Grain boundaries dependence of plastic deformation in nanocrystalline Cu film investigated by phase field and molecular dynamics methods

2020 ◽  
Vol 254 ◽  
pp. 123506 ◽  
Author(s):  
Meng Zhang ◽  
Ting Xu ◽  
Liang Fang
CrystEngComm ◽  
2022 ◽  
Author(s):  
ruibo ma ◽  
Lili Zhou ◽  
Yong-Chao Liang ◽  
Ze-an Tian ◽  
Yun-Fei Mo ◽  
...  

To investigate microstructural evolution and plastic deformation under tension conditions, the rapid solidification processes of Ni47Co53 alloy are first simulated by molecular dynamics methods at cooling rates of 1011, 1012...


Author(s):  
Ryo Kikuchi ◽  
Shujiro Suzuki ◽  
Ken Suzuki

Abstract Ni-based superalloys with excellent high temperature strength have been used in advanced thermal power plants. It was found that grain boundary cracking is caused in the alloy under creep-fatigue loading due to the degradation of the crystallinity of grain boundaries and the grain boundary cracking degrades the lifetime of the alloy drastically. In order to clarify the mechanism of intergranular cracking, in this research, static and dynamic strains were applied to a bicrystal structure of the alloy perpendicularly to the grain boundary using molecular dynamics analysis. In addition, the effect of the accumulation of vacancies in the area with high-density of dislocations on the strength of the bicrystal structure was analysed. It was found that the fracture mode of the bicrystal structure changed from ductile transgranular fracture to brittle intergranular one as strong functions of the combination of Schmid factor of the two grains and the density of defects around the grain boundary. The local heavy plastic deformation occurred around the grain boundary with large difference in Schmid factor between nearby grains and the diffusion of the newly grown dislocations and vacancies was suppressed by the large strain field due to the large mismatch of the crystallographic orientation between the grains. The accumulation of vacancies accelerated the local plastic deformation around the grain boundary. Therefore, the mechanism of the acceleration of intergranular cracking under creep-fatigue loading was successfully clarified by MD analysis.


Metals ◽  
2020 ◽  
Vol 10 (11) ◽  
pp. 1533
Author(s):  
Haichao Zhang ◽  
Xufeng Wang ◽  
Huirong Li ◽  
Changqing Li ◽  
Yungang Li

The molecular dynamics (MD) method was used to simulate and calculate the segregation energy and cohesive energy of Cu atoms at the Σ3{111}(110) and Σ3{112}(110) grain boundaries, and the tensile properties of the BCC-Fe crystal, with the grain boundaries containing coherent Cu clusters of different sizes (a diameter of 10 Å, 15 Å and 20 Å). The results showed that Cu atoms will spontaneously segregate towards the grain boundaries and tend to exist in the form of large-sized, low-density Cu clusters at the grain boundaries. When Cu cluster exists at the Σ3{111}(110) grain boundary, the increase in the size of the Cu cluster leads to an increase in the probability of vacancy formation inside the Cu cluster during the tensile process, weakening the breaking strength of the crystal. When the Cu cluster exists at the Σ3{112}(110) grain boundary, the Cu cluster with a diameter of 10 Å will reduce the strain hardening strength of the crystal, but the plastic deformation ability of the crystal will not be affected, and the existence of Cu clusters with a diameter of 15 Å and 20 Å will suppress the structural phase transformation of the crystal, and significantly decrease the plastic deformation ability of the crystal, thereby resulting in embrittlement of the crystal.


2007 ◽  
Vol 567-568 ◽  
pp. 161-164 ◽  
Author(s):  
Mikhail D. Starostenkov ◽  
Gennady M. Poletaev ◽  
Roman Y. Rakitin ◽  
Dmitry V. Sinyaev

The peculiarities of diffusion process and changes of long and short order parameters at an elastic and plastic deformation of compression and tension near grain boundaries with disorientation axis <111> are studied by the method of molecular dynamics. Whirl displacements of atoms destroying the order near grain boundary superdislocations are noticed at uniaxial deformation of compression. The fracture of superstructural and structural order at uniaxial deformation is accompanied by the deformation of amorphous area. Interdiffusion mechanism is changed in the dependence on deformation, temperature and boundary types.


2017 ◽  
Vol 15 (2) ◽  
pp. 285
Author(s):  
Andrey I. Dmitriev ◽  
Anton Yu. Nikonov

Molecular dynamics simulation of metallic bicrystals has been carried out to investigate the behavior of the symmetrical tilt grain boundaries under shear loading. Σ5 and Σ9 grain boundaries in Ni and α-Fe were analyzed. It is found that behavior of the defect depends not only on the structure of boundaries but also on the type of crystal lattice. In particular it is shown that under external stress the grain boundary (GB) behaves differently in the BCC and FCC metal. A comparison of the values of displacement of various types of GB due to their migration caused by shear deformation is carried out. The results can help us to understand the features of the plastic deformation development in nanoscale polycrystals under shear loading.


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