Improvement of the crystalline quality of the ZnO epitaxial layer on a low-temperature grown ZnO buffer layer

2004 ◽  
Vol 266 (4) ◽  
pp. 505-510 ◽  
Author(s):  
J.F. Yan ◽  
Y.M. Lu ◽  
Y.C. Liu ◽  
H.W. Liang ◽  
B.H. Li ◽  
...  
Keyword(s):  
Low Temperature ◽  
Buffer Layer ◽  
Epitaxial Layer ◽  
Crystalline Quality ◽  
Zno Buffer Layer

Effect of low-temperature GaN buffer layer on the crystalline quality of subsequent GaN layers grown by MOVPE

2007 ◽  
Vol 298 ◽  
pp. 232-234 ◽  
Author(s):  
K. Hoshino ◽  
N. Yanagita ◽  
M. Araki ◽  
K. Tadatomo
Keyword(s):  
Low Temperature ◽  
Buffer Layer ◽  
Crystalline Quality ◽  
Gan Buffer Layer

Effects of the Nitridation Process of (0001) Sapphire on Crystalline Quality of InN Grown by RF-MBE

2004 ◽  
Vol 831 ◽  
Author(s):  
Daisuke Muto ◽  
Ryotaro Yoneda ◽  
Hiroyuki Naoi ◽  
Masahito Kurouchi ◽  
Tsutomu Araki ◽  
...  
Keyword(s):  
Low Temperature ◽  
Buffer Layer ◽  
Buffer Layers ◽  
Crystalline Quality ◽  
Constant Independent ◽  
Nitrogen Flux ◽  
Sapphire Substrates ◽  
Nitridation Process ◽  
Flux Modulation

ABSTRACTThe effects of the nitridation process of (0001) sapphire on crystalline quality of InN were clearly demonstrated. The InN films were grown on NFM (nitrogen flux modulation) HT-InN or LT-InN buffer layers, which had been deposited on nitridated sapphire substrates. We found that low-temperature nitridation of sapphire is effective in improving the tilt distribution of InN films. Whereas the twist distribution remained narrow and almost constant, independent of nitridation conditions, when LT-InN buffer layers were used. The XRC-FWHM value of 54 arcsec for (0002) InN, the lowest reported to date, was achieved by using the LT-InN buffer layer and sapphire nitridation at 300°C for 3 hours.

scholarly journals Investigation of the Heteroepitaxial Process Optimization of Ge Layers on Si (001) by RPCVD

Nanomaterials ◽  
2021 ◽  
Vol 11 (4) ◽  
pp. 928
Author(s):  
Yong Du ◽  
Zhenzhen Kong ◽  
Muhammet Toprak ◽  
Guilei Wang ◽  
Yuanhao Miao ◽  
...  
Keyword(s):  
High Temperature ◽  
Buffer Layer ◽  
Layer Thickness ◽  
Growth Temperature ◽  
Crystalline Quality ◽  
Initial Growth ◽  
Two Dimensional ◽  
High Quality ◽  
Reduced Pressure

This work presents the growth of high-quality Ge epilayers on Si (001) substrates using a reduced pressure chemical vapor deposition (RPCVD) chamber. Based on the initial nucleation, a low temperature high temperature (LT-HT) two-step approach, we systematically investigate the nucleation time and surface topography, influence of a LT-Ge buffer layer thickness, a HT-Ge growth temperature, layer thickness, and high temperature thermal treatment on the morphological and crystalline quality of the Ge epilayers. It is also a unique study in the initial growth of Ge epitaxy; the start point of the experiments includes Stranski–Krastanov mode in which the Ge wet layer is initially formed and later the growth is developed to form nuclides. Afterwards, a two-dimensional Ge layer is formed from the coalescing of the nuclides. The evolution of the strain from the beginning stage of the growth up to the full Ge layer has been investigated. Material characterization results show that Ge epilayer with 400 nm LT-Ge buffer layer features at least the root mean square (RMS) value and it’s threading dislocation density (TDD) decreases by a factor of 2. In view of the 400 nm LT-Ge buffer layer, the 1000 nm Ge epilayer with HT-Ge growth temperature of 650 °C showed the best material quality, which is conducive to the merging of the crystals into a connected structure eventually forming a continuous and two-dimensional film. After increasing the thickness of Ge layer from 900 nm to 2000 nm, Ge surface roughness decreased first and then increased slowly (the RMS value for 1400 nm Ge layer was 0.81 nm). Finally, a high-temperature annealing process was carried out and high-quality Ge layer was obtained (TDD=2.78 × 107 cm−2). In addition, room temperature strong photoluminescence (PL) peak intensity and narrow full width at half maximum (11 meV) spectra further confirm the high crystalline quality of the Ge layer manufactured by this optimized process. This work highlights the inducing, increasing, and relaxing of the strain in the Ge buffer and the signature of the defect formation.

The Effect of Ge Segregation on Oxidation of Si

1987 ◽  
Vol 105 ◽  
Author(s):  
E. C. Frey ◽  
N. R. Parikh ◽  
M. L. Swanson ◽  
M. Z. Numan ◽  
W. K. Chu
Keyword(s):  
High Pressure ◽  
Low Temperature ◽  
Epitaxial Layer ◽  
Atmospheric Pressure ◽  
Oxidation Rate ◽  
Oxidation Temperature ◽  
Pressure Oxidation ◽  
Enhanced Oxidation ◽  
High Pressure Oxidation

AbstractWe have studied oxidation of various Si samples including: Ge implanted Si, CVD and MBE grown Si(0.4–4% Ge) alloys, and MBE grown Si-Si(Ge) superlattices. The samples were oxidized in pyrogenic steam (800–1000°C, atmospheric pressure) and at low temperature and high pressure (740°C, 205 atm of dry O2). The oxidized samples were analyzed with RBS/channeling and ellipsometry.An enhanced oxidation rate was seen for all Ge doped samples, compared with rates for pure Si. The magnitude of the enhancement increased with decreasing oxidation temperature. For steam oxidations the Ge was segregated from the oxide and formed an epitaxial layer at the Si-SiO2 interface; the quality of the epitaxy was highest for the highest oxidation temperatures. For high pressure oxidation the Ge was trapped in the oxide and the greatest enhancement in oxidation rate (>100%) was observed.

