materials. Over time, inorganic glass experienced an extensive range of fabrication techniques, from traditional melting-quenching (with an immense diversity of protocols) to chemical vapor deposition (CVD), physical vapor deposition (PVD), and wet chemistry routes as sol-gel and solvothermal processes. Additive manufacturing (AM) was recently added to the list. Bulks (3D), thin/thick films (2D), flexible glass (2D), powders (2D), fibers (1D), and nanoparticles (NPs) (0D) are examples of possible inorganic glass architectures able to integrate smart materials and opto-electronic devices, leading to added-value products in a wide range of markets. In this review, selected examples of inorganic glasses in areas such as: (i) magnetic glass materials, (ii) solar cells and transparent photovoltaic devices, (iii) photonic crystal, and (iv) smart materials are presented and discussed.

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