Effects of conditioning temperature on polishing pad for oxide chemical mechanical polishing process

2005 ◽  
Vol 82 (3-4) ◽  
pp. 680-685 ◽  
Author(s):  
Nam-Hoon Kim ◽  
Gwon-Woo Choi ◽  
Jin-Seong Park ◽  
Yong-Jin Seo ◽  
Woo-Sun Lee
Keyword(s):  
Chemical Mechanical Polishing ◽  
Mechanical Polishing ◽  
Polishing Process ◽  
Polishing Pad ◽  
Conditioning Temperature ◽  
Chemical Mechanical Polishing Process

Study on Groove Shape of CMP Polishing Pad: A Review

2012 ◽  
Vol 497 ◽  
pp. 278-283 ◽  
Author(s):  
Chun Lan Lou ◽  
Hai Yan Di ◽  
Qiang Fang ◽  
Tao Kong ◽  
Wei Feng Yao ◽  
...  
Keyword(s):  
Research And Development ◽  
Chemical Mechanical Polishing ◽  
Review Paper ◽  
Mechanical Polishing ◽  
Polishing Process ◽  
Critical Elements ◽  
Comprehensive View ◽  
Groove Shape ◽  
Polishing Pad ◽  
Chemical Mechanical Polishing Process

In the chemical mechanical polishing process (CMP) ，the groove shape of polishing pad is one of the most critical elements that directly influences the quality and efficiency of CMP. This review paper describes the basic patterns of groove shape and that the patterns shape of polishing pad how to effect on quality and efficiency of CMP. The effect comparison between various sorts of groove shape and their effects on polishing is described. It is intended to help reader to gain a more comprehensive view on groove shape of polishing pad, and to be instrumental for research and development new groove shape of polishing pad for CMP.

Ultrafiltration based on various polymeric membranes for recovery of spent tungsten slurry for reuse in chemical mechanical polishing process

2018 ◽  
Vol 548 ◽  
pp. 232-238 ◽  
Author(s):  
Nur Fatin Amalina Muhammad Sanusi ◽  
Mohd Hizami Mohd Yusoff ◽  
Ooi Boon Seng ◽  
Mohd Sabirin Marzuki ◽  
Ahmad Zuhairi Abdullah
Keyword(s):  
Chemical Mechanical Polishing ◽  
Polymeric Membranes ◽  
Mechanical Polishing ◽  
Polishing Process ◽  
Chemical Mechanical Polishing Process
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