The Influence of Growth Temperature on Oxygen Concentration in GaN Buffer Layer

2008 ◽  
Vol 1068 ◽  
Author(s):  
Ewa Dumiszewska ◽  
Wlodek Strupinski ◽  
Piotr Caban ◽  
Marek Wesolowski ◽  
Dariusz Lenkiewicz ◽  
...  
Keyword(s):  
High Temperature ◽  
Buffer Layer ◽  
Oxygen Concentration ◽  
Growth Temperature ◽  
Low Temperatures ◽  
Buffer Layers ◽  
Crystalline Quality ◽  
Temperature Growth ◽  
Gan Buffer Layer

ABSTRACTThe influence of growth temperature on oxygen incorporation into GaN epitaxial layers was studied. GaN layers deposited at low temperatures were characterized by much higher oxygen concentration than those deposited at high temperature typically used for epitaxial growth. GaN buffer layers (HT GaN) about 1 μm thick were deposited on GaN nucleation layers (NL) with various thicknesses. The influence of NL thickness on crystalline quality and oxygen concentration of HT GaN layers were studied using RBS and SIMS. With increasing thickness of NL the crystalline quality of GaN buffer layers deteriorates and the oxygen concentration increases. It was observed that oxygen atoms incorporated at low temperature in NL diffuse into GaN buffer layer during high temperature growth as a consequence GaN NL is the source for unintentional oxygen doping.

Improved Crystalline Quality of Molecular Beam Epitaxy Grown GaAs-on-Si Epilayer through the Use of Low-Temperature GaAs Intermediate Layer

1994 ◽  
Vol 33 (Part 2, No. 3B) ◽  
pp. L405-L408 ◽  
Author(s):  
Cheng Chiang Phua ◽  
Tow Chong Chong ◽  
Wai Shing Lau
Keyword(s):  
Molecular Beam Epitaxy ◽  
Low Temperature ◽  
Intermediate Layer ◽  
Molecular Beam ◽  
Crystalline Quality ◽  
Gaas On Si ◽  
Low Temperature Gaas

Influence of buffer layer thickness and epilayer’s growth temperature on crystalline quality of InAs0.6P0.4/InP grown by LP-MOCVD

2011 ◽  
Vol 151 (12) ◽  
pp. 904-907 ◽  
Author(s):  
Xia Liu ◽  
Hang Song ◽  
Guoqing Miao ◽  
Hong Jiang ◽  
Lianzhen Cao ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Layer Thickness ◽  
Growth Temperature ◽  
Crystalline Quality ◽  
Buffer Layer Thickness

Growth of 4H-SiC Epitaxial Layer through Optimization of Buffer Layer

2018 ◽  
Vol 924 ◽  
pp. 84-87 ◽  
Author(s):  
Nicolò Piluso ◽  
Andrea Severino ◽  
Ruggero Anzalone ◽  
Maria Ausilia di Stefano ◽  
Enzo Fontana ◽  
...  
Keyword(s):  
Buffer Layer ◽  
Leakage Current ◽  
Breakdown Voltage ◽  
Epitaxial Layer ◽  
Electrical Parameters ◽  
Crystallographic Defects

In this work the deposition of buffer layer has been studied in order to increase the quality of the epitaxial layer and improve the performance of device. The comparison between two different thicknesses of buffer layer reveals a decrease of crystallographic defects and an improvement of electrical parameters of MOSFET device as leakage current and breakdown voltage.

Improvement of crystalline quality of GaAsyP1−x−yNx layers with high nitrogen compositions at low-temperature growth by atomic hydrogen irradiation

2003 ◽  
Vol 251 (1-4) ◽  
pp. 443-448 ◽  
Author(s):  
Kenji Momose ◽  
Hiroo Yonezu ◽  
Yuzo Furukawa ◽  
Atsushi Utsumi ◽  
Yusuke Yoshizumi ◽  
...  
Keyword(s):  
Low Temperature ◽  
Atomic Hydrogen ◽  
Crystalline Quality ◽  
High Nitrogen ◽  
Temperature Growth ◽  
Low Temperature Growth

scholarly journals Morphology and surface reconstructions of m-plane GaN

2002 ◽  
Vol 743 ◽  
Author(s):  
C. D. Lee ◽  
R. M. Feenstra ◽  
J. E. Northrup ◽  
L. Lymperakis ◽  
J. Neugebauer
Keyword(s):  
Molecular Beam Epitaxy ◽  
Low Temperature ◽  
Surface Morphology ◽  
Buffer Layer ◽  
Molecular Beam ◽  
Structural Quality ◽  
Surface Reconstructions ◽  
Gan Buffer Layer

ABSTRACTM-plane GaN(1100) is grown by plasma assisted molecular beam epitaxy on ZnO(1100) substrates. A low-temperature GaN buffer layer is found to be necessary to obtain good structural quality of the films. Well oriented (1100) GaN films are obtained, with a slate like surface morphology. On the GaN(1100) surfaces, reconstructions with symmetry of c(2×2) and approximate “4×5” are found under N- and Ga-rich conditions, respectively. We propose a model for Ga-rich conditions with the “4×5” structure consisting of ≥ 2 monolayers of Ga terminating the GaN surface.

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